ES2034970T3 - Un circuito de pelicula delgada. - Google Patents

Un circuito de pelicula delgada.

Info

Publication number
ES2034970T3
ES2034970T3 ES198787102255T ES87102255T ES2034970T3 ES 2034970 T3 ES2034970 T3 ES 2034970T3 ES 198787102255 T ES198787102255 T ES 198787102255T ES 87102255 T ES87102255 T ES 87102255T ES 2034970 T3 ES2034970 T3 ES 2034970T3
Authority
ES
Spain
Prior art keywords
film circuit
thin film
conductors
thin
solderable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES198787102255T
Other languages
English (en)
Inventor
Siegfried Dr. Muller
Helmut Hanisch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent Deutschland AG
Original Assignee
Standard Elektrik Lorenz AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Elektrik Lorenz AG filed Critical Standard Elektrik Lorenz AG
Application granted granted Critical
Publication of ES2034970T3 publication Critical patent/ES2034970T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/288—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thin film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/707—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04073—Bonding areas specifically adapted for connectors of different types
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/05644—Gold [Au] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01028—Nickel [Ni]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
    • H01L2924/0495—5th Group
    • H01L2924/04953—TaN
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Details Of Resistors (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Non-Adjustable Resistors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

ESTA FORMADO POR UNA RESISTENCIA INTEGRADA (2) Y CONDUCTORES (9 QUE PRESENTAN UN RESISTENCIA R< 10 M0HM, SON SOLDABLES Y BONDERIZABLES Y CONSISTEN EN DOS ESTRATOS DE AU (4, 6) SUPERPUESTOS ENTRE LOS CUALES SE DISPONE UN ESTRATO DE PD (5). SE UTILIZA EN TECNICAS DE ALTA FRECUENCIA.
ES198787102255T 1986-02-20 1987-02-17 Un circuito de pelicula delgada. Expired - Lifetime ES2034970T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863605425 DE3605425A1 (de) 1986-02-20 1986-02-20 Duennschichtschaltung und ein verfahren zu ihrer herstellung

Publications (1)

Publication Number Publication Date
ES2034970T3 true ES2034970T3 (es) 1993-04-16

Family

ID=6294533

Family Applications (1)

Application Number Title Priority Date Filing Date
ES198787102255T Expired - Lifetime ES2034970T3 (es) 1986-02-20 1987-02-17 Un circuito de pelicula delgada.

Country Status (7)

Country Link
US (1) US4742325A (es)
EP (1) EP0234487B1 (es)
JP (1) JPS62199043A (es)
AT (1) ATE79483T1 (es)
DE (2) DE3605425A1 (es)
ES (1) ES2034970T3 (es)
GR (1) GR3005916T3 (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4136198A1 (de) * 1991-11-02 1993-05-06 Deutsche Aerospace Ag, 8000 Muenchen, De Verfahren zur herstellung eines strukturierten duennfilm-widerstandsschichtsystems sowie schaltungsanordnung mit einem insbesondere nach diesem verfahren hergestellten duennfilm-widerstandsschichtsystem
DE4314665A1 (de) * 1993-05-04 1994-11-10 Hella Kg Hueck & Co Schaltungsanordnung
JPH09503627A (ja) * 1994-08-05 1997-04-08 フィリップス エレクトロニクス ネムローゼ フェンノートシャップ 電気的抵抗構造体
US6703666B1 (en) 1999-07-14 2004-03-09 Agere Systems Inc. Thin film resistor device and a method of manufacture therefor
US6347175B1 (en) 1999-07-14 2002-02-12 Corning Incorporated Solderable thin film
CN1946877A (zh) * 2004-04-14 2007-04-11 三菱化学株式会社 蚀刻方法和蚀刻液
JP4774789B2 (ja) * 2004-04-14 2011-09-14 三菱化学株式会社 エッチング方法及びエッチング液
US7432202B2 (en) 2005-12-28 2008-10-07 Intel Corporation Method of substrate manufacture that decreases the package resistance
JP4516538B2 (ja) * 2006-03-01 2010-08-04 住友電工デバイス・イノベーション株式会社 半導体装置の製造方法
KR20130056629A (ko) * 2011-11-22 2013-05-30 삼성전기주식회사 기판 및 이의 제조방법
JP2020010004A (ja) * 2018-07-12 2020-01-16 Koa株式会社 抵抗器及び回路基板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3649945A (en) * 1971-01-20 1972-03-14 Fairchild Camera Instr Co Thin film resistor contact
US4077854A (en) * 1972-10-02 1978-03-07 The Bendix Corporation Method of manufacture of solderable thin film microcircuit with stabilized resistive films
FR2210881B1 (es) * 1972-12-14 1976-04-23 Honeywell Bull
FR2290762A1 (fr) * 1974-11-06 1976-06-04 Lignes Telegraph Telephon Procede de realisation de contacts ohmiques pour circuits en couche mince
JPS531858A (en) * 1976-06-29 1978-01-10 Kokusai Electric Co Ltd Method of forming thin film circuit
JPS555842A (en) * 1978-06-28 1980-01-17 Kubota Ltd Preparation of synthetic resin tube
DE2906813C2 (de) * 1979-02-22 1982-06-03 Robert Bosch Gmbh, 7000 Stuttgart Elektronische Dünnschichtschaltung
EP0016263B1 (de) * 1979-03-21 1983-07-06 BBC Brown Boveri AG Dünnschichtwiderstand mit grossem Temperaturkoeffizienten und Verfahren zu dessen Herstellung
GB2186597B (en) * 1986-02-17 1990-04-04 Plessey Co Plc Electrical contact surface coating

Also Published As

Publication number Publication date
EP0234487A2 (de) 1987-09-02
US4742325A (en) 1988-05-03
GR3005916T3 (es) 1993-06-07
EP0234487A3 (en) 1990-03-07
JPH0421359B2 (es) 1992-04-09
ATE79483T1 (de) 1992-08-15
DE3605425A1 (de) 1987-08-27
DE3780980D1 (de) 1992-09-17
EP0234487B1 (de) 1992-08-12
JPS62199043A (ja) 1987-09-02

Similar Documents

Publication Publication Date Title
EP0252756A3 (en) Semiconductor device comprising an organic material
ATE136160T1 (de) Elektrisches dünnschicht-bauelement mit polymersubstrat
ES2034970T3 (es) Un circuito de pelicula delgada.
BR8600568A (pt) Composicao de adesivo,placa de circuito,laminado de cobre e pelicula de poliimida e pelicula independente
ES2104582T3 (es) Dispositivo opticamente variable transparente.
IE821477L (en) Hybrid integrated circuit device
DE3778261D1 (de) Substrat mit mehrschichtiger verdrahtung.
DE69014027D1 (de) Dünnfilmkondensatoren und deren Herstellungsverfahren.
DE3781998T2 (de) Brechbarer mehrschichtiger thermoplastischer film.
DE3066718D1 (en) A thick film copper conductor composition and a dielectric substrate having a thin layer of the composition bonded thereto
DE69206424D1 (de) Mehrschichtfolie und selbstklebendes Band.
NO872916L (no) FremgangsmŸte for Ÿ tilveiebringe av passive tynnsjiktkretser med forskjellige resistansesjikt og en passiv krets fremstilt ved fremgangsmŸten.
DE69427501T2 (de) Halbleiteranordnung mit Dünnfilm-Widerstand
DE3873896D1 (de) Laminiermaterial fuer gedruckte schaltungsplatte mit niedriger dielektrizitaetskonstanten.
DE3576422D1 (de) Selbstspeichernde anzeigeeinrichtung mit duennfilmelektrolumineszenz- und fotoleiterschichten.
DE3675153D1 (de) Mehrschichtige verpackungsfolie mit ueberlegener kratzfestigkeit.
ATE117869T1 (de) Mischleiterplatten und verfahren zu ihrer herstellung.
EP0782376A3 (en) Polyimide-metal foil composite film
DE3478915D1 (en) Solar insulating window film
EP0340412A3 (en) Semiconductor light beam position sensor, and image input device using this sensor
ATE55532T1 (de) Mehrlagige, starre und flexible bereiche aufweisende leiterplatte.
DE3576932D1 (de) Orientierter heisssiegelbarer mehrschichtfilm.
SE8506042L (sv) Polypropyleninnehallande substrat och artiklar framstellda derav
DE3581632D1 (de) Integrierte halbleiter-schaltungsvorrichtung mit mehrschichtverdrahtung.
EP0353414A3 (en) Semiconductor device comprising conductive layers

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 234487

Country of ref document: ES