GB991267A - Hermetically sealed semiconductor devices - Google Patents

Hermetically sealed semiconductor devices

Info

Publication number
GB991267A
GB991267A GB14100/63A GB1410063A GB991267A GB 991267 A GB991267 A GB 991267A GB 14100/63 A GB14100/63 A GB 14100/63A GB 1410063 A GB1410063 A GB 1410063A GB 991267 A GB991267 A GB 991267A
Authority
GB
United Kingdom
Prior art keywords
membrane
wafer
electron beam
hole
oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB14100/63A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RTX Corp
Original Assignee
United Aircraft Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Aircraft Corp filed Critical United Aircraft Corp
Publication of GB991267A publication Critical patent/GB991267A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/60—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
    • H10D84/611—Combinations of BJTs and one or more of diodes, resistors or capacitors
    • H10D84/613—Combinations of vertical BJTs and one or more of diodes, resistors or capacitors
    • H10P10/12—
    • H10W20/40—
    • H10W70/093—
    • H10W70/60—
    • H10W72/20—
    • H10W74/43—
    • H10W72/07236—
    • H10W72/252—

Landscapes

  • Ceramic Products (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
GB14100/63A 1962-04-10 1963-04-09 Hermetically sealed semiconductor devices Expired GB991267A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US186467A US3178804A (en) 1962-04-10 1962-04-10 Fabrication of encapsuled solid circuits

Publications (1)

Publication Number Publication Date
GB991267A true GB991267A (en) 1965-05-05

Family

ID=22685080

Family Applications (1)

Application Number Title Priority Date Filing Date
GB14100/63A Expired GB991267A (en) 1962-04-10 1963-04-09 Hermetically sealed semiconductor devices

Country Status (5)

Country Link
US (1) US3178804A (cg-RX-API-DMAC10.html)
BE (1) BE630858A (cg-RX-API-DMAC10.html)
CH (1) CH434481A (cg-RX-API-DMAC10.html)
GB (1) GB991267A (cg-RX-API-DMAC10.html)
NL (1) NL291352A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2244374A (en) * 1990-05-22 1991-11-27 Stc Plc Radiation beam bonding of semiconductor device contacts

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3256465A (en) * 1962-06-08 1966-06-14 Signetics Corp Semiconductor device assembly with true metallurgical bonds
US3270146A (en) * 1963-03-14 1966-08-30 Motorola Inc Hearing aid
US3300832A (en) * 1963-06-28 1967-01-31 Rca Corp Method of making composite insulatorsemiconductor wafer
US3456158A (en) * 1963-08-08 1969-07-15 Ibm Functional components
US3354354A (en) * 1964-03-24 1967-11-21 Rca Corp Oxide bonded semiconductor wafer utilizing intrinsic and degenerate material
US3699406A (en) * 1963-12-26 1972-10-17 Gen Electric Semiconductor gate-controlled pnpn switch
US3262022A (en) * 1964-02-13 1966-07-19 Gen Micro Electronics Inc Packaged electronic device
US3320485A (en) * 1964-03-30 1967-05-16 Trw Inc Dielectric isolation for monolithic circuit
US3393349A (en) * 1964-04-30 1968-07-16 Motorola Inc Intergrated circuits having isolated islands with a plurality of semiconductor devices in each island
US3289046A (en) * 1964-05-19 1966-11-29 Gen Electric Component chip mounted on substrate with heater pads therebetween
GB1039915A (en) * 1964-05-25 1966-08-24 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices
US3386008A (en) * 1964-08-31 1968-05-28 Cts Corp Integrated circuit
US3489953A (en) * 1964-09-18 1970-01-13 Texas Instruments Inc Stabilized integrated circuit and process for fabricating same
US3323198A (en) * 1965-01-27 1967-06-06 Texas Instruments Inc Electrical interconnections
DE1293308B (de) * 1966-01-21 1969-04-24 Siemens Ag Transistoranordnung zur Strombegrenzung
GB1125745A (en) * 1966-03-16 1968-08-28 English Electric Leo Marconi C Attaching integrated circuits to substrates
US3497929A (en) * 1966-05-31 1970-03-03 Stanford Research Inst Method of making a needle-type electron source
DE1564863C2 (de) * 1966-06-28 1983-04-28 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Planartransistor mit einer Emitter-, einer Basis- und einer Kollektorzone
US3413497A (en) * 1966-07-13 1968-11-26 Hewlett Packard Co Insulated-gate field effect transistor with electrostatic protection means
US3432920A (en) * 1966-12-01 1969-03-18 Rca Corp Semiconductor devices and methods of making them
US3496631A (en) * 1967-02-08 1970-02-24 Gordon Kowa Cheng Chen Manufacture of semi-conductor devices
US3543394A (en) * 1967-05-24 1970-12-01 Sheldon L Matlow Method for depositing thin films in controlled patterns
US3497774A (en) * 1967-06-07 1970-02-24 Beckman Instruments Inc Electrical circuit module and method of manufacture
US3497947A (en) * 1967-08-18 1970-03-03 Frank J Ardezzone Miniature circuit connection and packaging techniques
US3529123A (en) * 1968-07-24 1970-09-15 Smith Corp A O Electron beam heating with controlled beam
US3851382A (en) * 1968-12-02 1974-12-03 Telefunken Patent Method of producing a semiconductor or thick film device
US3860783A (en) * 1970-10-19 1975-01-14 Bell Telephone Labor Inc Ion etching through a pattern mask
US3659035A (en) * 1971-04-26 1972-04-25 Rca Corp Semiconductor device package
US3737742A (en) * 1971-09-30 1973-06-05 Trw Inc Monolithic bi-polar semiconductor device employing cermet for both schottky barrier and ohmic contact
JPS558260Y2 (cg-RX-API-DMAC10.html) * 1973-09-06 1980-02-23
JPS5512430Y2 (cg-RX-API-DMAC10.html) * 1974-08-05 1980-03-18
US4126879A (en) * 1977-09-14 1978-11-21 Rca Corporation Semiconductor device with ballast resistor adapted for a transcalent device
DE2840776A1 (de) * 1978-09-19 1980-03-27 Siemens Ag Halbleiterbauelement mit passivierender schutzschicht
DE3831394A1 (de) * 1988-09-15 1990-03-22 Prithwis Basu Verfahren und vorrichtung zum kontaktieren eines elektrischen leitungsdrahtes mit kontaktstellen auf einer leiterplatte
US10583302B2 (en) 2016-09-23 2020-03-10 Greatbatch Ltd. Gold wetting on ceramic surfaces upon coating with titanium hydride

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2561411A (en) * 1950-03-08 1951-07-24 Bell Telephone Labor Inc Semiconductor signal translating device
US2680220A (en) * 1950-06-09 1954-06-01 Int Standard Electric Corp Crystal diode and triode
DE1446221A1 (de) * 1951-01-28 1969-09-25 Philips Patentverwaltung Verfahren zum Benetzen und Verbinden von Halbleitern und Metallen mit Halbleitern und Metallen
DE896827C (de) * 1951-09-08 1953-11-16 Licentia Gmbh Verfahren zur formgebenden Bearbeitung von kristallenen Halbleiterkoerpern
DE876419C (de) * 1951-09-09 1953-05-11 Licentia Gmbh Verfahren zum Herstellen von elektrischen und/oder mechanischen Verbindungen
US2898519A (en) * 1955-11-14 1959-08-04 Erie Resistor Corp Printed circuit assembly
US3042998A (en) * 1957-05-06 1962-07-10 Sperry Gyroscope Co Ltd Slip ring assembly
US3029366A (en) * 1959-04-22 1962-04-10 Sprague Electric Co Multiple semiconductor assembly
US2971138A (en) * 1959-05-18 1961-02-07 Rca Corp Circuit microelement
US2981877A (en) * 1959-07-30 1961-04-25 Fairchild Semiconductor Semiconductor device-and-lead structure
US3059322A (en) * 1961-03-17 1962-10-23 Grady L Teague Method of making a collapsible antenna of wire mesh

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2244374A (en) * 1990-05-22 1991-11-27 Stc Plc Radiation beam bonding of semiconductor device contacts
GB2244374B (en) * 1990-05-22 1994-10-05 Stc Plc Improvements in hybrid circuits

Also Published As

Publication number Publication date
NL291352A (cg-RX-API-DMAC10.html) 1900-01-01
US3178804A (en) 1965-04-20
CH434481A (de) 1967-04-30
BE630858A (cg-RX-API-DMAC10.html) 1900-01-01

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