NL291352A - - Google Patents

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Publication number
NL291352A
NL291352A NL291352DA NL291352A NL 291352 A NL291352 A NL 291352A NL 291352D A NL291352D A NL 291352DA NL 291352 A NL291352 A NL 291352A
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of NL291352A publication Critical patent/NL291352A/xx

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
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    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
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    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
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Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Products (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
NL291352D 1962-04-10 NL291352A (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US186467A US3178804A (en) 1962-04-10 1962-04-10 Fabrication of encapsuled solid circuits

Publications (1)

Publication Number Publication Date
NL291352A true NL291352A (xx) 1900-01-01

Family

ID=22685080

Family Applications (1)

Application Number Title Priority Date Filing Date
NL291352D NL291352A (xx) 1962-04-10

Country Status (5)

Country Link
US (1) US3178804A (xx)
BE (1) BE630858A (xx)
CH (1) CH434481A (xx)
GB (1) GB991267A (xx)
NL (1) NL291352A (xx)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3256465A (en) * 1962-06-08 1966-06-14 Signetics Corp Semiconductor device assembly with true metallurgical bonds
US3270146A (en) * 1963-03-14 1966-08-30 Motorola Inc Hearing aid
US3300832A (en) * 1963-06-28 1967-01-31 Rca Corp Method of making composite insulatorsemiconductor wafer
US3456158A (en) * 1963-08-08 1969-07-15 Ibm Functional components
US3354354A (en) * 1964-03-24 1967-11-21 Rca Corp Oxide bonded semiconductor wafer utilizing intrinsic and degenerate material
US3699406A (en) * 1963-12-26 1972-10-17 Gen Electric Semiconductor gate-controlled pnpn switch
US3262022A (en) * 1964-02-13 1966-07-19 Gen Micro Electronics Inc Packaged electronic device
US3320485A (en) * 1964-03-30 1967-05-16 Trw Inc Dielectric isolation for monolithic circuit
US3393349A (en) * 1964-04-30 1968-07-16 Motorola Inc Intergrated circuits having isolated islands with a plurality of semiconductor devices in each island
US3289046A (en) * 1964-05-19 1966-11-29 Gen Electric Component chip mounted on substrate with heater pads therebetween
GB1039915A (en) * 1964-05-25 1966-08-24 Standard Telephones Cables Ltd Improvements in or relating to semiconductor devices
US3386008A (en) * 1964-08-31 1968-05-28 Cts Corp Integrated circuit
US3489953A (en) * 1964-09-18 1970-01-13 Texas Instruments Inc Stabilized integrated circuit and process for fabricating same
US3323198A (en) * 1965-01-27 1967-06-06 Texas Instruments Inc Electrical interconnections
DE1293308B (de) * 1966-01-21 1969-04-24 Siemens Ag Transistoranordnung zur Strombegrenzung
GB1125745A (en) * 1966-03-16 1968-08-28 English Electric Leo Marconi C Attaching integrated circuits to substrates
US3497929A (en) * 1966-05-31 1970-03-03 Stanford Research Inst Method of making a needle-type electron source
DE1564863C2 (de) * 1966-06-28 1983-04-28 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Planartransistor mit einer Emitter-, einer Basis- und einer Kollektorzone
US3413497A (en) * 1966-07-13 1968-11-26 Hewlett Packard Co Insulated-gate field effect transistor with electrostatic protection means
US3432920A (en) * 1966-12-01 1969-03-18 Rca Corp Semiconductor devices and methods of making them
US3496631A (en) * 1967-02-08 1970-02-24 Gordon Kowa Cheng Chen Manufacture of semi-conductor devices
US3543394A (en) * 1967-05-24 1970-12-01 Sheldon L Matlow Method for depositing thin films in controlled patterns
US3497774A (en) * 1967-06-07 1970-02-24 Beckman Instruments Inc Electrical circuit module and method of manufacture
US3497947A (en) * 1967-08-18 1970-03-03 Frank J Ardezzone Miniature circuit connection and packaging techniques
US3529123A (en) * 1968-07-24 1970-09-15 Smith Corp A O Electron beam heating with controlled beam
US3851382A (en) * 1968-12-02 1974-12-03 Telefunken Patent Method of producing a semiconductor or thick film device
US3860783A (en) * 1970-10-19 1975-01-14 Bell Telephone Labor Inc Ion etching through a pattern mask
US3659035A (en) * 1971-04-26 1972-04-25 Rca Corp Semiconductor device package
US3737742A (en) * 1971-09-30 1973-06-05 Trw Inc Monolithic bi-polar semiconductor device employing cermet for both schottky barrier and ohmic contact
JPS558260Y2 (xx) * 1973-09-06 1980-02-23
JPS5512430Y2 (xx) * 1974-08-05 1980-03-18
US4126879A (en) * 1977-09-14 1978-11-21 Rca Corporation Semiconductor device with ballast resistor adapted for a transcalent device
DE2840776A1 (de) * 1978-09-19 1980-03-27 Siemens Ag Halbleiterbauelement mit passivierender schutzschicht
DE3831394A1 (de) * 1988-09-15 1990-03-22 Prithwis Basu Verfahren und vorrichtung zum kontaktieren eines elektrischen leitungsdrahtes mit kontaktstellen auf einer leiterplatte
GB2244374B (en) * 1990-05-22 1994-10-05 Stc Plc Improvements in hybrid circuits
US10583302B2 (en) 2016-09-23 2020-03-10 Greatbatch Ltd. Gold wetting on ceramic surfaces upon coating with titanium hydride

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2561411A (en) * 1950-03-08 1951-07-24 Bell Telephone Labor Inc Semiconductor signal translating device
US2680220A (en) * 1950-06-09 1954-06-01 Int Standard Electric Corp Crystal diode and triode
DE1446221A1 (de) * 1951-01-28 1969-09-25 Philips Patentverwaltung Verfahren zum Benetzen und Verbinden von Halbleitern und Metallen mit Halbleitern und Metallen
DE896827C (de) * 1951-09-08 1953-11-16 Licentia Gmbh Verfahren zur formgebenden Bearbeitung von kristallenen Halbleiterkoerpern
DE876419C (de) * 1951-09-09 1953-05-11 Licentia Gmbh Verfahren zum Herstellen von elektrischen und/oder mechanischen Verbindungen
US2898519A (en) * 1955-11-14 1959-08-04 Erie Resistor Corp Printed circuit assembly
US3042998A (en) * 1957-05-06 1962-07-10 Sperry Gyroscope Co Ltd Slip ring assembly
US3029366A (en) * 1959-04-22 1962-04-10 Sprague Electric Co Multiple semiconductor assembly
US2971138A (en) * 1959-05-18 1961-02-07 Rca Corp Circuit microelement
US2981877A (en) * 1959-07-30 1961-04-25 Fairchild Semiconductor Semiconductor device-and-lead structure
US3059322A (en) * 1961-03-17 1962-10-23 Grady L Teague Method of making a collapsible antenna of wire mesh

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CH434481A (de) 1967-04-30
GB991267A (en) 1965-05-05
BE630858A (xx) 1900-01-01
US3178804A (en) 1965-04-20

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