GB944943A - Improvements in or relating to semiconductor devices - Google Patents

Improvements in or relating to semiconductor devices

Info

Publication number
GB944943A
GB944943A GB2027/60A GB202760A GB944943A GB 944943 A GB944943 A GB 944943A GB 2027/60 A GB2027/60 A GB 2027/60A GB 202760 A GB202760 A GB 202760A GB 944943 A GB944943 A GB 944943A
Authority
GB
United Kingdom
Prior art keywords
glass
ceramic
sealed
parts
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2027/60A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB944943A publication Critical patent/GB944943A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/06Containers; Seals characterised by the material of the container or its electrical properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Micromachines (AREA)
  • Glass Compositions (AREA)
GB2027/60A 1959-02-09 1960-01-20 Improvements in or relating to semiconductor devices Expired GB944943A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US791934A US3059158A (en) 1959-02-09 1959-02-09 Protected semiconductor device and method of making it

Publications (1)

Publication Number Publication Date
GB944943A true GB944943A (en) 1963-12-18

Family

ID=25155270

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2027/60A Expired GB944943A (en) 1959-02-09 1960-01-20 Improvements in or relating to semiconductor devices

Country Status (6)

Country Link
US (1) US3059158A (US06818201-20041116-C00086.png)
BE (1) BE584431A (US06818201-20041116-C00086.png)
DE (1) DE1212220B (US06818201-20041116-C00086.png)
FR (1) FR1247196A (US06818201-20041116-C00086.png)
GB (1) GB944943A (US06818201-20041116-C00086.png)
NL (1) NL244815A (US06818201-20041116-C00086.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109467386A (zh) * 2018-01-15 2019-03-15 杭州创屹机电科技有限公司 一种快速固化的3d打印陶瓷浆料及打印方法

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3435516A (en) * 1959-05-06 1969-04-01 Texas Instruments Inc Semiconductor structure fabrication
NL125803C (US06818201-20041116-C00086.png) * 1961-01-16
FR1319150A (fr) * 1961-04-05 1963-02-22 Gen Electric Perfectionnements aux dispositifs à semi-conducteurs
US3202888A (en) * 1962-02-09 1965-08-24 Hughes Aircraft Co Micro-miniature semiconductor devices
US3213337A (en) * 1962-10-02 1965-10-19 Whittaker Corp Composite ceramic body and method of forming the same
US3217088A (en) * 1962-11-30 1965-11-09 Owens Illinois Glass Co Joining glass members and encapsulation of small electrical components
US3268374A (en) * 1963-04-24 1966-08-23 Texas Instruments Inc Method of producing a field-effect transistor
GB1027737A (en) * 1963-05-14 1966-04-27 Nat Res Dev Semiconductor diode construction
DE1230918B (de) * 1964-05-08 1966-12-22 Telefunken Patent Halbleiteranordnung
US3514346A (en) * 1965-08-02 1970-05-26 Gen Electric Semiconductive devices having asymmetrically conductive junction
GB1134998A (en) * 1967-04-04 1968-11-27 Marconi Co Ltd Improvements in or relating to insulated gate field effect transistors
US3648121A (en) * 1967-09-06 1972-03-07 Tokyo Shibaura Electric Co A laminated semiconductor structure
US3735208A (en) * 1971-08-26 1973-05-22 Rca Corp Thermal fatigue lead-soldered semiconductor device
US3715636A (en) * 1972-01-03 1973-02-06 Gen Electric Silicon carbide lamp mounted on a ceramic of poor thermal conductivity
JPS49135749U (US06818201-20041116-C00086.png) * 1973-03-24 1974-11-21
US4262165A (en) * 1976-03-26 1981-04-14 Hitachi, Ltd. Packaging structure for semiconductor IC chip
JPS52116074A (en) * 1976-03-26 1977-09-29 Hitachi Ltd Electronic part
CA2106981A1 (en) * 1992-01-27 1993-07-28 Victor Albert Keith Temple Semiconductor devices and methods of mass production thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2874340A (en) * 1953-06-26 1959-02-17 Sprague Electric Co Rectifying contact
US2792539A (en) * 1953-07-07 1957-05-14 Sprague Electric Co Transistor construction
US2736847A (en) * 1954-05-10 1956-02-28 Hughes Aircraft Co Fused-junction silicon diodes
AT193945B (de) * 1955-06-28 1957-12-10 Western Electric Co Verfahren zur Änderung der spezifischen Leitfähigkeit eines Halbleitermaterials
BE550947A (US06818201-20041116-C00086.png) * 1955-09-12
NL213425A (US06818201-20041116-C00086.png) * 1956-01-03
NL217849A (US06818201-20041116-C00086.png) * 1956-06-12
US2959718A (en) * 1957-04-08 1960-11-08 Int Rectifier Corp Rectifier assembly
DE1047949B (de) * 1957-06-24 1958-12-31 Siemens Ag Insbesondere auf Strahlung ansprechende Halbleiterkristallanordnung mit p-n-UEbergang und den p-n-UEbergang gegen Feuchtigkeit schuetzender Huelle
US2946935A (en) * 1958-10-27 1960-07-26 Sarkes Tarzian Diode

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109467386A (zh) * 2018-01-15 2019-03-15 杭州创屹机电科技有限公司 一种快速固化的3d打印陶瓷浆料及打印方法

Also Published As

Publication number Publication date
BE584431A (US06818201-20041116-C00086.png)
FR1247196A (fr) 1960-11-25
DE1212220B (de) 1966-03-10
NL244815A (US06818201-20041116-C00086.png)
US3059158A (en) 1962-10-16

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