GB1027737A - Semiconductor diode construction - Google Patents
Semiconductor diode constructionInfo
- Publication number
- GB1027737A GB1027737A GB19007/63A GB1900763A GB1027737A GB 1027737 A GB1027737 A GB 1027737A GB 19007/63 A GB19007/63 A GB 19007/63A GB 1900763 A GB1900763 A GB 1900763A GB 1027737 A GB1027737 A GB 1027737A
- Authority
- GB
- United Kingdom
- Prior art keywords
- diode
- semi
- plates
- sector
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/02365—Fixing laser chips on mounts by clamping
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
Abstract
1,027,737. Lasers. NATIONAL RESEARCH DEVELOPMENT CORPORATION. May 14, 1964 [May 14, 1963], No. 19007/63. Heading H3B. [Also in Division H1] In a construction in which a semi-conductor diode is mounted between two end plates, a spacer, mounted between the end plates to hold them rigidly, is of a material of a coefficient of expansion similar to that of the diode. A semi-conductor diode 1, Fig. 2 (not shown), of gallium arsenide or phosphide, is mounted between two molybdenum plates 5, 6, the plate 5 being plated with gold and tin for contact with N-type region 2 and plate 6 being plated with gold and zinc for contact with P- type region 3. These plates serve as electrical contacts and are large enough to act as heat sinks. They are further held appropriately spaced by a member 7 of coefficient of expansion similar to that of the device 1 and, to ensure this similarity, the member 7 is preferably made from a semi-insulating form of the same material as the device 1. A sector of the spacer 7 is cut away to allow the passage of radiation emitted and, if desired, a second sector, opposite to the first, may be cut away to permit silvering of the rear face of the diode after the whole device has been assembled.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB19007/63A GB1027737A (en) | 1963-05-14 | 1963-05-14 | Semiconductor diode construction |
FR974385A FR1396723A (en) | 1963-05-14 | 1964-05-13 | Semiconductor diode |
DEN24975A DE1297759B (en) | 1963-05-14 | 1964-05-14 | Semiconductor diode array |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB19007/63A GB1027737A (en) | 1963-05-14 | 1963-05-14 | Semiconductor diode construction |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1027737A true GB1027737A (en) | 1966-04-27 |
Family
ID=10122194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB19007/63A Expired GB1027737A (en) | 1963-05-14 | 1963-05-14 | Semiconductor diode construction |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE1297759B (en) |
FR (1) | FR1396723A (en) |
GB (1) | GB1027737A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108988119A (en) * | 2017-06-01 | 2018-12-11 | 英锜科技股份有限公司 | Laser optical-mechanical support |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1081835A (en) * | 1953-05-05 | 1954-12-23 | Csf | Modular light emitting device |
US2770761A (en) * | 1954-12-16 | 1956-11-13 | Bell Telephone Labor Inc | Semiconductor translators containing enclosed active junctions |
US2855334A (en) * | 1955-08-17 | 1958-10-07 | Sprague Electric Co | Method of preparing semiconducting crystals having symmetrical junctions |
BE571550A (en) * | 1957-09-27 | |||
US3110080A (en) * | 1958-01-20 | 1963-11-12 | Westinghouse Electric Corp | Rectifier fabrication |
BE584431A (en) * | 1959-02-09 | |||
US3034079A (en) * | 1959-05-11 | 1962-05-08 | Microwave Ass | Hermetically sealed semiconductors |
USRE25632E (en) * | 1960-01-11 | 1964-08-18 | Optical maser | |
FR1313633A (en) * | 1961-02-24 | 1962-12-28 | Hughes Aircraft Co | Semiconductor devices and their manufacturing process |
-
1963
- 1963-05-14 GB GB19007/63A patent/GB1027737A/en not_active Expired
-
1964
- 1964-05-13 FR FR974385A patent/FR1396723A/en not_active Expired
- 1964-05-14 DE DEN24975A patent/DE1297759B/en active Pending
Also Published As
Publication number | Publication date |
---|---|
DE1297759B (en) | 1969-06-19 |
FR1396723A (en) | 1965-04-23 |
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