GB941823A - Improvements in or relating to electroplating - Google Patents

Improvements in or relating to electroplating

Info

Publication number
GB941823A
GB941823A GB26837/62A GB2683762A GB941823A GB 941823 A GB941823 A GB 941823A GB 26837/62 A GB26837/62 A GB 26837/62A GB 2683762 A GB2683762 A GB 2683762A GB 941823 A GB941823 A GB 941823A
Authority
GB
United Kingdom
Prior art keywords
groups
solution
electrolyte
electro
carbamyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB26837/62A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DEHYDAG GmbH
Dehydag Deutsche Hydrierwerke GmbH
Original Assignee
DEHYDAG GmbH
Dehydag Deutsche Hydrierwerke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DEHYDAG GmbH, Dehydag Deutsche Hydrierwerke GmbH filed Critical DEHYDAG GmbH
Publication of GB941823A publication Critical patent/GB941823A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D295/00—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms
    • C07D295/16—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms acylated on ring nitrogen atoms
    • C07D295/20—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms acylated on ring nitrogen atoms by radicals derived from carbonic acid, or sulfur or nitrogen analogues thereof
    • C07D295/21—Radicals derived from sulfur analogues of carbonic acid
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/04—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member
    • C07D233/28—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to ring carbon atoms
    • C07D233/30—Oxygen or sulfur atoms
    • C07D233/42—Sulfur atoms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Filtering Materials (AREA)
  • Chemically Coating (AREA)

Abstract

941,823. Electro-plating baths. DEHYDAG DEUTSCHE HYDRIERWERKE G. m. b. H. July 12, 1962 [Aug. 10, 1961], No. 26837/62. Heading C7B. Electro-plating baths contain an acid solution of a metal ion and a sparingly soluble organic brightening agent in sufficient amount to form a heterogenous plating solution. Preferably the addition agents contain N and S groups e.g. thiazole, thio-imidazole, mercapto-benzthiazole, di-thiocarbamic acid and similar groups. Polyamides, and compounds containing azido- or alkglene-diamino groups can also be used. In examples, the following compounds are contained in a cage immersed in the electrolyte to maintain the solution at saturation point, 4- butyl, 5, 6 benzo-cournarin, N-stearyl-dithio carbamyl-S-propane-#-sodium sulphonate, thiozolpyrazolone, copper albuminate, and piperazine-N-N<SP>1</SP>-bis-dithio-carbamyl-S-sodium propionate. The electrolyte is preferably circulated through the cage, and includes a filter trap.
GB26837/62A 1961-08-10 1962-07-12 Improvements in or relating to electroplating Expired GB941823A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DED36777A DE1224111B (en) 1961-08-10 1961-08-10 Acid galvanic copper and nickel baths and process for depositing the coatings
DED0039520 1962-08-01

Publications (1)

Publication Number Publication Date
GB941823A true GB941823A (en) 1963-11-13

Family

ID=25971309

Family Applications (2)

Application Number Title Priority Date Filing Date
GB26837/62A Expired GB941823A (en) 1961-08-10 1962-07-12 Improvements in or relating to electroplating
GB30313/63A Expired GB1055243A (en) 1961-08-10 1963-07-31 Improvements in or relating to electroplating

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB30313/63A Expired GB1055243A (en) 1961-08-10 1963-07-31 Improvements in or relating to electroplating

Country Status (6)

Country Link
US (2) US3257294A (en)
BE (1) BE621297A (en)
CH (1) CH429356A (en)
DE (2) DE1224111B (en)
GB (2) GB941823A (en)
NL (1) NL281922A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH494824A (en) * 1969-07-10 1970-08-15 Fluehmann Werner Process for the electrodeposition of copper with high ductility
US3669853A (en) * 1969-07-15 1972-06-13 Chemetron Corp Coumarin-carrier addition agent for nickel baths
US3518171A (en) * 1969-07-24 1970-06-30 Metalux Corp The Purification of nickel electroplating solutions
US4014761A (en) * 1975-01-06 1977-03-29 M & T Chemicals Inc. Bright acid zinc plating
CA1128458A (en) * 1977-06-06 1982-07-27 Tokuyama Soda Kabushiki Kaisha Electrolysis with cathode of iron or nickel with electroplate from s/n nickel bath
DE2921241A1 (en) * 1979-04-19 1980-10-23 Alusuisse ACID TIN-II CONTAINING ELECTROLYT
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4614568A (en) * 1983-06-14 1986-09-30 Nihon Kogyo Kabushiki Kaisha High-speed silver plating and baths therefor
GB8522046D0 (en) * 1985-09-05 1985-10-09 Interox Chemicals Ltd Stabilisation
ES2624637T3 (en) * 2008-05-30 2017-07-17 Atotech Deutschland Gmbh Electrogalvanoplasty additive for the deposition of an alloy of a metal of group IB / binary or ternary of group IB-group IIIA / ternary, quaternary or quinary of group IB, group IIIA-group VIA

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1071438B (en) * 1959-12-17 Deutsche Gold- und Silber-Scheideanstalt vormals Roessler, Frankfurt/M Anode for electroplating baths and process for their manufacture
US1003092A (en) * 1907-04-11 1911-09-12 Ontario Nickel Company Ltd Method of electrolyzing nickel-sulfate solutions.
US1371414A (en) * 1919-06-17 1921-03-15 Thomas A Edison Nickel-plating
US2248092A (en) * 1934-10-26 1941-07-08 Sherka Chemical Co Inc Method for treating electroplating baths
US2449422A (en) * 1944-04-15 1948-09-14 Harshaw Chem Corp Electrodeposition of nickel
BE517665A (en) * 1949-11-23
AT172066B (en) * 1950-03-27 1952-08-11 H C Dr Wilhelm Dipl Pfanhauser Process for producing hard, shiny copper deposits by electrolytic deposition
NL110737C (en) * 1953-09-19
US2799634A (en) * 1954-02-26 1957-07-16 Westinghouse Electric Corp Combined addition agents for acid copper plating
BE550706A (en) * 1956-01-27
US2879211A (en) * 1956-11-16 1959-03-24 Hanson Van Winkle Munning Co Electroplating duplex nickel coatings
US2885399A (en) * 1957-03-04 1959-05-05 Univ Ohio State Res Found Hydrazinium hexafluorophosphate salts
DE1152863B (en) * 1957-03-16 1963-08-14 Riedel & Co Acid baths for the production of leveling copper coatings

Also Published As

Publication number Publication date
CH429356A (en) 1967-01-31
DE1421977A1 (en) 1968-11-07
NL281922A (en)
DE1421977B2 (en) 1970-02-19
DE1224111B (en) 1966-09-01
US3257294A (en) 1966-06-21
BE621297A (en)
US3245886A (en) 1966-04-12
GB1055243A (en) 1967-01-18

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