GB800574A - Improvements in semi-conductor devices - Google Patents
Improvements in semi-conductor devicesInfo
- Publication number
- GB800574A GB800574A GB35678/54A GB3567854A GB800574A GB 800574 A GB800574 A GB 800574A GB 35678/54 A GB35678/54 A GB 35678/54A GB 3567854 A GB3567854 A GB 3567854A GB 800574 A GB800574 A GB 800574A
- Authority
- GB
- United Kingdom
- Prior art keywords
- semi
- conductors
- tube
- sealed
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 7
- 239000004020 conductor Substances 0.000 abstract 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 3
- 239000000945 filler Substances 0.000 abstract 3
- 239000011521 glass Substances 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 239000004411 aluminium Substances 0.000 abstract 2
- 229910052782 aluminium Inorganic materials 0.000 abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 229920003319 Araldite® Polymers 0.000 abstract 1
- 229920002367 Polyisobutene Polymers 0.000 abstract 1
- 239000004793 Polystyrene Substances 0.000 abstract 1
- 239000010425 asbestos Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 210000003298 dental enamel Anatomy 0.000 abstract 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 230000037431 insertion Effects 0.000 abstract 1
- 238000003780 insertion Methods 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229920002223 polystyrene Polymers 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000010453 quartz Substances 0.000 abstract 1
- 229910052895 riebeckite Inorganic materials 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4918—Disposition being disposed on at least two different sides of the body, e.g. dual array
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Resistance Heating (AREA)
- Joining Of Glass To Other Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL183554 | 1953-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB800574A true GB800574A (en) | 1958-08-27 |
Family
ID=19750636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB35678/54A Expired GB800574A (en) | 1953-12-12 | 1954-12-09 | Improvements in semi-conductor devices |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US2877392A (enrdf_load_stackoverflow) |
| BE (1) | BE534031A (enrdf_load_stackoverflow) |
| CH (1) | CH329187A (enrdf_load_stackoverflow) |
| DE (1) | DE1033783B (enrdf_load_stackoverflow) |
| ES (1) | ES218906A1 (enrdf_load_stackoverflow) |
| FR (1) | FR1115837A (enrdf_load_stackoverflow) |
| GB (1) | GB800574A (enrdf_load_stackoverflow) |
| NL (1) | NL87748C (enrdf_load_stackoverflow) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL236678A (enrdf_load_stackoverflow) * | 1958-03-04 | 1900-01-01 | ||
| US2937110A (en) * | 1958-07-17 | 1960-05-17 | Westinghouse Electric Corp | Protective treatment for semiconductor devices |
| US2985806A (en) * | 1958-12-24 | 1961-05-23 | Philco Corp | Semiconductor fabrication |
| DE1184017B (de) * | 1961-03-10 | 1964-12-23 | Intermetall | Verfahren zum Herstellen von die pn-UEbergaenge in Halbleiteranordnungen schuetzenden UEberzuegen aus Silikonharz |
| US3181229A (en) * | 1962-01-08 | 1965-05-04 | Mallory & Co Inc P R | Hermetically sealed semiconductor device and method for producing it |
| BE635453A (enrdf_load_stackoverflow) * | 1962-07-27 | 1900-01-01 | ||
| US3284678A (en) * | 1962-11-09 | 1966-11-08 | Philco Corp | Semiconductor encapsulating and reinforcing materials utilizing boron nitride |
| DE1244963B (de) * | 1963-01-09 | 1967-07-20 | Siemens Ag | Mit einer Kunststoffhuelle umgossenes oder umpresstes Halbleiterventil |
| US3243670A (en) * | 1963-09-30 | 1966-03-29 | Int Standard Electric Corp | Mountings for semiconductor devices |
| US4042955A (en) * | 1973-06-22 | 1977-08-16 | Nippondenso Co., Ltd. | Resin-sealed electrical device |
| FR2348550A1 (fr) * | 1976-04-16 | 1977-11-10 | Saunier Duval | Procede d'isolation electrique d'une thermistance |
| US4214885A (en) * | 1978-03-01 | 1980-07-29 | Hideo Nishi | Method for producing miniature lamps |
| JPS59198740A (ja) * | 1983-04-25 | 1984-11-10 | Mitsubishi Electric Corp | 樹脂封止形半導体複合素子 |
| DE8909244U1 (de) * | 1989-07-31 | 1989-09-21 | Siemens AG, 1000 Berlin und 8000 München | Halbleiterbauelement |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE307647C (enrdf_load_stackoverflow) * | ||||
| US756676A (en) * | 1902-11-10 | 1904-04-05 | Internat Wireless Telegraph Company | Wave-responsive device. |
| US1782129A (en) * | 1924-12-26 | 1930-11-18 | Andre Henri Georges | Unilateral conductor for rectifying alternating current |
| US2406405A (en) * | 1941-05-19 | 1946-08-27 | Sperry Gyroscope Co Inc | Coaxial condenser crystal and method of making same |
| BE454977A (enrdf_load_stackoverflow) * | 1943-04-05 | |||
| US2697805A (en) * | 1949-02-05 | 1954-12-21 | Sylvania Electric Prod | Point contact rectifier |
| US2699594A (en) * | 1952-02-27 | 1955-01-18 | Sylvania Electric Prod | Method of assembling semiconductor units |
-
0
- NL NL87748D patent/NL87748C/xx active
- BE BE534031D patent/BE534031A/xx unknown
-
1954
- 1954-12-07 US US473674A patent/US2877392A/en not_active Expired - Lifetime
- 1954-12-09 DE DEN9878A patent/DE1033783B/de active Pending
- 1954-12-09 GB GB35678/54A patent/GB800574A/en not_active Expired
- 1954-12-09 ES ES0218906A patent/ES218906A1/es not_active Expired
- 1954-12-10 FR FR1115837D patent/FR1115837A/fr not_active Expired
- 1954-12-10 CH CH329187D patent/CH329187A/de unknown
Also Published As
| Publication number | Publication date |
|---|---|
| FR1115837A (fr) | 1956-04-30 |
| US2877392A (en) | 1959-03-10 |
| NL87748C (enrdf_load_stackoverflow) | |
| DE1033783B (de) | 1958-07-10 |
| BE534031A (enrdf_load_stackoverflow) | |
| CH329187A (de) | 1958-04-15 |
| ES218906A1 (es) | 1955-12-16 |
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