FR1115837A - Systèmes d'électrodes comportant au moins un corps semi-conducteur, en particulier diode à cristal ou transisteur - Google Patents
Systèmes d'électrodes comportant au moins un corps semi-conducteur, en particulier diode à cristal ou transisteurInfo
- Publication number
- FR1115837A FR1115837A FR1115837DA FR1115837A FR 1115837 A FR1115837 A FR 1115837A FR 1115837D A FR1115837D A FR 1115837DA FR 1115837 A FR1115837 A FR 1115837A
- Authority
- FR
- France
- Prior art keywords
- transistor
- semiconductor body
- electrode systems
- crystal diode
- particular crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000013078 crystal Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4918—Disposition being disposed on at least two different sides of the body, e.g. dual array
Landscapes
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
- Resistance Heating (AREA)
- Joining Of Glass To Other Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL183554 | 1953-12-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1115837A true FR1115837A (fr) | 1956-04-30 |
Family
ID=19750636
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1115837D Expired FR1115837A (fr) | 1953-12-12 | 1954-12-10 | Systèmes d'électrodes comportant au moins un corps semi-conducteur, en particulier diode à cristal ou transisteur |
Country Status (8)
Country | Link |
---|---|
US (1) | US2877392A (fr) |
BE (1) | BE534031A (fr) |
CH (1) | CH329187A (fr) |
DE (1) | DE1033783B (fr) |
ES (1) | ES218906A1 (fr) |
FR (1) | FR1115837A (fr) |
GB (1) | GB800574A (fr) |
NL (1) | NL87748C (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL236678A (fr) * | 1958-03-04 | 1900-01-01 | ||
US2937110A (en) * | 1958-07-17 | 1960-05-17 | Westinghouse Electric Corp | Protective treatment for semiconductor devices |
US2985806A (en) * | 1958-12-24 | 1961-05-23 | Philco Corp | Semiconductor fabrication |
DE1184017B (de) * | 1961-03-10 | 1964-12-23 | Intermetall | Verfahren zum Herstellen von die pn-UEbergaenge in Halbleiteranordnungen schuetzenden UEberzuegen aus Silikonharz |
US3181229A (en) * | 1962-01-08 | 1965-05-04 | Mallory & Co Inc P R | Hermetically sealed semiconductor device and method for producing it |
NL295904A (fr) * | 1962-07-27 | 1900-01-01 | ||
US3284678A (en) * | 1962-11-09 | 1966-11-08 | Philco Corp | Semiconductor encapsulating and reinforcing materials utilizing boron nitride |
DE1244963B (de) * | 1963-01-09 | 1967-07-20 | Siemens Ag | Mit einer Kunststoffhuelle umgossenes oder umpresstes Halbleiterventil |
US3243670A (en) * | 1963-09-30 | 1966-03-29 | Int Standard Electric Corp | Mountings for semiconductor devices |
US4042955A (en) * | 1973-06-22 | 1977-08-16 | Nippondenso Co., Ltd. | Resin-sealed electrical device |
US4214885A (en) * | 1978-03-01 | 1980-07-29 | Hideo Nishi | Method for producing miniature lamps |
DE8909244U1 (de) * | 1989-07-31 | 1989-09-21 | Siemens AG, 1000 Berlin und 8000 München | Halbleiterbauelement |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE307647C (fr) * | ||||
US756676A (en) * | 1902-11-10 | 1904-04-05 | Internat Wireless Telegraph Company | Wave-responsive device. |
US1782129A (en) * | 1924-12-26 | 1930-11-18 | Andre Henri Georges | Unilateral conductor for rectifying alternating current |
US2406405A (en) * | 1941-05-19 | 1946-08-27 | Sperry Gyroscope Co Inc | Coaxial condenser crystal and method of making same |
BE454977A (fr) * | 1943-04-05 | |||
US2697805A (en) * | 1949-02-05 | 1954-12-21 | Sylvania Electric Prod | Point contact rectifier |
US2699594A (en) * | 1952-02-27 | 1955-01-18 | Sylvania Electric Prod | Method of assembling semiconductor units |
-
0
- NL NL87748D patent/NL87748C/xx active
- BE BE534031D patent/BE534031A/xx unknown
-
1954
- 1954-12-07 US US473674A patent/US2877392A/en not_active Expired - Lifetime
- 1954-12-09 DE DEN9878A patent/DE1033783B/de active Pending
- 1954-12-09 ES ES0218906A patent/ES218906A1/es not_active Expired
- 1954-12-09 GB GB35678/54A patent/GB800574A/en not_active Expired
- 1954-12-10 FR FR1115837D patent/FR1115837A/fr not_active Expired
- 1954-12-10 CH CH329187D patent/CH329187A/de unknown
Also Published As
Publication number | Publication date |
---|---|
DE1033783B (de) | 1958-07-10 |
CH329187A (de) | 1958-04-15 |
ES218906A1 (es) | 1955-12-16 |
BE534031A (fr) | |
US2877392A (en) | 1959-03-10 |
GB800574A (en) | 1958-08-27 |
NL87748C (fr) |
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