GB789931A - Improvements in devices comprising semi-conductors - Google Patents

Improvements in devices comprising semi-conductors

Info

Publication number
GB789931A
GB789931A GB12697/56A GB1269756A GB789931A GB 789931 A GB789931 A GB 789931A GB 12697/56 A GB12697/56 A GB 12697/56A GB 1269756 A GB1269756 A GB 1269756A GB 789931 A GB789931 A GB 789931A
Authority
GB
United Kingdom
Prior art keywords
semi
germanium
conductor
wire
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB12697/56A
Other languages
English (en)
Inventor
Julian Robert Anthony Beale
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mullard Radio Valve Co Ltd
Original Assignee
Mullard Radio Valve Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL216667D priority Critical patent/NL216667A/xx
Priority to NL106770D priority patent/NL106770C/xx
Application filed by Mullard Radio Valve Co Ltd filed Critical Mullard Radio Valve Co Ltd
Priority to GB12697/56A priority patent/GB789931A/en
Priority to FR1171850D priority patent/FR1171850A/fr
Priority to CH347580D priority patent/CH347580A/de
Priority to DEN13579A priority patent/DE1058158B/de
Priority to US655291A priority patent/US2878148A/en
Publication of GB789931A publication Critical patent/GB789931A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47B—TABLES; DESKS; OFFICE FURNITURE; CABINETS; DRAWERS; GENERAL DETAILS OF FURNITURE
    • A47B31/00—Service or tea tables, trolleys, or wagons
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/50—Alloying conductive materials with semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S228/00—Metal fusion bonding
    • Y10S228/904—Wire bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Temperature-Responsive Valves (AREA)
  • Die Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
GB12697/56A 1956-04-25 1956-04-25 Improvements in devices comprising semi-conductors Expired GB789931A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
NL216667D NL216667A (enExample) 1956-04-25
NL106770D NL106770C (enExample) 1956-04-25
GB12697/56A GB789931A (en) 1956-04-25 1956-04-25 Improvements in devices comprising semi-conductors
FR1171850D FR1171850A (fr) 1956-04-25 1957-04-23 Procédé d'application d'une électrode sur un corps semi-conducteur
CH347580D CH347580A (de) 1956-04-25 1957-04-23 Verfahren zum Anbringen einer Elektrode auf einem halbleitenden Körper
DEN13579A DE1058158B (de) 1956-04-25 1957-04-25 Verfahren zum Anbringen einer Legierungs-Elektrode auf einem halbleitenden Koerper
US655291A US2878148A (en) 1956-04-25 1957-04-26 Method of manufacturing semiconductive devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB12697/56A GB789931A (en) 1956-04-25 1956-04-25 Improvements in devices comprising semi-conductors

Publications (1)

Publication Number Publication Date
GB789931A true GB789931A (en) 1958-01-29

Family

ID=10009446

Family Applications (1)

Application Number Title Priority Date Filing Date
GB12697/56A Expired GB789931A (en) 1956-04-25 1956-04-25 Improvements in devices comprising semi-conductors

Country Status (6)

Country Link
US (1) US2878148A (enExample)
CH (1) CH347580A (enExample)
DE (1) DE1058158B (enExample)
FR (1) FR1171850A (enExample)
GB (1) GB789931A (enExample)
NL (2) NL216667A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL107669C (enExample) * 1956-10-01
US3036937A (en) * 1957-12-26 1962-05-29 Sylvania Electric Prod Method for manufacturing alloyed junction semiconductor devices
DE1059112B (de) * 1958-04-11 1959-06-11 Intermetall Verfahren zur Kontaktierung von mit Aluminium legierten Silizium-Transistoren
US3005897A (en) * 1959-05-07 1961-10-24 Hoffman Electrouics Corp Heater control circuit for alloying apparatus
NL135881C (enExample) * 1959-08-05
NL121712C (enExample) * 1959-10-15 1900-01-01

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL100884C (enExample) * 1953-05-28 1900-01-01
NL91651C (enExample) * 1953-12-09
NL183885B (nl) * 1953-12-23 Texaco Development Corp Werkwijze voor de bereiding van een gasmengsel, dat in hoofdzaak waterstof en koolmonoxide bevat door partiele oxydatie van een brandstof.
US2736847A (en) * 1954-05-10 1956-02-28 Hughes Aircraft Co Fused-junction silicon diodes

Also Published As

Publication number Publication date
DE1058158B (de) 1959-05-27
FR1171850A (fr) 1959-01-30
NL216667A (enExample)
CH347580A (de) 1960-07-15
NL106770C (enExample)
US2878148A (en) 1959-03-17

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