GB753135A - Improvements in or relating to dry rectifiers - Google Patents
Improvements in or relating to dry rectifiersInfo
- Publication number
- GB753135A GB753135A GB23810/53A GB2381053A GB753135A GB 753135 A GB753135 A GB 753135A GB 23810/53 A GB23810/53 A GB 23810/53A GB 2381053 A GB2381053 A GB 2381053A GB 753135 A GB753135 A GB 753135A
- Authority
- GB
- United Kingdom
- Prior art keywords
- rod
- metal
- plate
- bell
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000007789 gas Substances 0.000 abstract 1
- 229910052732 germanium Inorganic materials 0.000 abstract 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000011261 inert gas Substances 0.000 abstract 1
- 229910000833 kovar Inorganic materials 0.000 abstract 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 abstract 1
- 239000010935 stainless steel Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/54—Providing fillings in containers, e.g. gas fillings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB23810/53A GB753135A (en) | 1953-08-28 | 1953-08-28 | Improvements in or relating to dry rectifiers |
DEI8993A DE1083936B (de) | 1953-08-28 | 1954-08-05 | Elektrische Halbleitervorrichtung fuer groessere Leistungen und Verfahren zur Herstellung einer solchen Vorrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB23810/53A GB753135A (en) | 1953-08-28 | 1953-08-28 | Improvements in or relating to dry rectifiers |
Publications (1)
Publication Number | Publication Date |
---|---|
GB753135A true GB753135A (en) | 1956-07-18 |
Family
ID=10201675
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB23810/53A Expired GB753135A (en) | 1953-08-28 | 1953-08-28 | Improvements in or relating to dry rectifiers |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE1083936B (de) |
GB (1) | GB753135A (de) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1079745B (de) * | 1957-11-02 | 1960-04-14 | Siemens Ag | Halbleiteranordnung mit einem scheibenfoermigen Grundkoerper und Verfahren zu ihrer Herstellung |
DE1125553B (de) * | 1958-10-15 | 1962-03-15 | Siemens Ag | Verfahren zum Herstellen einer mit einlegierten Elektroden versehenen Halbleiteranordnung |
DE1150154B (de) * | 1958-07-31 | 1963-06-12 | Texas Instruments Inc | Vorrichtung zum Einschliessen einer Halbleitervorrichtung in einem Glaskolben |
DE1233949B (de) * | 1959-07-13 | 1967-02-09 | Siemens Ag | Verfahren zur Herstellung einer Halbleiter-gleichrichteranordnung mit einem einkristallinen Halbleiterkoerper |
EP1915042A2 (de) | 2006-10-16 | 2008-04-23 | Ferroperm-Emc ApS | Hermetisch abgedichtete Schaltung |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1001269A (de) * | 1960-09-30 | 1900-01-01 | ||
DE1192323B (de) * | 1960-11-02 | 1965-05-06 | Siemens Ag | Verfahren zum Herstellen von Schweissstellen zwischen den Teilen eines ein Halbleiterelement gasdicht einschliessenden Gehaeuses und Anordnungen zur Durchfuehrung dieses Verfahrens |
DE1279852B (de) * | 1963-08-05 | 1968-10-10 | Semikron Gleichrichterbau | Verfahren zur Herstellung von Halbleiter-Anordnungen |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2563613A (en) * | 1948-03-20 | 1951-08-07 | Translating means for ultra-short | |
FR1028268A (fr) * | 1950-11-22 | 1953-05-20 | Philips Nv | Système d'électrodes et procédé de fabrication |
-
1953
- 1953-08-28 GB GB23810/53A patent/GB753135A/en not_active Expired
-
1954
- 1954-08-05 DE DEI8993A patent/DE1083936B/de active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1079745B (de) * | 1957-11-02 | 1960-04-14 | Siemens Ag | Halbleiteranordnung mit einem scheibenfoermigen Grundkoerper und Verfahren zu ihrer Herstellung |
DE1150154B (de) * | 1958-07-31 | 1963-06-12 | Texas Instruments Inc | Vorrichtung zum Einschliessen einer Halbleitervorrichtung in einem Glaskolben |
DE1125553B (de) * | 1958-10-15 | 1962-03-15 | Siemens Ag | Verfahren zum Herstellen einer mit einlegierten Elektroden versehenen Halbleiteranordnung |
DE1233949B (de) * | 1959-07-13 | 1967-02-09 | Siemens Ag | Verfahren zur Herstellung einer Halbleiter-gleichrichteranordnung mit einem einkristallinen Halbleiterkoerper |
EP1915042A2 (de) | 2006-10-16 | 2008-04-23 | Ferroperm-Emc ApS | Hermetisch abgedichtete Schaltung |
EP1915042A3 (de) * | 2006-10-16 | 2009-09-02 | Ferroperm-Emc ApS | Hermetisch abgedichtete Schaltung |
Also Published As
Publication number | Publication date |
---|---|
DE1083936B (de) | 1960-06-23 |
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