GB805443A - Improvements in rectifiers utilising semi-conducting material - Google Patents

Improvements in rectifiers utilising semi-conducting material

Info

Publication number
GB805443A
GB805443A GB3284754A GB3284754A GB805443A GB 805443 A GB805443 A GB 805443A GB 3284754 A GB3284754 A GB 3284754A GB 3284754 A GB3284754 A GB 3284754A GB 805443 A GB805443 A GB 805443A
Authority
GB
United Kingdom
Prior art keywords
junction
rings
plugs
sealed
rectifiers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3284754A
Inventor
Thomas Hilary Kinman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
British Thomson Houston Co Ltd
Original Assignee
British Thomson Houston Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by British Thomson Houston Co Ltd filed Critical British Thomson Houston Co Ltd
Priority to GB3284754A priority Critical patent/GB805443A/en
Priority to FR1143135D priority patent/FR1143135A/en
Publication of GB805443A publication Critical patent/GB805443A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Products (AREA)

Abstract

805,443. PN junction rectifiers. BRITISH THOMSON-HOUSTON CO. Ltd. Nov. 2, 1955 [Nov. 12, 1954], No. 32847/54. Class 37. A sealed PN junction rectifier comprises a semi-conductor element containing a PN junction mounted between and in contact with conducting members to each of which is sealed a ring of insulating material of low thermal conductivity, the outer rims of the rings being joined by a metal ring to form an enclosure. In Fig. 1, rings 5 of ceramic are metallized at their inner rims and then soldered to shouldered copper plugs 2, 3. The PN junction element 1, e.g. of Ge or Si, is mounted between the plugs which are then heated to melt layers of solder previously provided on the plugs or element to seal them together. The solders used on opposite faces of the element comprise In, Al, or Ga and As or Sb, respectively. Metal ring 6 is then slipped over rings 5 and soldered thereto to form a sealed enclosure which may be evacuated or gas-filled through a suitable tubule. Alternatively the device is assembled in a suitable atmosphere.
GB3284754A 1954-11-12 1954-11-12 Improvements in rectifiers utilising semi-conducting material Expired GB805443A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB3284754A GB805443A (en) 1954-11-12 1954-11-12 Improvements in rectifiers utilising semi-conducting material
FR1143135D FR1143135A (en) 1954-11-12 1955-11-10 Improvements to semiconductor rectifiers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3284754A GB805443A (en) 1954-11-12 1954-11-12 Improvements in rectifiers utilising semi-conducting material

Publications (1)

Publication Number Publication Date
GB805443A true GB805443A (en) 1958-12-03

Family

ID=10344886

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3284754A Expired GB805443A (en) 1954-11-12 1954-11-12 Improvements in rectifiers utilising semi-conducting material

Country Status (2)

Country Link
FR (1) FR1143135A (en)
GB (1) GB805443A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3238425A (en) * 1960-09-30 1966-03-01 Siemens Ag Encapsuled semiconductor device and method of its manufacture

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1136016B (en) * 1958-11-11 1962-09-06 Siemens Ag Method for producing a semiconductor component and semiconductor component produced by this method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3238425A (en) * 1960-09-30 1966-03-01 Siemens Ag Encapsuled semiconductor device and method of its manufacture

Also Published As

Publication number Publication date
FR1143135A (en) 1957-09-26

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