GB637519A - Full-wave rectifier in a glass or other insulating container - Google Patents
Full-wave rectifier in a glass or other insulating containerInfo
- Publication number
- GB637519A GB637519A GB5130/47A GB513047A GB637519A GB 637519 A GB637519 A GB 637519A GB 5130/47 A GB5130/47 A GB 5130/47A GB 513047 A GB513047 A GB 513047A GB 637519 A GB637519 A GB 637519A
- Authority
- GB
- United Kingdom
- Prior art keywords
- metal
- discs
- lead
- insulating
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/074—Stacked arrangements of non-apertured devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Rectifiers (AREA)
Abstract
637,519. Asymmetrically-conducting resistances. STANDARD TELEPHONES & CABLES, Ltd. Feb. 21, 1947, No. 5130. Convention date, Feb. 23, 1946. [Class 37] A rectifier unit for full-wave rectification comprises a number of rectifier elements housed in an insulating container 6, e.g. of glass, having a metal end cap 8 and a conductor lead 16 extending through a hermetic insulating seal 9 in the end cap. In one example a metal cap at each end is welded to a silver coating 24 and has a lead 16, 17 extending through and welded externally to a metal sleeve 11 sealed in a hole 10 in the cap by means of a glass seal 9. Four selenium elements with intervening metal discs 4 are housed in a tubular glass container 6 between insulating discs 13, 14 and kept under pressure by a spring 15, the rectifier elements being connected in a bridge arrangement for full-wave rectification. For this purpose a metal bridge member (Fig. 5, not shown) comprising a pair of metal discs 5 joined by a bridge-piece 12, connects the end elements, and one lead (17) is welded to one of the discs. The other lead (16) is connected to a central metal disc 4 and the two remaining discs 4 are connected respectively to the nearer end cap by leads 19, 20 passing through holes in a longitudinally split insulating sleeve 22. The rectifier unit is mounted in resilient terminal clips 21 which engage the end caps 8 and are connected to opposite sides of the A.C. input leads. In a modification (Fig. 8, not shown), the end discs are not joined by a bridge-piece 12 but each is connected to its respective metal end cap, an insulating seal being provided at one end only-for the passage of a lead joined to the central disc 4.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US637519XA | 1946-02-23 | 1946-02-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB637519A true GB637519A (en) | 1950-05-24 |
Family
ID=22051255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB5130/47A Expired GB637519A (en) | 1946-02-23 | 1947-02-21 | Full-wave rectifier in a glass or other insulating container |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB637519A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1243784B (en) * | 1961-07-07 | 1967-07-06 | Philips Patentverwaltung | Semiconductor arrangement with disc or tubular diodes |
-
1947
- 1947-02-21 GB GB5130/47A patent/GB637519A/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1243784B (en) * | 1961-07-07 | 1967-07-06 | Philips Patentverwaltung | Semiconductor arrangement with disc or tubular diodes |
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