GB2509654A - LED replacement light bulb assembly - Google Patents

LED replacement light bulb assembly Download PDF

Info

Publication number
GB2509654A
GB2509654A GB1407035.3A GB201407035A GB2509654A GB 2509654 A GB2509654 A GB 2509654A GB 201407035 A GB201407035 A GB 201407035A GB 2509654 A GB2509654 A GB 2509654A
Authority
GB
United Kingdom
Prior art keywords
heat sink
inserts
insert
heat
leds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB1407035.3A
Other languages
English (en)
Other versions
GB201407035D0 (en
Inventor
Kimmo Jokelainen
Ville Moilanen
Howard Rupprecht
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LIGHTTHERM Ltd
Original Assignee
LIGHTTHERM Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LIGHTTHERM Ltd filed Critical LIGHTTHERM Ltd
Priority to GB1407035.3A priority Critical patent/GB2509654A/en
Publication of GB201407035D0 publication Critical patent/GB201407035D0/en
Publication of GB2509654A publication Critical patent/GB2509654A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K99/00—Subject matter not provided for in other groups of this subclass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
    • B29K2995/0013—Conductive
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
GB1407035.3A 2011-03-08 2011-03-08 LED replacement light bulb assembly Withdrawn GB2509654A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1407035.3A GB2509654A (en) 2011-03-08 2011-03-08 LED replacement light bulb assembly

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1407035.3A GB2509654A (en) 2011-03-08 2011-03-08 LED replacement light bulb assembly
GB1103850.2A GB2488982B (en) 2011-03-08 2011-03-08 Heat sink assembly for opto-electronic components and a method for producing the same LED heatsink

Publications (2)

Publication Number Publication Date
GB201407035D0 GB201407035D0 (en) 2014-06-04
GB2509654A true GB2509654A (en) 2014-07-09

Family

ID=43923323

Family Applications (2)

Application Number Title Priority Date Filing Date
GB1407035.3A Withdrawn GB2509654A (en) 2011-03-08 2011-03-08 LED replacement light bulb assembly
GB1103850.2A Expired - Fee Related GB2488982B (en) 2011-03-08 2011-03-08 Heat sink assembly for opto-electronic components and a method for producing the same LED heatsink

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB1103850.2A Expired - Fee Related GB2488982B (en) 2011-03-08 2011-03-08 Heat sink assembly for opto-electronic components and a method for producing the same LED heatsink

Country Status (6)

Country Link
US (1) US9175842B2 (enExample)
EP (1) EP2707653A4 (enExample)
JP (1) JP2014510407A (enExample)
CN (1) CN103608622A (enExample)
GB (2) GB2509654A (enExample)
WO (1) WO2012120185A2 (enExample)

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US8915617B2 (en) * 2011-10-14 2014-12-23 Ovation Polymer Technology And Engineered Materials, Inc. Thermally conductive thermoplastic for light emitting diode fixture assembly
FI20125932A7 (fi) * 2012-09-08 2014-03-09 Lighttherm Oy Menetelmä LED valaisinlaitteiden valmistamiseksi ja LED valaisinlaitteet
US9227347B2 (en) 2013-02-25 2016-01-05 Sabic Global Technologies B.V. Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly
US9052093B2 (en) * 2013-03-14 2015-06-09 Cree, Inc. LED lamp and heat sink
JPWO2014192280A1 (ja) * 2013-05-29 2017-02-23 パナソニックＩｐマネジメント株式会社 Ｌｅｄユニット
GB2523844B (en) * 2014-03-08 2016-04-27 Lighttherm Ltd LED lamp with embedded circuitry
JP2016058261A (ja) * 2014-09-10 2016-04-21 信越ポリマー株式会社 放熱ソケットおよびその製造方法、ならびに放熱ソケットを含むｌｅｄコンポーネント
CN107429892B (zh) * 2015-03-31 2020-09-01 亮锐控股有限公司 具有散热片的led照明模块以及更换led模块的方法
CN205030031U (zh) * 2015-10-12 2016-02-10 中磊电子（苏州）有限公司 导热塑料散热器与通信装置
DE102016005291B4 (de) * 2016-04-29 2024-01-11 Ksg Austria Gmbh Verfahren zur Herstellung eines elektronischen Gerätes in der Form eines Spritzgußteils mit eingelegter Leiterplatte
US20170356640A1 (en) * 2016-06-10 2017-12-14 Innotec, Corp. Illumination assembly including thermal energy management
DE102017104794B4 (de) * 2017-03-08 2020-03-26 Bruker Daltonik Gmbh Ionenmobilitätsspektrometer
CN206988932U (zh) * 2017-05-10 2018-02-09 湖州明朔光电科技有限公司 石墨烯散热led灯
CN112923339A (zh) * 2021-04-02 2021-06-08 苏州梦时达新能源科技有限公司 基于氮化物材料的led模组压铸导热散热器

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US20060227558A1 (en) * 2005-04-08 2006-10-12 Toshiba Lighting & Technology Corporation Lamp having outer shell to radiate heat of light source
WO2008146694A1 (ja) * 2007-05-23 2008-12-04 Sharp Kabushiki Kaisha 照明装置
CN101419962A (zh) * 2007-10-24 2009-04-29 张守仁 发光二极管、其制法及以该发光二极管制造的照明器
WO2009153031A1 (de) * 2008-06-18 2009-12-23 Phoenix Contact Gmbh & Co. Kg Leuchtelement mit kunststoffhalterung
US20110030920A1 (en) * 2009-08-04 2011-02-10 Asia Vital Components (Shen Zhen) Co., Ltd. Heat Sink Structure

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Publication number Priority date Publication date Assignee Title
US20060227558A1 (en) * 2005-04-08 2006-10-12 Toshiba Lighting & Technology Corporation Lamp having outer shell to radiate heat of light source
WO2008146694A1 (ja) * 2007-05-23 2008-12-04 Sharp Kabushiki Kaisha 照明装置
CN101419962A (zh) * 2007-10-24 2009-04-29 张守仁 发光二极管、其制法及以该发光二极管制造的照明器
WO2009153031A1 (de) * 2008-06-18 2009-12-23 Phoenix Contact Gmbh & Co. Kg Leuchtelement mit kunststoffhalterung
US20110030920A1 (en) * 2009-08-04 2011-02-10 Asia Vital Components (Shen Zhen) Co., Ltd. Heat Sink Structure

Also Published As

Publication number Publication date
GB201103850D0 (en) 2011-04-20
GB2488982A (en) 2012-09-19
GB2488982B (en) 2014-10-08
JP2014510407A (ja) 2014-04-24
EP2707653A2 (en) 2014-03-19
WO2012120185A3 (en) 2012-11-01
US9175842B2 (en) 2015-11-03
WO2012120185A2 (en) 2012-09-13
CN103608622A (zh) 2014-02-26
GB201407035D0 (en) 2014-06-04
US20130335970A1 (en) 2013-12-19
EP2707653A4 (en) 2015-04-01

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)