GB2345286B - Photoresist copolymer, process for preparing the same and photoresist composition comprising the same - Google Patents
Photoresist copolymer, process for preparing the same and photoresist composition comprising the sameInfo
- Publication number
- GB2345286B GB2345286B GB9929650A GB9929650A GB2345286B GB 2345286 B GB2345286 B GB 2345286B GB 9929650 A GB9929650 A GB 9929650A GB 9929650 A GB9929650 A GB 9929650A GB 2345286 B GB2345286 B GB 2345286B
- Authority
- GB
- United Kingdom
- Prior art keywords
- same
- photoresist
- preparing
- copolymer
- photoresist composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/52—Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
- C07C69/533—Monocarboxylic acid esters having only one carbon-to-carbon double bond
- C07C69/54—Acrylic acid esters; Methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
- C08F22/10—Esters
- C08F22/1006—Esters of polyhydric alcohols or polyhydric phenols, e.g. ethylene glycol dimethacrylate
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-1998-0063793A KR100362937B1 (ko) | 1998-12-31 | 1998-12-31 | 신규의포토레지스트가교제,이를포함하는포토레지스트중합체및포토레지스트조성물 |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9929650D0 GB9929650D0 (en) | 2000-02-09 |
GB2345286A GB2345286A (en) | 2000-07-05 |
GB2345286B true GB2345286B (en) | 2004-06-30 |
Family
ID=19570347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9929650A Expired - Fee Related GB2345286B (en) | 1998-12-31 | 1999-12-15 | Photoresist copolymer, process for preparing the same and photoresist composition comprising the same |
Country Status (9)
Country | Link |
---|---|
JP (1) | JP4001445B2 (ko) |
KR (1) | KR100362937B1 (ko) |
CN (1) | CN1303114C (ko) |
DE (1) | DE19960506A1 (ko) |
FR (1) | FR2788062B1 (ko) |
GB (1) | GB2345286B (ko) |
IT (1) | IT1308679B1 (ko) |
NL (1) | NL1013916C2 (ko) |
TW (1) | TWI222968B (ko) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7208260B2 (en) * | 1998-12-31 | 2007-04-24 | Hynix Semiconductor Inc. | Cross-linking monomers for photoresist, and process for preparing photoresist polymers using the same |
KR100557608B1 (ko) * | 1999-02-10 | 2006-03-10 | 주식회사 하이닉스반도체 | 신규의 포토레지스트 가교제 및 이를 이용한 포토레지스트 조성물 |
KR100557609B1 (ko) * | 1999-02-22 | 2006-03-10 | 주식회사 하이닉스반도체 | 신규의 포토레지스트 가교제 및 이를 이용한 포토레지스트 조성물 |
US6818376B2 (en) | 1999-08-23 | 2004-11-16 | Hynix Semiconductor Inc. | Cross-linker monomer comprising double bond and photoresist copolymer containing the same |
KR100520183B1 (ko) | 1999-08-23 | 2005-10-10 | 주식회사 하이닉스반도체 | 두 개의 이중결합을 가지는 가교제를 단량체로 포함하는 포토레지스트용 공중합체 |
KR100546110B1 (ko) * | 2000-01-21 | 2006-01-24 | 주식회사 하이닉스반도체 | 포토레지스트 가교제 및 이를 함유하는 포토레지스트 조성물 |
US6664022B1 (en) * | 2000-08-25 | 2003-12-16 | Shipley Company, L.L.C. | Photoacid generators and photoresists comprising same |
KR20020082006A (ko) * | 2001-04-23 | 2002-10-30 | 금호석유화학 주식회사 | 신규한 산-민감성 중합체 및 이를 함유하는 레지스트 조성물 |
US7138218B2 (en) | 2001-12-18 | 2006-11-21 | Hynix Semiconductor Inc. | Process for forming an ultra fine pattern using a bottom anti-reflective coating film containing an acid generator |
US7338742B2 (en) | 2003-10-08 | 2008-03-04 | Hynix Semiconductor Inc. | Photoresist polymer and photoresist composition containing the same |
US7270937B2 (en) | 2003-10-17 | 2007-09-18 | Hynix Semiconductor Inc. | Over-coating composition for photoresist and process for forming photoresist pattern using the same |
KR100680405B1 (ko) | 2003-11-19 | 2007-02-08 | 주식회사 하이닉스반도체 | Euv용 포토레지스트 조성물 및 이를 이용한포토레지스트 패턴 형성 방법 |
JP4979477B2 (ja) * | 2004-03-08 | 2012-07-18 | 三菱レイヨン株式会社 | レジスト用重合体、レジスト組成物、およびパターン製造方法、並びにレジスト用重合体用原料化合物 |
US20070031758A1 (en) * | 2005-08-03 | 2007-02-08 | Jsr Corporation | Positive-type radiation-sensitive resin composition for producing a metal-plating formed material, transcription film and production method of a metal-plating formed material |
KR100694412B1 (ko) | 2006-02-24 | 2007-03-12 | 주식회사 하이닉스반도체 | 반도체소자의 미세패턴 형성방법 |
US7745339B2 (en) | 2006-02-24 | 2010-06-29 | Hynix Semiconductor Inc. | Method for forming fine pattern of semiconductor device |
EP2133747A4 (en) * | 2007-02-26 | 2011-01-12 | Jsr Corp | RESIN COMPOSITION FOR MICRO-MOTIF FORMATION AND METHOD FOR FORMING MICRO-MOTIFS |
WO2017058528A1 (en) * | 2015-09-28 | 2017-04-06 | 3M Innovative Properties Company | Patterned film article comprising cleavable crosslinker and methods |
CN116102938B (zh) * | 2021-11-09 | 2023-10-20 | 上海新阳半导体材料股份有限公司 | 一种深紫外光刻用底部抗反射涂层及其制备方法和应用 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2057752A5 (ko) * | 1969-08-04 | 1971-05-21 | Ford France | |
US4329419A (en) * | 1980-09-03 | 1982-05-11 | E. I. Du Pont De Nemours And Company | Polymeric heat resistant photopolymerizable composition for semiconductors and capacitors |
WO1992007022A1 (en) * | 1990-10-23 | 1992-04-30 | Atomic Energy Of Canada Limited | Process for the preparation of cellulosic fibre-reinforced thermoplastic composite materials |
US5777068A (en) * | 1994-09-13 | 1998-07-07 | Nippon Zeon Co., Ltd. | Photosensitive polyimide resin composition |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1275471A (en) * | 1969-06-04 | 1972-05-24 | Du Pont | Improvements relating to photo-resists |
JPS5713444A (en) * | 1980-06-27 | 1982-01-23 | Tamura Kaken Kk | Photosensitive composition |
-
1998
- 1998-12-31 KR KR10-1998-0063793A patent/KR100362937B1/ko not_active IP Right Cessation
-
1999
- 1999-12-10 TW TW088121653A patent/TWI222968B/zh not_active IP Right Cessation
- 1999-12-15 GB GB9929650A patent/GB2345286B/en not_active Expired - Fee Related
- 1999-12-15 DE DE19960506A patent/DE19960506A1/de not_active Withdrawn
- 1999-12-21 IT IT1999TO001137A patent/IT1308679B1/it active
- 1999-12-22 NL NL1013916A patent/NL1013916C2/nl not_active IP Right Cessation
- 1999-12-22 JP JP36514699A patent/JP4001445B2/ja not_active Expired - Fee Related
- 1999-12-24 CN CNB991266870A patent/CN1303114C/zh not_active Expired - Lifetime
- 1999-12-29 FR FR9916643A patent/FR2788062B1/fr not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2057752A5 (ko) * | 1969-08-04 | 1971-05-21 | Ford France | |
US4329419A (en) * | 1980-09-03 | 1982-05-11 | E. I. Du Pont De Nemours And Company | Polymeric heat resistant photopolymerizable composition for semiconductors and capacitors |
WO1992007022A1 (en) * | 1990-10-23 | 1992-04-30 | Atomic Energy Of Canada Limited | Process for the preparation of cellulosic fibre-reinforced thermoplastic composite materials |
US5777068A (en) * | 1994-09-13 | 1998-07-07 | Nippon Zeon Co., Ltd. | Photosensitive polyimide resin composition |
Also Published As
Publication number | Publication date |
---|---|
CN1258670A (zh) | 2000-07-05 |
TWI222968B (en) | 2004-11-01 |
CN1303114C (zh) | 2007-03-07 |
GB2345286A (en) | 2000-07-05 |
ITTO991137A1 (it) | 2001-06-21 |
FR2788062A1 (fr) | 2000-07-07 |
DE19960506A1 (de) | 2000-09-07 |
JP4001445B2 (ja) | 2007-10-31 |
FR2788062B1 (fr) | 2004-09-10 |
JP2000199951A (ja) | 2000-07-18 |
KR100362937B1 (ko) | 2003-10-04 |
GB9929650D0 (en) | 2000-02-09 |
KR20000047041A (ko) | 2000-07-25 |
ITTO991137A0 (it) | 1999-12-21 |
NL1013916A1 (nl) | 2000-07-03 |
IT1308679B1 (it) | 2002-01-09 |
NL1013916C2 (nl) | 2002-12-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20151215 |