GB2341018A - Light emitting diode assembly with overvoltage protection - Google Patents

Light emitting diode assembly with overvoltage protection Download PDF

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Publication number
GB2341018A
GB2341018A GB9917515A GB9917515A GB2341018A GB 2341018 A GB2341018 A GB 2341018A GB 9917515 A GB9917515 A GB 9917515A GB 9917515 A GB9917515 A GB 9917515A GB 2341018 A GB2341018 A GB 2341018A
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GB
United Kingdom
Prior art keywords
light
emitting diode
voltage
led
diode assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9917515A
Other versions
GB9917515D0 (en
Inventor
William K Antle
Michael K Lam
James W Stewart
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of GB9917515D0 publication Critical patent/GB9917515D0/en
Publication of GB2341018A publication Critical patent/GB2341018A/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/20—Responsive to malfunctions or to light source life; for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Emergency Protection Circuit Devices (AREA)

Abstract

A light emitting diode assembly comprises a voltage clamping element 12 connected in parallel with a LED 14 to protect the LED from excess voltage, eg. due to electrostatic discharge (ESD). The element 12 may be formed by a back-to back configuration of diodes 16a, 16b, such as Zener diodes or transient voltage suppressor (TVS) diodes. The voltage clamping element 12 may be integrated into the same package as the LED 14. The LED 14 and the element 12 may be attached to first and second mounting sites (21a, 21b, Fig.2) on a first electrode (22a) which has a leg protruding from the package, a second electrode (22b) being connected to the LED 14 and the element 12 by wire bonds (24a, 24b). In an alternative package (Fig.3), the LED 14 is flip-chip soldered to a top surface of the element 12 so that adjacent contacts of the LED 14 and element 12 are connected to one another, and these contacts are connected by wire bonds (24a, 24b) to electrodes (22a, 22b) which have legs protruding from the package.

Description

2341018 LIGHT EMITTING DIODE ASSEMBLY The present invention relates to a
light-emitting diode assembly.
Due to their compact size, high reliability and low power consumption light-emitting diodes (LEDs) have replaced incandescent bulbs in a variety of optical signaling systems such as automotive tail lights and traffic signals. However, presently available LEDs are susceptible to damage from electrostatic discharge (ESD) which may degrade performance and reduce the reliability of the signaling systems in which the LEDs are used. In an attempt to protect the LEDs from ESD damage, special handling precautions are taken during assembly of the optical signaling systems. These handling precautions increase the manufacturing cost of the system because they involve grounding of equipment such as workbenches, flooring, assembly fixtures and tools and also persons handling the LEDs. In addition, the handling precautions are not completely effective at preventing build-up of electrostatic potential which causes ESD that damages the LEDs.
The present invention seeks to provide an improved lightemitting diode.
According to an aspect of the present invention, there is provided a light-emitting diode assembly as specified in claim 1.
According to the preferred embodiments of the present invention, a lightemitting diode assembly incorporates a power shunting element that provides electrical over-stress protection to an LED and prevents damage to the LED from electrostatic discharge (ESD). The power shunting element is coupled in parallel to the LED within the LED assembly and protects the LED by diverting electrical current from the LED and limiting the voltage across the LED to a clamp voltage when a threshold voltage across the LED is exceeded.
An embodiment of the present invention is described below, by way of example only, with reference to the accompanying drawings, in which:
Figure 1 shows a schematic of a light-emitting diode assembly including a power shunting element constructed according to the preferred embodiments of the present invention; Figure 2 shows a cross-section of the light-emitting diode assembly constructed according to a first preferred embodiment of the present invention; and Figure 3 shows a cross-section of the light-emitting diode assembly constructed according to a second preferred embodiment of the present invention.
1 3 Figure 1 shows a schematic of a light-emitting diode assembly 10 including a power shunting element 12 constructed according to the preferred embodiment of the present invention. The power shunting element 12 is connected in parallel with a light-emitting diode (LED) 14, between a first electrical contact 15 and a second electrical contact 17 of the LED 14. When a voltage V applied between the electrical contacts exceeds a threshold voltage, power dissipation within the LED 14 is limited by the power shunting device 12 which clamps the voltage V to a!--lamp voltage and diverts a current Is from the LED 14. Thus, the power shunting element 12 provides protection for the LED 14 against electrical over-stress, such as that produced by electrostatic discharge (ESD) that is damaging to LEDs in the absence of the power shunting element 12.
The power shunting element 12 is implemented using a variety of voltage clamping devices such as a back-to-back configuration of diodes 16a, 16b. When the voltage clamping devices are Zener diodes, the threshold voltage and the clamp voltage are determined by the Zener voltage of the one of the Zener diodes that is reverse biased and the forward turn-on voltage of the one of the Zener diodes that is forward biased. As an alternative example, when the back-to-back diodes 16a, 16b are transient voltage suppressor (TVS) diodes, the threshold voltage and clamp voltage are determined by the reverse stand-off voltage of the TVS diodes.
The threshold voltage of the power shunting element 12 is chosen to be at least as great as the peak operating voltage of the LED 14 to be protected. For example, the threshold voltage is chosen to be at least as great as the forward junction voltage I 4 of the LED 14 to allow proper operation of the LED. The clamp voltage is chosen to be sufficiently small to limit power dissipation within the LED 14, assuring reliability of the LED even when the applied voltage V exceeds the forward junction voltage of the LED 14.
Figure 2 shows a cross-section of a light-emitting diode assembly 10a constructed according to a first preferred embodiment of the present invention. The LED 14 is attached to a first mounting site 21a of a tirst electrode 22a protruding from a package 23 of the LED assembly 10a using epoxy, solder or other attaching means. The power shunting element 12 is attached to a second mounting site 21b of the first electrode 22a. A pair of wire bonds 24a, 24b, mesh bonds, welds or other connection means provides electrical conduction between the first electrical contact 15 of the LED 14, the first terminal 12a of the power shunting element 12 and a second electrode 22b. Electrical conduction between a second electrical contact 17 of the LED 14 and a second terminal 12b of the power shunting element 12 is provided through the first electrode 22a. The power shunting element 12 limits the voltage V between the first electrical contact 15 and second electrical contact 17 of the LED 14 to the clamp voltage and diverts current IS from the LED 14 when the applied voltage V exceeds the threshold voltage.
Figure 3 shows a cross-section of a light-emitting diode assembly 10b constructed according to a second preferred embodiment of the present invention. In the second preferred embodiment the power shunting element 12 is mounted on a mounting site 21a of a first electrode 22a protruding from a package 23 of the LED assembly 10b. An LED 14 is attached to a top surface of the power shunting element 12 using flip-chip soldering so that a first electrical contact 15 of the LED 14 is electrically connected to a first terminal 12a of the power shunting element 12 and a second electrical contact 17 of the LED 14 is electrically connected to a second terminal 12b of the power shunting element 12. The first electrical contact 15 and the first terminal 12a are coupled to the first electrode 22a using a wire bond 24a or other type of connection. The second electrical contact 17 and the second terminal 12b are coupled to the second electrode 22b using a wire bond 24b or other type of connection. The power shunting element 12 limits the voltage V between the first electrical contact 15 and second electrical contact 17 of the LED 14 to the clamp voltage and diverts current Is from the LED when the applied voltage V exceeds the threshold voltage.
The disclosures in United States patent application no. 09/141,389, from which this application claims priority, and in the abstract accompanying this application are incorporated herein by reference.
1 6

Claims (13)

Claims
1 A light-emitting diode assembly, comprising: a light-emitting diode including a first electrical contact and a second electrical contact; a package including a first electrode coupled to the first electrical contact and a second electrode coupled to the second electrical contact the first electrode and the second electrode for receiving.an applied voltage;.
A power shunting element coupled to the first electrical contact for shunting electrical current from the light-emitting diode when the applied voltage exceeds a threshold voltage.
2. The light-emitting diode assembly of claim 1 wherein the power shunting element includes a back-to-back configuration of voltage clamping devices.
3. The light-emitting diode assembly of claim 2 wherein the back-to-back configuration of voltage clamping devices includes at least one zener diode.
4. The light-emitting diode assembly of claim 2 wherein the back-to-back configuration of voltage clamping devices includes at least one transient voltage suppressor.
1 7
5. The light emittingdiode assembly of claim 1 wherein the first electrode includes a first mounting site accommodating the light-emitting diode and a second mounting site for accommodating the power shunt element, the coupling between the second electrical contact and the power shunting element provided by the first electrode.
6. The light-emitting diode assembly of claim 5 wherein the power shunting element includes a ba(k-to-back configuration of voltage clamping devices.
7. The light-emitting diode assembly of claim 6 wherein the backto-back configuration of voltage clamping devices includes at least one zener diode. -
8. The lightemitting diode assembly of claim 6 wherein the backto-back configuration of voltage clamping devices includes at least one transient voltage suppressor.
9. The light-emitting diode assembly of claim 1 wherein the power shunting element has a bottom surface attached to the first electrode and a top surface having a first terminal and a second terminal, the first elec-trical contact of the lightemitting diode coupled to the first terminal and the second electrical contact of the light-emit-i.ng diode coupled to the second terminal using flip-chip soldering.
10. The light-emitting diode assembly of claim 9 wherein the power shunting element includes a back-to-back configuration of voltage clamping devices.
8
11. The light-emitting diode assembly of claim 10 wherein the back-toback configuration of voltage clamping devices includes at least one zener diode.
12. The light-emitting diode assembly of claim 10 wherein the back-toback configuration of voltage clamping devices includes at least one transient voltage suppressor.
13. A light-emitting diode assembly substantially as hereinbefore described with reference to and as illustrated in the accompanying drawings.
1
GB9917515A 1998-08-27 1999-07-26 Light emitting diode assembly with overvoltage protection Withdrawn GB2341018A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/141,389 US5914501A (en) 1998-08-27 1998-08-27 Light emitting diode assembly having integrated electrostatic discharge protection

Publications (2)

Publication Number Publication Date
GB9917515D0 GB9917515D0 (en) 1999-09-29
GB2341018A true GB2341018A (en) 2000-03-01

Family

ID=22495489

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9917515A Withdrawn GB2341018A (en) 1998-08-27 1999-07-26 Light emitting diode assembly with overvoltage protection

Country Status (6)

Country Link
US (1) US5914501A (en)
JP (1) JP2000077718A (en)
KR (1) KR20000017513A (en)
DE (1) DE19919944A1 (en)
GB (1) GB2341018A (en)
TW (1) TW418548B (en)

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US5914501A (en) 1999-06-22
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