GB2212516A - Gold plated terminal or contact - Google Patents
Gold plated terminal or contact Download PDFInfo
- Publication number
- GB2212516A GB2212516A GB8826815A GB8826815A GB2212516A GB 2212516 A GB2212516 A GB 2212516A GB 8826815 A GB8826815 A GB 8826815A GB 8826815 A GB8826815 A GB 8826815A GB 2212516 A GB2212516 A GB 2212516A
- Authority
- GB
- United Kingdom
- Prior art keywords
- plating layer
- contact
- terminal
- alloy plating
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims description 35
- 229910052737 gold Inorganic materials 0.000 title claims description 35
- 239000010931 gold Substances 0.000 title claims description 35
- 238000007747 plating Methods 0.000 claims description 57
- 229910045601 alloy Inorganic materials 0.000 claims description 26
- 239000000956 alloy Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- 229910018104 Ni-P Inorganic materials 0.000 claims description 4
- 229910018536 Ni—P Inorganic materials 0.000 claims description 4
- 229910020515 Co—W Inorganic materials 0.000 claims description 3
- 229910020706 Co—Re Inorganic materials 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 description 9
- 230000007797 corrosion Effects 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 6
- 229910052721 tungsten Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 241000206607 Porphyra umbilicalis Species 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 2
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 2
- 229910001149 41xx steel Inorganic materials 0.000 description 1
- -1 Cr-W Inorganic materials 0.000 description 1
- 229910000711 U alloy Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Contacts (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28941587A JPH01132072A (ja) | 1987-11-18 | 1987-11-18 | 端子、接点等の金メッキ部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB8826815D0 GB8826815D0 (en) | 1988-12-21 |
| GB2212516A true GB2212516A (en) | 1989-07-26 |
Family
ID=17742945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8826815A Withdrawn GB2212516A (en) | 1987-11-18 | 1988-11-16 | Gold plated terminal or contact |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH01132072A (enrdf_load_stackoverflow) |
| DE (1) | DE3838971A1 (enrdf_load_stackoverflow) |
| GB (1) | GB2212516A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2252669A (en) * | 1991-02-05 | 1992-08-12 | Mitsubishi Electric Corp | Method for manufacturing semiconductor device |
| CN104694928A (zh) * | 2009-07-10 | 2015-06-10 | 克斯塔里克公司 | 涂覆物品及方法 |
| US10541189B2 (en) | 2016-12-28 | 2020-01-21 | Denka Company Limited | Heat dissipation component for semiconductor element |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0359972A (ja) * | 1989-07-27 | 1991-03-14 | Yazaki Corp | 電気接点 |
| JP3693300B2 (ja) * | 1993-09-03 | 2005-09-07 | 日本特殊陶業株式会社 | 半導体パッケージの外部接続端子及びその製造方法 |
| US6039615A (en) * | 1996-03-15 | 2000-03-21 | The Whitaker Corporation | Female electrical terminal having overstress members |
| KR19990066462A (ko) * | 1998-01-26 | 1999-08-16 | 윤종용 | 모니터의 접지 조립체 |
| US6335107B1 (en) * | 1999-09-23 | 2002-01-01 | Lucent Technologies Inc. | Metal article coated with multilayer surface finish for porosity reduction |
| KR20010055949A (ko) * | 1999-12-13 | 2001-07-04 | 류정열 | 엠보스 구조를 갖는 250단자 |
| JP5489049B2 (ja) * | 2008-01-28 | 2014-05-14 | 住友電気工業株式会社 | 箔状導体及び配線部材並びに配線部材の製造方法 |
| JP2012043841A (ja) * | 2010-08-13 | 2012-03-01 | Murata Mfg Co Ltd | 積層型セラミック電子部品およびその製造方法 |
| DE102015220688A1 (de) * | 2015-10-22 | 2017-04-27 | Zf Friedrichshafen Ag | Elektrischer Stecker und Verfahren zum Herstellen |
| JP7011142B2 (ja) * | 2016-09-30 | 2022-01-26 | 日亜化学工業株式会社 | 発光装置、発光装置用パッケージ及び発光装置の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2129441A (en) * | 1982-11-05 | 1984-05-16 | Standard Telephones Cables Ltd | Plated electrical contacts |
| EP0160761A1 (en) * | 1984-05-11 | 1985-11-13 | Burlington Industries, Inc. | Amorphous transition metal alloy, thin gold coated, electrical contact |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54111502A (en) * | 1978-02-20 | 1979-08-31 | Inoue Japax Res Inc | Gas evolution by electrolysis of water |
| DE3345162C1 (de) * | 1983-12-14 | 1984-11-15 | Degussa Ag, 6000 Frankfurt | Werkstoffe für Schwachstromkontakte |
-
1987
- 1987-11-18 JP JP28941587A patent/JPH01132072A/ja active Pending
-
1988
- 1988-11-16 GB GB8826815A patent/GB2212516A/en not_active Withdrawn
- 1988-11-18 DE DE3838971A patent/DE3838971A1/de active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2129441A (en) * | 1982-11-05 | 1984-05-16 | Standard Telephones Cables Ltd | Plated electrical contacts |
| EP0160761A1 (en) * | 1984-05-11 | 1985-11-13 | Burlington Industries, Inc. | Amorphous transition metal alloy, thin gold coated, electrical contact |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2252669A (en) * | 1991-02-05 | 1992-08-12 | Mitsubishi Electric Corp | Method for manufacturing semiconductor device |
| US5272111A (en) * | 1991-02-05 | 1993-12-21 | Mitsubishi Denki Kabushiki Kaisha | Method for manufacturing semiconductor device contact |
| GB2252669B (en) * | 1991-02-05 | 1995-03-22 | Mitsubishi Electric Corp | Method for manufacturing a semiconductor device having gilded contact pads |
| CN104694928A (zh) * | 2009-07-10 | 2015-06-10 | 克斯塔里克公司 | 涂覆物品及方法 |
| US9074294B2 (en) | 2009-07-10 | 2015-07-07 | Xtalic Corporation | Coated articles and methods |
| US9765438B2 (en) | 2009-07-10 | 2017-09-19 | Xtalic Corporation | Coated articles and methods |
| US11634831B2 (en) * | 2009-07-10 | 2023-04-25 | Xtalic Corporation | Coated articles |
| US10541189B2 (en) | 2016-12-28 | 2020-01-21 | Denka Company Limited | Heat dissipation component for semiconductor element |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3838971C2 (enrdf_load_stackoverflow) | 1991-03-28 |
| DE3838971A1 (de) | 1989-06-01 |
| GB8826815D0 (en) | 1988-12-21 |
| JPH01132072A (ja) | 1989-05-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |