EP0160761A1 - Amorphous transition metal alloy, thin gold coated, electrical contact - Google Patents
Amorphous transition metal alloy, thin gold coated, electrical contact Download PDFInfo
- Publication number
- EP0160761A1 EP0160761A1 EP84303633A EP84303633A EP0160761A1 EP 0160761 A1 EP0160761 A1 EP 0160761A1 EP 84303633 A EP84303633 A EP 84303633A EP 84303633 A EP84303633 A EP 84303633A EP 0160761 A1 EP0160761 A1 EP 0160761A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- gold
- electrical contact
- transition metal
- nickel
- amorphous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/619—Amorphous layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
Definitions
- the invention relates to an electrical contact surface (such as an electrical switch contact) having low contact resistance, relatively low cost, acceptable solderability, and high corrosion resistance.
- the electrical contact surface, and method of formation thereof, according to the present invention are particularly designed to replace conventional electrical contact surfaces wherein a gold layer of at least about 30 microinches thickness is applied over a crystalline substrate..
- gold is currently used to insure low contact resistance, and thus effective conduction.
- the gold is applied over a crystalline base metal such as copper, brass, or silver, with or without an intermediate strike of nickel, and the thickness of the gold layer is normally at least about 30 microinches (e.g. 50-100 microinches). At a thickness of 50 microinches the cost of the gold layer is on the order of 5 cents/cm 2 .
- gold has less than ideal solderability since it dissolves in and embrittles some solder alloys.
- an electrical contact surface is provided which overcomes the drawbacks associated with the conventional electrical contact surfaces described above, so that in low and intermediate voltage and/or current signal situations effective conduction can be obtained at less cost and over longer periods of time.
- an electrical contact surface is provided comprising an electrically conductive substrate (preferably a metal such as copper, bronze, brass, aluminum, or silver) with an amorphous (as opposed to crystalline) transition metal alloy electrolytically deposited thereon.
- An "amorphous" alloy is one that has a geometric or topological configuration of the atoms forming the alloy that is different from crystalline (i.e. non-crystalline). Typically, metal alloys are crystalline. When X-ray diffraction tests are done on crystalline materials, it can be seen that the materials exhibit sharp peaks for the d-spacings between planes in the ordered crystal structure, the narrowness or width of these peaks relative to thick height gives an indication of the size of the crystals. For amorphous materials, there are no particularly sharp peaks, the amorphous material being characterized by lack of order in the atomic structure.
- the amorphous transition metal alloy according to the invention preferably is a nickel-phosphorus alloy, such as one having about 15-25 atomic percent phosphorus (preferably about 20 percent), with cobalt, or some other transition metals, utilizable in addition to, or in place of, the nickel.
- Various materials may be added to the plating bath to enhance the corrosion protection of the electrical contact surface being formed, particularly advantageous materials being hexafluosilicate (SiF 6 --), hexafluotitanate (TiF 6 --), or hexafluozir- conate (ZrF 6 --) ions.
- the amorphous nickel alloy is preferably coated with a layer of gold.
- the contactor that results exhibits superior properties compared to conventional contactors wherein the same thickness of gold is coated on a crystalline metal alloy.
- a gold thickness of less than 30 microinches over the amorphous nickel alloy produces an electrical contact structure according to the invention that is equal to, or superior to, conventional contactors wherein a coating of 50-100 microinches of gold is provided.
- a method of producing an electrical contact surface comprises the steps of providing a plating bath for electrolytically depositing an amorphous transition metal alloy on a conductive substrate, immersing the substrate in the bath, and then subsequently coating the amorphous electrolytically deposited alloy with a flash of gold.
- Nickel chloride, cobalt carbonate, and phosphorous acid are preferred bath constituents.
- a number of bath additives can be provided to influence contact resistance and corrosion protection in a positive way.
- Typical bath additives include boric acid, hydroxyacetic acid, acetic acid, B -alanine, succinic acid, surfactants of the alkoxylated linear alcoholic class, SiF 6 -- ions, TiF 6 -- ions and ZrF 6 -- ions.
- the bath temperature conditions, and the current density at the cathode, are maintained so that effective electrolytic deposition takes place.
- a deposition of an amorphous transition metal alloy can be provided on a substrate by immersing the substrate (or a portion thereof) in a plating bath.
- Amorphous transition metal alloys have been found to have better corrosion resistance than crystalline materials, and a thinner coating of gold over an amorphous transition metal alloy produces a contactor having the same, or better, properties than a contactor formed by a thicker coating of gold over a crystalline material. Further, acceptable contacts can be obtained, according to the invention, with only a very thin coating of gold.
- Typical transition metal alloys that are useful in forming electrical contact surfaces (such as electrical switch contacts) according to the invention are nickel and cobalt.
- Nickel is the preferred transition metal since it has the least cost for the most corrosion resistance, of suitable transition metals.
- cobalt for all or part of the nickel, in the plating bath.
- An amorphous deposition of the nickel on the conductive substrate (which preferably comprises a metal such as copper, bronze, brass, aluminum, or silver, or alloys thereof) is formed when phosphorous acid is included in the plating bath, and a relatively high percentage of phosphorus is provided in the alloy that is formed.
- a phosphorus concentration of at least about 12%, and preferably of about 15-25 atomic percent is desired in order to achieve good corrosion resistance and low contact resistance.
- the amorphous deposited alloy has about 20 atomic percent phosphorus.
- the bath temperature conditions, and the current density at the cathode, are controlled in order to maximize the corrosion resistance and minimize the contact resistance.
- current density is about 50 amp./ft. 2 - 2500 amp./ft. 2 , with a range of about 100-900 amp./ft. 2 preferred.
- Typical temperatures are 70-85°C with 75-80°C preferred. Temperature is not critical, but lower temperature will have a tendency to increase the preference of cobalt for nickel in the plating where both are present in the bath.
- Various additives may be provided in the bath in order to positively affect the contact resistance and corrosion resistance.
- the bath contains hexafluosilicate ions at a concentration of about 0.1 molar to the solubility limit (with the addition of small amounts of HF to maintain solubility if necessary) the overall corrosion resistance of the amorphous nickel alloy may be enhanced.
- a generally comparable enhancement of corrosion resistance may also be obtained by substituting TiF 6 -- or ZrF 6 -- ions for part or all of the SiF 6 -- ions.
- any suitable anode and cathode materials may be utilized.
- the anode can either be inert (platinized titanium, platinum, or graphite), or can be of nickel (or like transition metal to be deposited). If TiF 6 --, SiF 6 -- or ZrF 6 -- ions are included in the bath a nickel or cobalt anode must be used. With an inert anode additions of nickel or cobalt must be made from time to time (preferably in the form of NiC0 3 or C O C0 3 ) to maintain the nickel content.
- nickel anode With the nickel anode the content of nickel ion in the bath tends to rise since each two electrons at the anode cause the dissolution of about one nickel ion, while at the cathode both nickel and phosphorus are being reduced.
- a nickel and an inert anode can be used together such that each carries only a portion of the current, and thus maintain a balanced bath with regard to nickel.
- Phosphorous, in the form of phosphorous or hypophosphorous acid, and preferably in the form of phosphorous acid, must be added from time to time -- irrespective of the anode construction -- to maintain the proper bath balance, although the proportion of phosphorous acid is not critical and the bath balance can be maintained rather easily.
- a coating of gold is applied over the amorphous alloy. Preferably this is accomplished by providing an electrodeposit that is applied for a controlled time at a controlled current density.
- the thickness of the gold coating is determined by the desired end properties of the contactor produced. Within wide ranges, whatever the thickness of the gold coating on the amorphous alloy, the contactor that results can be expected to have enhanced properties compared to contactors formed by the same thickness of gold coating over a crystalline material. In fact, acceptable electric contacts can be produced even when the thickness of the gold coating is about 1 microinch.
- the gold coating is in the range of 5-30 microinches, and more preferably 5-15 microinches.
- the gold used for the coating preferably is hard gold, although soft gold is also practical although usually with somewhat less desirable results.
- the thickness of the amorphous transition metal alloy on the substrate is not particularly critical. It merely need be thick enough to achieve the desired results according to the invention. A preferred thickness is in the range of about 50 microinches - 150 microinches. Ranges of 25 microinches - 1000 microinches are practical.
- the electrically conductive substrate is formed into the desired final contact shape. It is then immersed in a cleaner, and then deionized water, and then a dilute hydrochloric acid solution. Then it is placed in the Ni-Co-P plating bath and after plating it is rinsed is deionized water. Then the gold plating is provided thereon in any conventional way, such as in a gold plating bath maintained at about 30-35°C with a current density of about 10 amp./ft. 2. After the gold plating is applied it is again immersed in deionized water.
- a plating bath was formed with the following composition:
- An electrically conductive substrate was immersed in the bath, which was maintained at a temperature of about 80°C, and with a current density at the cathode of about 150 ma/cm 2 .
- the substrate When removed from the bath, the substrate had an amorphous nickel-phosphorus alloy thereon. A one (1) microinch strike of gold was provided on the amorphous alloy.
- the electrical contact surface that resulted had a contact resistance that was substantially as low as a similar substrate with a 50 microinch or greater coating of gold, the contact resistance was stable over time, and as stable in corrosive environments (such as when subjected to the S0 2 test -- 100 percent relative humidity and 1 percent concentration of sulfur dioxide, room temperature, over forty hours --, and the mixed gas test -- the same conditions as the S0 2 test only adding 1 percent nitrogen dioxide and 1 percent chlorine).
- the electrical contact surface formed was much less expensive than the conventional one, and had better solderability characteristics.
- the bath composition, temperature, and current density characteristics were substantially the same as in example 1.
- an approximately 10 microinch strike of gold was provided on the amorphous alloy.
- the electrical contact surface that resulted had contact resistance, and other properties, equal, or superior to, an electrical contact surface formed utilizing similar materials in crystalline form, and with a 50 microinch coating of gold.
- the bath composition in this example was as follows:
- the bath temperature conditions, current density, and like parameters, were substantially the same as for example 1, and after deposition of the amorphous nickel-phosphorus alloy on the substrate a 1 microinch flash of gold was applied.
- the electrical contact surface formed was found to have acceptable contact resistance (i.e. less than 4 milliohms when tested according to ASTM B667-80) and corrosion resistance, although it was not as good as the electrical contact surface produced in example 1.
- the bath composition for this example was as follows:
- the bath temperature was maintained at about 75°C, with a current density at the cathode of about 200 ma/cm 2 .
- An anal sis of the plating resulting from immersion of the substrate in this bath showed bulk values (in atomic percent) of 6.8 ⁇ 4%.cobalt, 0.6 oxygen, 73.3 percent nickel, and 19.3 percent phosphorus.
- a 1 microinch strike of gold was provided on the amorphous alloy.
- the electrical contact surface formed had low contact resistance and high corrosion resistance, and was an excellent substitute for conventional electrical contact surfaces of gold about 50 microinches thick (or thicker) applied over a crystalline base metal.
- a member of platings were produced on electrically conductive substrates to produce platings having about 20% phosphorous, X% cobalt, and 80-X% nickel, utilizing the constituents indicated in the following table:
- Plating was accomplished at 75-78°C using a hard anode (e.g. platinum or platinized titanium) and a current density of about 100 amp./ft. 2 .
- a hard anode e.g. platinum or platinized titanium
- the sum of the nickel plus cobalt is one mole/liter in each formulation, and CoCO 3 is the source of all the cobalt in each of the formulations. Therefore, the Co +2 /Ni +2 ratio in the bath is M/1 CoCO 3 /(1-M/1 CoC0 3 ).
- the Co/Ni ratio in the plating is %Co(80-%Co).
- the relationship between Co +2 /Ni +2 in the bath and Co/Ni in the plate is:
- the plating formed as actual electrical connectors, having 10% Co were coated with 5, 10, or 15 microinches of hard gold, or 5 microinches soft gold, and subjected to durability cycling utilizing conventional techniques, and exposure in a BCL Class III environment, and utilizing the same material on both the PC boards and the connector openings.
- the following results were achieved, wherein
Landscapes
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Composite Materials (AREA)
- Contacts (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacture Of Switches (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Conductive Materials (AREA)
Abstract
Description
- The invention relates to an electrical contact surface (such as an electrical switch contact) having low contact resistance, relatively low cost, acceptable solderability, and high corrosion resistance. The electrical contact surface, and method of formation thereof, according to the present invention are particularly designed to replace conventional electrical contact surfaces wherein a gold layer of at least about 30 microinches thickness is applied over a crystalline substrate..
- In the electrical connector industry where low voltage and/or current signals must be conducted reliably, and in some situations where intermediate voltage and/or current signals must be conducted, gold is currently used to insure low contact resistance, and thus effective conduction. Usually the gold is applied over a crystalline base metal such as copper, brass, or silver, with or without an intermediate strike of nickel, and the thickness of the gold layer is normally at least about 30 microinches (e.g. 50-100 microinches). At a thickness of 50 microinches the cost of the gold layer is on the order of 5 cents/cm2. It is the characteristic of gold -- with such a thickness -- that it is porous and thus through time the underlying material, or its corrosinn;products, may migrate to the surface of the gold and unacceptably raise the contact resistance. Additionally, certain organic materials or sulfur compounds can polymerize on a gold surface and cause high contact resistance. Additionally, gold has less than ideal solderability since it dissolves in and embrittles some solder alloys.
- According to the present invention an electrical contact surface is provided which overcomes the drawbacks associated with the conventional electrical contact surfaces described above, so that in low and intermediate voltage and/or current signal situations effective conduction can be obtained at less cost and over longer periods of time. According to the present invention, an electrical contact surface is provided comprising an electrically conductive substrate (preferably a metal such as copper, bronze, brass, aluminum, or silver) with an amorphous (as opposed to crystalline) transition metal alloy electrolytically deposited thereon.
- An "amorphous" alloy is one that has a geometric or topological configuration of the atoms forming the alloy that is different from crystalline (i.e. non-crystalline). Typically, metal alloys are crystalline. When X-ray diffraction tests are done on crystalline materials, it can be seen that the materials exhibit sharp peaks for the d-spacings between planes in the ordered crystal structure, the narrowness or width of these peaks relative to thick height gives an indication of the size of the crystals. For amorphous materials, there are no particularly sharp peaks, the amorphous material being characterized by lack of order in the atomic structure. The exact nature of the amorphous structures is not known, however there are a number of theories which attempt to describe the configurations of the atoms in amorphous materials. In this regard attention is directed to an article entitled "Metallic Glasses" by Chaudhari et al, appearing in Scientific American, Volume 242, No. 4, 1980, pages 98-117.
- The amorphous transition metal alloy according to the invention preferably is a nickel-phosphorus alloy, such as one having about 15-25 atomic percent phosphorus (preferably about 20 percent), with cobalt, or some other transition metals, utilizable in addition to, or in place of, the nickel. Various materials may be added to the plating bath to enhance the corrosion protection of the electrical contact surface being formed, particularly advantageous materials being hexafluosilicate (SiF6--), hexafluotitanate (TiF6--), or hexafluozir- conate (ZrF6--) ions.
- After the amorphous nickel alloy has been electrolytically deposited on the substrate, the amorphous nickel alloy is preferably coated with a layer of gold. When the amorphous nickel alloy is coated with a layer of gold of a given thickness, the contactor that results exhibits superior properties compared to conventional contactors wherein the same thickness of gold is coated on a crystalline metal alloy. For instance, a gold thickness of less than 30 microinches over the amorphous nickel alloy produces an electrical contact structure according to the invention that is equal to, or superior to, conventional contactors wherein a coating of 50-100 microinches of gold is provided. In fact, it is possible to obtain entirely acceptable contactors even when the gold coating is one microinch thick (at this thickness the cost of the gold is only about 0.1 cents/cm2), although a range of 5-15 microinches is preferred. The electrical contact surface resulting has stable contact resistance both initially and after exposure to a series of common atmospheric corrodants, and initially (soon after production) when tested pursuant to ASTM B667-80 has a contact resistance less than 4 milliohms.
- According to another aspect of the present invention, a method of producing an electrical contact surface is provided. The method comprises the steps of providing a plating bath for electrolytically depositing an amorphous transition metal alloy on a conductive substrate, immersing the substrate in the bath, and then subsequently coating the amorphous electrolytically deposited alloy with a flash of gold. Nickel chloride, cobalt carbonate, and phosphorous acid are preferred bath constituents. A number of bath additives can be provided to influence contact resistance and corrosion protection in a positive way. Typical bath additives include boric acid, hydroxyacetic acid, acetic acid, B-alanine, succinic acid, surfactants of the alkoxylated linear alcoholic class, SiF6-- ions, TiF6-- ions and ZrF6-- ions. The bath temperature conditions, and the current density at the cathode, are maintained so that effective electrolytic deposition takes place.
- It is the primary object of the present invention to provide for the production of electrical contact surfaces that have low, stable contact resistance over extended periods of time even when subjected to corrosive conditions, and at a relatively low cost. This and other objects of the invention will become clear from an inspection of the detailed description of the invention and from the appended claims.
- A deposition of an amorphous transition metal alloy can be provided on a substrate by immersing the substrate (or a portion thereof) in a plating bath. Amorphous transition metal alloys have been found to have better corrosion resistance than crystalline materials, and a thinner coating of gold over an amorphous transition metal alloy produces a contactor having the same, or better, properties than a contactor formed by a thicker coating of gold over a crystalline material. Further, acceptable contacts can be obtained, according to the invention, with only a very thin coating of gold.
- Typical transition metal alloys that are useful in forming electrical contact surfaces (such as electrical switch contacts) according to the invention are nickel and cobalt. Nickel is the preferred transition metal since it has the least cost for the most corrosion resistance, of suitable transition metals. However, generally comparable, and sometimes superior, results can be achieved substituting cobalt, for all or part of the nickel, in the plating bath.
- An amorphous deposition of the nickel on the conductive substrate (which preferably comprises a metal such as copper, bronze, brass, aluminum, or silver, or alloys thereof) is formed when phosphorous acid is included in the plating bath, and a relatively high percentage of phosphorus is provided in the alloy that is formed. A phosphorus concentration of at least about 12%, and preferably of about 15-25 atomic percent is desired in order to achieve good corrosion resistance and low contact resistance. Most preferably the amorphous deposited alloy has about 20 atomic percent phosphorus.
- The bath temperature conditions, and the current density at the cathode, are controlled in order to maximize the corrosion resistance and minimize the contact resistance. Typically current density is about 50 amp./ft.2 - 2500 amp./ft.2, with a range of about 100-900 amp./ft.2 preferred. Typical temperatures are 70-85°C with 75-80°C preferred. Temperature is not critical, but lower temperature will have a tendency to increase the preference of cobalt for nickel in the plating where both are present in the bath.
- Various additives may be provided in the bath in order to positively affect the contact resistance and corrosion resistance. When the bath contains hexafluosilicate ions at a concentration of about 0.1 molar to the solubility limit (with the addition of small amounts of HF to maintain solubility if necessary) the overall corrosion resistance of the amorphous nickel alloy may be enhanced. A generally comparable enhancement of corrosion resistance may also be obtained by substituting TiF6-- or ZrF6-- ions for part or all of the SiF6-- ions.
- In a plating bath containing nickel or cobalt ions and phosphorous acid any suitable anode and cathode materials may be utilized. For instance the anode can either be inert (platinized titanium, platinum, or graphite), or can be of nickel (or like transition metal to be deposited). If TiF6--, SiF6-- or ZrF6-- ions are included in the bath a nickel or cobalt anode must be used. With an inert anode additions of nickel or cobalt must be made from time to time (preferably in the form of NiC03 or COC03) to maintain the nickel content. With the nickel anode the content of nickel ion in the bath tends to rise since each two electrons at the anode cause the dissolution of about one nickel ion, while at the cathode both nickel and phosphorus are being reduced. A nickel and an inert anode can be used together such that each carries only a portion of the current, and thus maintain a balanced bath with regard to nickel. Phosphorous, in the form of phosphorous or hypophosphorous acid, and preferably in the form of phosphorous acid, must be added from time to time -- irrespective of the anode construction -- to maintain the proper bath balance, although the proportion of phosphorous acid is not critical and the bath balance can be maintained rather easily..
- After deposition of the nickel phosphorous alloy, or the like, on a substrate, a coating of gold is applied over the amorphous alloy. Preferably this is accomplished by providing an electrodeposit that is applied for a controlled time at a controlled current density. The thickness of the gold coating is determined by the desired end properties of the contactor produced. Within wide ranges, whatever the thickness of the gold coating on the amorphous alloy, the contactor that results can be expected to have enhanced properties compared to contactors formed by the same thickness of gold coating over a crystalline material. In fact, acceptable electric contacts can be produced even when the thickness of the gold coating is about 1 microinch. Preferably the gold coating is in the range of 5-30 microinches, and more preferably 5-15 microinches.
- The gold used for the coating preferably is hard gold, although soft gold is also practical although usually with somewhat less desirable results. The thickness of the amorphous transition metal alloy on the substrate is not particularly critical. It merely need be thick enough to achieve the desired results according to the invention. A preferred thickness is in the range of about 50 microinches - 150 microinches. Ranges of 25 microinches - 1000 microinches are practical.
- In the typical manufacture of an electrical contact according to the invention (which may be of a wide variety of forms, such as edge card connectors, contact leaf springs, rigid electrical switch contact structures, etc.), desirably, the electrically conductive substrate is formed into the desired final contact shape. It is then immersed in a cleaner, and then deionized water, and then a dilute hydrochloric acid solution. Then it is placed in the Ni-Co-P plating bath and after plating it is rinsed is deionized water. Then the gold plating is provided thereon in any conventional way, such as in a gold plating bath maintained at about 30-35°C with a current density of about 10 amp./ft.2. After the gold plating is applied it is again immersed in deionized water.
- Alternatively, for many electrical contact shapes (such as edge card connectors), it is possible to plate blanks or coupons first, and only after they have been plated and a gold strike applied are they formed into the desired shape.
- The following are examples of the practice of the invention:
- A plating bath was formed with the following composition:
- .75 M/1 NiCl2 . 6H20
- .25 M/l NiC03
- 1.25 M/l H3PO3
- An electrically conductive substrate was immersed in the bath, which was maintained at a temperature of about 80°C, and with a current density at the cathode of about 150 ma/cm2. When removed from the bath, the substrate had an amorphous nickel-phosphorus alloy thereon. A one (1) microinch strike of gold was provided on the amorphous alloy. The electrical contact surface that resulted had a contact resistance that was substantially as low as a similar substrate with a 50 microinch or greater coating of gold, the contact resistance was stable over time, and as stable in corrosive environments (such as when subjected to the S02 test -- 100 percent relative humidity and 1 percent concentration of sulfur dioxide, room temperature, over forty hours --, and the mixed gas test -- the same conditions as the S02 test only adding 1 percent nitrogen dioxide and 1 percent chlorine). The electrical contact surface formed was much less expensive than the conventional one, and had better solderability characteristics.
- In this example, the bath composition, temperature, and current density characteristics were substantially the same as in example 1. After the substrate with an amorphous nickel-phosphorus alloy was removed from the bath, an approximately 10 microinch strike of gold was provided on the amorphous alloy. The electrical contact surface that resulted had contact resistance, and other properties, equal, or superior to, an electrical contact surface formed utilizing similar materials in crystalline form, and with a 50 microinch coating of gold.
- The bath composition in this example was as follows:
- .2 M/1 NiCl2 .6 (H20)
- .8 M/1 NiS04 .6 (H20)
- .5 M/l H3PO3
- -.5 M/1 H3PO4
- The bath temperature conditions, current density, and like parameters, were substantially the same as for example 1, and after deposition of the amorphous nickel-phosphorus alloy on the substrate a 1 microinch flash of gold was applied. By testing, the electrical contact surface formed was found to have acceptable contact resistance (i.e. less than 4 milliohms when tested according to ASTM B667-80) and corrosion resistance, although it was not as good as the electrical contact surface produced in example 1.
- The bath composition for this example was as follows:
- .88 M/l NiCl2 . 6H20
- .25 M/l NiC03
- 1.25 M/l H3P03
- .4 M/1 H3B03
- .2 M/1 Acetic acid
- .1 M/l COC03
- The bath temperature was maintained at about 75°C, with a current density at the cathode of about 200 ma/cm2. An anal sis of the plating resulting from immersion of the substrate in this bath showed bulk values (in atomic percent) of 6.8 ±4%.cobalt, 0.6 oxygen, 73.3 percent nickel, and 19.3 percent phosphorus. A 1 microinch strike of gold was provided on the amorphous alloy. The electrical contact surface formed had low contact resistance and high corrosion resistance, and was an excellent substitute for conventional electrical contact surfaces of gold about 50 microinches thick (or thicker) applied over a crystalline base metal.
-
- Plating was accomplished at 75-78°C using a hard anode (e.g. platinum or platinized titanium) and a current density of about 100 amp./ft.2.
- The sum of the nickel plus cobalt is one mole/liter in each formulation, and CoCO3 is the source of all the cobalt in each of the formulations. Therefore, the Co+2/Ni+2 ratio in the bath is M/1 CoCO3/(1-M/1 CoC03). The Co/Ni ratio in the plating is %Co(80-%Co). The relationship between Co+2/Ni+2 in the bath and Co/Ni in the plate is:
- It is evident that the cobalt is being plated preferentially to the nickel and that at low cobalt levels this preference is slightly greater. Operating at lower temperature will make the preference (Co/Ni in plating) greater, as will operating at higher current density. Further, these formulations produce lower than nominal amounts of cobalt when they are new, i.e. for the first 100 amp-minutes/liter the baths will produce only ca. 1/2 to 2/3 the desired cobalt content in the plating.
- The plating, formed as actual electrical connectors, having 10% Co were coated with 5, 10, or 15 microinches of hard gold, or 5 microinches soft gold, and subjected to durability cycling utilizing conventional techniques, and exposure in a BCL Class III environment, and utilizing the same material on both the PC boards and the connector openings. The following results were achieved, wherein
- Rc= the contact resistance and
- a= a measure of the deviations of the individual contact values from their average
- These results indicate improved performance of the electrical connectors according to the invention compared to a 50 microinch plating of hard gold over conventional sulfamate nickel.
- While the invention has been herein shown and described in what is presently conceived to be the most practical and preferred embodiment thereof, it will be apparent to those of ordinary skill in the art that many modifications may be made thereof within the scope of the invention, which scope is to be accorded the broadest interpretation*of the appended claims so as to encompass all equivalent structures and methods.
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT84303633T ATE40721T1 (en) | 1984-05-11 | 1984-05-30 | ELECTRICAL CONTACT COATED WITH AN AMORPHOUS TRANSITION ALLOY WHICH IS ITSELF COATED WITH A GOLD FILM. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US60913784A | 1984-05-11 | 1984-05-11 | |
US609137 | 1984-05-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0160761A1 true EP0160761A1 (en) | 1985-11-13 |
EP0160761B1 EP0160761B1 (en) | 1989-02-08 |
Family
ID=24439500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP84303633A Expired EP0160761B1 (en) | 1984-05-11 | 1984-05-30 | Amorphous transition metal alloy, thin gold coated, electrical contact |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0160761B1 (en) |
JP (1) | JPS6129021A (en) |
AT (1) | ATE40721T1 (en) |
DE (1) | DE3476684D1 (en) |
ES (1) | ES533300A0 (en) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3838971A1 (en) * | 1987-11-18 | 1989-06-01 | Yazaki Corp | GOLD PLATED CONNECTORS |
EP0384579A1 (en) * | 1989-02-01 | 1990-08-29 | AT&T Corp. | Apparatus including electrical contacts |
EP0410472A2 (en) | 1989-07-27 | 1991-01-30 | Yazaki Corporation | Electric contact |
US5408574A (en) * | 1989-12-01 | 1995-04-18 | Philip Morris Incorporated | Flat ceramic heater having discrete heating zones |
US5468936A (en) * | 1993-03-23 | 1995-11-21 | Philip Morris Incorporated | Heater having a multiple-layer ceramic substrate and method of fabrication |
US5637925A (en) * | 1988-02-05 | 1997-06-10 | Raychem Ltd | Uses of uniaxially electrically conductive articles |
EP1086807A2 (en) * | 1999-09-23 | 2001-03-28 | Lucent Technologies Inc. | Metal article coated with multilayer surface finish for porosity reduction |
WO2003050920A1 (en) * | 2001-12-13 | 2003-06-19 | Outokumpu Oyj | Contact terminal with doped coating |
WO2007039302A1 (en) * | 2005-10-05 | 2007-04-12 | W.C. Heraeus Gmbh | Slip ring for continuous current transfer |
US7615255B2 (en) | 2005-09-07 | 2009-11-10 | Rohm And Haas Electronic Materials Llc | Metal duplex method |
US20140234663A1 (en) * | 2009-07-10 | 2014-08-21 | Xtalic Corporation | Coated articles and methods |
US8857468B2 (en) | 2010-08-07 | 2014-10-14 | Audi Ag | Expansion reservoir for a coolant circuit |
EP2753731A4 (en) * | 2011-09-09 | 2015-07-01 | Macdermid Acumen Inc | Electrodeposition of hard magnetic coatings |
WO2024160379A1 (en) * | 2023-02-03 | 2024-08-08 | Abb Schweiz Ag | Dry mechanism with multilayer coating |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0192703B1 (en) * | 1984-08-31 | 1989-11-02 | AT&T Corp. | Nickel-based electrical contact |
US20170100744A1 (en) | 2015-10-12 | 2017-04-13 | Tyco Electronics Corporation | Electronic Component and Process of Producing Electronic Component |
US20170100916A1 (en) | 2015-10-12 | 2017-04-13 | Tyco Electronics Corporation | Electronic Component and Process of Producing Electronic Component |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1059738B (en) * | 1957-12-06 | 1959-06-18 | Duerrwaechter E Dr Doduco | Process for the production of a multilayer metal |
GB1507782A (en) * | 1976-04-13 | 1978-04-19 | Lea Ronal Inc | Electrodeposition of gold |
US4101389A (en) * | 1976-05-20 | 1978-07-18 | Sony Corporation | Method of manufacturing amorphous alloy |
-
1984
- 1984-05-30 EP EP84303633A patent/EP0160761B1/en not_active Expired
- 1984-05-30 DE DE8484303633T patent/DE3476684D1/en not_active Expired
- 1984-05-30 AT AT84303633T patent/ATE40721T1/en not_active IP Right Cessation
- 1984-05-31 JP JP11217484A patent/JPS6129021A/en active Pending
- 1984-06-11 ES ES533300A patent/ES533300A0/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1059738B (en) * | 1957-12-06 | 1959-06-18 | Duerrwaechter E Dr Doduco | Process for the production of a multilayer metal |
GB1507782A (en) * | 1976-04-13 | 1978-04-19 | Lea Ronal Inc | Electrodeposition of gold |
US4101389A (en) * | 1976-05-20 | 1978-07-18 | Sony Corporation | Method of manufacturing amorphous alloy |
Non-Patent Citations (2)
Title |
---|
METAL FINISHING ABSTRACTS, volume 22, no. 3, May/June 1980, Teddington, Middlesex (GB) page 187H, & JP - A - 54 110470 (HITACHI) * |
METAL FINISHING, volume 82, no. 1, January 1984, pages 59-65, C. RAJAGOPAL et al.: "Electrode-deposition of corrosion resistant amorphous nickel alloys on mild steel" * |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3838971A1 (en) * | 1987-11-18 | 1989-06-01 | Yazaki Corp | GOLD PLATED CONNECTORS |
GB2212516A (en) * | 1987-11-18 | 1989-07-26 | Yazaki Corp | Gold plated terminal or contact |
US5637925A (en) * | 1988-02-05 | 1997-06-10 | Raychem Ltd | Uses of uniaxially electrically conductive articles |
EP0384579A1 (en) * | 1989-02-01 | 1990-08-29 | AT&T Corp. | Apparatus including electrical contacts |
US5066550A (en) * | 1989-07-27 | 1991-11-19 | Yazaki Corporation | Electric contact |
EP0410472B1 (en) * | 1989-07-27 | 1995-11-15 | Yazaki Corporation | Electric contact |
EP0410472A2 (en) | 1989-07-27 | 1991-01-30 | Yazaki Corporation | Electric contact |
US5408574A (en) * | 1989-12-01 | 1995-04-18 | Philip Morris Incorporated | Flat ceramic heater having discrete heating zones |
US5468936A (en) * | 1993-03-23 | 1995-11-21 | Philip Morris Incorporated | Heater having a multiple-layer ceramic substrate and method of fabrication |
EP1086807A2 (en) * | 1999-09-23 | 2001-03-28 | Lucent Technologies Inc. | Metal article coated with multilayer surface finish for porosity reduction |
EP1086807A3 (en) * | 1999-09-23 | 2001-10-31 | Lucent Technologies Inc. | Metal article coated with multilayer surface finish for porosity reduction |
WO2003050920A1 (en) * | 2001-12-13 | 2003-06-19 | Outokumpu Oyj | Contact terminal with doped coating |
US7615255B2 (en) | 2005-09-07 | 2009-11-10 | Rohm And Haas Electronic Materials Llc | Metal duplex method |
WO2007039302A1 (en) * | 2005-10-05 | 2007-04-12 | W.C. Heraeus Gmbh | Slip ring for continuous current transfer |
US20140234663A1 (en) * | 2009-07-10 | 2014-08-21 | Xtalic Corporation | Coated articles and methods |
US9765438B2 (en) * | 2009-07-10 | 2017-09-19 | Xtalic Corporation | Coated articles and methods |
US8857468B2 (en) | 2010-08-07 | 2014-10-14 | Audi Ag | Expansion reservoir for a coolant circuit |
EP2753731A4 (en) * | 2011-09-09 | 2015-07-01 | Macdermid Acumen Inc | Electrodeposition of hard magnetic coatings |
WO2024160379A1 (en) * | 2023-02-03 | 2024-08-08 | Abb Schweiz Ag | Dry mechanism with multilayer coating |
Also Published As
Publication number | Publication date |
---|---|
ES8601557A1 (en) | 1985-10-16 |
EP0160761B1 (en) | 1989-02-08 |
DE3476684D1 (en) | 1989-03-16 |
JPS6129021A (en) | 1986-02-08 |
ES533300A0 (en) | 1985-10-16 |
ATE40721T1 (en) | 1989-02-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0160761B1 (en) | Amorphous transition metal alloy, thin gold coated, electrical contact | |
KR100783847B1 (en) | Metal article coated with multilayer surface finish for porosity reduction | |
EP0146152B1 (en) | Solderable palladium-nickel coatings | |
JP5077479B1 (en) | Contacts and electronic parts using the same | |
Tsay et al. | Non-anomalous codeposition of iron-nickel alloys using pulse-reverse electroplating through means of experimental strategies | |
US5560812A (en) | Method for producing a metal film resistor | |
US4767509A (en) | Nickel-phosphorus electroplating and bath therefor | |
KR100872622B1 (en) | METHOD FOR FORMING Sn-Ag-Cu THREE-ELEMENT ALLOY THIN FILM ON BASE | |
JP6086531B2 (en) | Silver plating material | |
KR20200130787A (en) | Electrolytic Rhodium Plating Solution | |
KR20020042719A (en) | Method for producing an electrolytically coated cold rolled strip, preferably for use in the production of battery sheaths, and battery sheath produced according to said method | |
EP0198355B1 (en) | Electroplating bath and application thereof | |
Kim et al. | A novel electrodeposition process for plating Zn-Ni-Cd alloys | |
CA1245259A (en) | Amorphous transition metal alloy, thin gold coated, electrical contact | |
US4564565A (en) | Method of making low contact resistance metallic coatings and electrical contacts so produced | |
EP0384579B1 (en) | Apparatus including electrical contacts | |
JP2007169706A (en) | Electroplating solution and electroplating method for forming amorphous gold-nickel based alloy plated film | |
Jiang et al. | Effects of Bromide Ions in Anomalous Codeposition of Ni-Co Alloys with a Sulfamate Based Electrolyte | |
JPS639034B2 (en) | ||
JP7068899B2 (en) | Rhodium phosphorus plating film and laminate material | |
Zidani et al. | Effect of the Additive on the Properties of Ni-Fe Coating | |
JP2007009304A (en) | Composite plated material, and method for producing the same | |
Ng et al. | Effect of crystallographic orientation on contact resistance of electroplated nickel alloys | |
Nobel | Electroplated Palladium-Silver (60/40 wt%) Alloy as a Contact Metal | |
JP2620816B2 (en) | Palladium-nickel-phosphorus alloy electroplating solution |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Designated state(s): AT BE CH DE FR GB IT LI LU NL SE |
|
17P | Request for examination filed |
Effective date: 19860430 |
|
17Q | First examination report despatched |
Effective date: 19870722 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AT BE CH DE FR GB IT LI LU NL SE |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SE Effective date: 19890208 Ref country code: NL Effective date: 19890208 Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT;WARNING: LAPSES OF ITALIAN PATENTS WITH EFFECTIVE DATE BEFORE 2007 MAY HAVE OCCURRED AT ANY TIME BEFORE 2007. THE CORRECT EFFECTIVE DATE MAY BE DIFFERENT FROM THE ONE RECORDED. Effective date: 19890208 Ref country code: AT Effective date: 19890208 |
|
REF | Corresponds to: |
Ref document number: 40721 Country of ref document: AT Date of ref document: 19890215 Kind code of ref document: T |
|
REF | Corresponds to: |
Ref document number: 3476684 Country of ref document: DE Date of ref document: 19890316 |
|
ET | Fr: translation filed | ||
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 19890531 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: CH Payment date: 19890614 Year of fee payment: 6 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: BE Payment date: 19890703 Year of fee payment: 6 |
|
NLV1 | Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act | ||
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 19900518 Year of fee payment: 7 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: FR Payment date: 19900525 Year of fee payment: 7 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LI Effective date: 19900531 Ref country code: CH Effective date: 19900531 Ref country code: BE Effective date: 19900531 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 19900629 Year of fee payment: 7 |
|
BERE | Be: lapsed |
Owner name: BURLINGTON INDUSTRIES INC. Effective date: 19900531 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Effective date: 19910530 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
26N | No opposition filed | ||
GBPC | Gb: european patent ceased through non-payment of renewal fee | ||
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Effective date: 19920131 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DE Effective date: 19920303 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: ST |