ES533300A0 - A METHOD OF FORMING AN ELECTRICAL CONTACT STRUCTURE - Google Patents

A METHOD OF FORMING AN ELECTRICAL CONTACT STRUCTURE

Info

Publication number
ES533300A0
ES533300A0 ES533300A ES533300A ES533300A0 ES 533300 A0 ES533300 A0 ES 533300A0 ES 533300 A ES533300 A ES 533300A ES 533300 A ES533300 A ES 533300A ES 533300 A0 ES533300 A0 ES 533300A0
Authority
ES
Spain
Prior art keywords
electrical contact
gold
forming
transition metal
metal alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES533300A
Other languages
Spanish (es)
Other versions
ES8601557A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Burlington Industries Inc
Original Assignee
Burlington Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burlington Industries Inc filed Critical Burlington Industries Inc
Publication of ES533300A0 publication Critical patent/ES533300A0/en
Publication of ES8601557A1 publication Critical patent/ES8601557A1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/619—Amorphous layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Composite Materials (AREA)
  • Contacts (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacture Of Switches (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Conductive Materials (AREA)

Abstract

An electrical contact, and a method of forming an electrical contact, result in a structure that may utilize far less gold than conventional electrical contacts while having the same, or superior, desirable properties. The electrical contact includes an electrically conductive substrate with an amorphous transition metal alloy electrolytically deposited on the substrate. The amorphorus transition metal alloy is a nickel phosphorus, or nickel cobalt phosphorus alloy, and has an uncovered coating of gold thereover. The gold coating is between about 1-30 microinches thick, preferably 5-15 microinches of hard gold.
ES533300A 1984-05-11 1984-06-11 Amorphous transition metal alloy, thin gold coated, electrical contact. Expired ES8601557A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US60913784A 1984-05-11 1984-05-11

Publications (2)

Publication Number Publication Date
ES533300A0 true ES533300A0 (en) 1985-10-16
ES8601557A1 ES8601557A1 (en) 1985-10-16

Family

ID=24439500

Family Applications (1)

Application Number Title Priority Date Filing Date
ES533300A Expired ES8601557A1 (en) 1984-05-11 1984-06-11 Amorphous transition metal alloy, thin gold coated, electrical contact.

Country Status (5)

Country Link
EP (1) EP0160761B1 (en)
JP (1) JPS6129021A (en)
AT (1) ATE40721T1 (en)
DE (1) DE3476684D1 (en)
ES (1) ES8601557A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0192703B1 (en) * 1984-08-31 1989-11-02 AT&T Corp. Nickel-based electrical contact
JPH01132072A (en) * 1987-11-18 1989-05-24 Yazaki Corp Gold plated parts of terminal, contact, and the like
US5637925A (en) * 1988-02-05 1997-06-10 Raychem Ltd Uses of uniaxially electrically conductive articles
US4891480A (en) * 1989-02-01 1990-01-02 American Telephone And Telegraph Company, At&T Bell Laboratories Apparatus including electrical contacts
JPH0359972A (en) * 1989-07-27 1991-03-14 Yazaki Corp Electrical contact
US5408574A (en) * 1989-12-01 1995-04-18 Philip Morris Incorporated Flat ceramic heater having discrete heating zones
US5468936A (en) * 1993-03-23 1995-11-21 Philip Morris Incorporated Heater having a multiple-layer ceramic substrate and method of fabrication
US6335107B1 (en) * 1999-09-23 2002-01-01 Lucent Technologies Inc. Metal article coated with multilayer surface finish for porosity reduction
FI113912B (en) * 2001-12-13 2004-06-30 Outokumpu Oy Connector terminal with additive coating
US7615255B2 (en) 2005-09-07 2009-11-10 Rohm And Haas Electronic Materials Llc Metal duplex method
DE102005047799A1 (en) * 2005-10-05 2007-05-24 W.C. Heraeus Gmbh Slip ring body for continuous power transmission
US8652649B2 (en) * 2009-07-10 2014-02-18 Xtalic Corporation Coated articles and methods
DE102010033715A1 (en) 2010-08-07 2012-02-09 Audi Ag Expansion tank for a coolant circuit
US20130065069A1 (en) * 2011-09-09 2013-03-14 Yun Li Liu Electrodeposition of Hard Magnetic Coatings
US20170100916A1 (en) 2015-10-12 2017-04-13 Tyco Electronics Corporation Electronic Component and Process of Producing Electronic Component
US20170100744A1 (en) 2015-10-12 2017-04-13 Tyco Electronics Corporation Electronic Component and Process of Producing Electronic Component

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1059738B (en) * 1957-12-06 1959-06-18 Duerrwaechter E Dr Doduco Process for the production of a multilayer metal
GB1507782A (en) * 1976-04-13 1978-04-19 Lea Ronal Inc Electrodeposition of gold
CA1072910A (en) * 1976-05-20 1980-03-04 Satoru Uedaira Method of manufacturing amorphous alloy

Also Published As

Publication number Publication date
ES8601557A1 (en) 1985-10-16
EP0160761A1 (en) 1985-11-13
EP0160761B1 (en) 1989-02-08
JPS6129021A (en) 1986-02-08
ATE40721T1 (en) 1989-02-15
DE3476684D1 (en) 1989-03-16

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