GB2212516A - Gold plated terminal or contact - Google Patents
Gold plated terminal or contact Download PDFInfo
- Publication number
- GB2212516A GB2212516A GB8826815A GB8826815A GB2212516A GB 2212516 A GB2212516 A GB 2212516A GB 8826815 A GB8826815 A GB 8826815A GB 8826815 A GB8826815 A GB 8826815A GB 2212516 A GB2212516 A GB 2212516A
- Authority
- GB
- United Kingdom
- Prior art keywords
- plating layer
- contact
- terminal
- alloy plating
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
Description
GOLD PLATED TERMINAL OR CONTACT This invention relates to aold plated
terminals 0 and contacts for use as terminals for electronic c-i--cu-i'Ls, those for printed circuits and those for audio equipment', for use in automobiles.
21251 C In order to reduce the contact resistance of terminals and contacts of the kind sDecified and imorove the corrosion ^ar been produced by sub-'ec.-- resistance thereof, they have so f j nC, t the surface of a substrate metal such as copper and copper alloy, etc. to electro-nickel pialting, and then gold plating. The purpose of previous dez)csi-Jon of electrc-.-,cke" plat-n= - -m. - L, - C P-on on the surface of a substrate metal is to prevent gold diffusing into the substrate metal..
0 In order to reduce the contact Lance of terminals 4s' and contacts and enhance the corrosion res lance thereoff, 4t is only necessary to se' the thickness of 'he gold plating J. k.' L, - at, about 0.1Abm at a minimum. However, there has been a problem that, because ol the high porosity of the gold plating itself, it has unavoidably many pin holes through which the electro-nickel plating layer is liable to be corroded. As a means for solving such a-problem, there is - 1 known a method of eliminating the occur. ence O.L pin holes by forming the above-ment_ioned gold plating layer thick-ly 0 L1h This method, however, has (as ' ick as 0.6 to 1.0j-,4m,. L posed a problem that no appreciable change in Iberns of 'the contact resistance is obtained thereby, but the amount of gold required to be used increases, resulting in increased costs of terminals and contacts.
The present invention has been devised to solve the above-mentioned problem in the prior art, and has for its object to provide a terminal or contact having gold plating deposited thereon, wherein it has an improved corrosion-resistance and the amount of gold to be used is reduced thereby achieving a significant cost reduction.
To achieve the above-mentioned object, according to the present invention, there is provided a gold plated terminal or contact, characterized in that, a non-crystalline alloy plating layer is deposited on the surLace ot a substrate metall intended to have gold plating deposited thereon, and then a gold plating layer is deposited on the non-crystalline U alloy plating.
The above-mentioned non-crystalline alloy plating 'ormed by any one of NiP, Ni-B, Ni- layer includes those f Fe-P, Co-P, Nii-P-W, CO-Ni-P, Co-W, Fe-W, Co-Re, Cr-W, CrMo, etc. The non-crystalline alloy plating- layer is more excellent in corrosion resistance than the electro-n-ickel - d - f' at ng ayer, and there is no fe ar ' occurrence o.
of ' corrosion thereof even in case nin holes exist in the ao',; Dla4nR layer.
Embodiments of the invention are described below with reference to the drawings in which:- Fia. I is a fragmentary, enlarged sectional view CP 0 Q showing an embodiment of the present inventon, and Figs. 2 and 3 are fragmentary, enlarged sectional views showing the prior art.
1 I - resist -act ance o' 4nals In order to reduce the con".
L,erm.
4 ce c. and improve and contacts, e the corros on res-stan- t - is only necessary to set the th' I gold L.hereo-L, Lckness oi plating layer at about 0. 1.,/,jm at a minimum. 'However, ere 4. OS41 ±he high por.Ly Of has been a problem that., because of. gold plating itself, the gold platingg laver has many pin holes 30a therein as shown in Fig. 2, through which electro- nickel plating layer 200 is liable to be corroded. Further, in Fig. 2, reLerence numeral 2 denotes a substrate metal.
As a means for solving such a problem, there has been known and employed a method of eliminating the occurrence of pin holes 30a by forming the gold plating layer 30 thickly (as thick as 0.6 to 1.0)-.,km). This method, however, posed a problem that an appreciable change in terms of the contact resistance is obtained thereby, but the amount of gold required 3 to be used increases, resulting.4n increased costs of such terminals and contacts, etc.
Fig. 1 illustrates an example of gold plated component part according to the present invention. in this figure, reference numeral 10 denotes a substrate metal such as copper or a copper alloy, etc. forming a terminal for use with a connector. This substrate metal 10 has a gold plating layer'30 deposited thereon with an aim of reducing the contact resistance thereof as well as improving the corrosion resistance thereof. In this case, to prevent the gold from diffusing into the substrate-metal 10, a plating layer of another metal is interposed between the substrate metal 10 and the gold plating layer 30. What is important in that case is the interposition of a non-crystalline alloy plating layer 20 as an intermediate plati.ng layer between them.
T laver 20 includes I e non-crystall-line alloy plating those formed by any one of, for example, N-i--P, N-J-3, N-iFe-P, Co-?, Ni-P-W, Co-Nii-P, Co-W, Fe-W, Co- Re, Cr-W, and Cr-Mo, etc. Because any of these materials is subjected "e secregation and has no grain boundary, the surface to lit+ 0 LI thereof is uniform and smooth, and a uniform passivated film is formed, which is more excellent. in corrosion resistance than electro-nickel plating. The term "non-crystalline" atomLe arrangements, but implies the disordered state ol is used herein to include also partial crystallization.
1 i i 1 A As examples of the method of forming the non-crystalline alloy plating layer, there are electro-plating and electroless plating processes. the gold Therefore, even when the thickness of plating layer 30 is set at about 0. 1,/.,m; in other words, even in case the cold plating layer 30 has many pin holes C m 30a formed therein, there is no problem in terms of corrosion resistance. I'hus, it is not necessary to set the thickness of the gold plating layer 30 as thick as 0.6 tto 1.0 m, and also the resultant gold plating 'layer 0 provii g 1 des a corrosion resistance which is nearly equivalent to that of the prior art example (Re.Ler to Fic. 3) whose gold plating
0 c c layer 30 is set in thickness at 0.6 to i.0 r. Wh Ll st this non-crystalline alloy pla':-,ng layer 20 is higher in electric resistance than the electro-nickel plating 'Layer, however, because the gold plating!aver 33 is depos-lted c L on the non-crystalline alloy layer 20, no problems occur at all.
the above-mentioned non-cryst Out of 11alline alloy layers 20, that formed by Ni-51 is produced either by electro-. plating process using, for example, phosphorous acid as 0 c a phosphorous containing additive or by electroless plating process using hypophosphite as a reducing agent, and is composed of 85 to 95 '/"a of Ni and 5 to 115 I1G of P. Further, this Ni-P plating layer has a characteristic property that a the non-crystalline alloy plating layer 20 itself is less in porosity than the elec'L.-o-nickel plating layer (that is, less in the number of pin holes).- Furthermore, those non - crystallIne alloy plating layers formed by Ni-Fe-P, Co-P, Co-Mi-P, and Ni-P-W, respectively, are produced in the same manner either by electro-pla'Ling process using, for example, phosphorous acid as a phosphorous containing additive or by electrol.ess plating process using typophosphite as a reducing agent. Further, that formed by NJ.-B is produced by electtroless platting process using a borohydride compound as a reducina agent, and is composed of 9 to 04 of IN-4, and 6 to 7 ',o of B. In the above-mentioned embodiment, gold plating of terminals for use in connectors has been described, the present invention can be applied allso to gold platting of terminals lor -orlni-ed substrates, and termInalls and contacts for audio equipmen't or the like.
As described hereinabove, according to the present invention, since a noncrystalline alloy plating layer is deposited on the surfac e of a substrate metal intended to have gold plating deposited thereon, and then a gold plating layer is deposited on the non-crysiLtalline alloy plating layer, even when pin holes exist in the gold plating layer, there is no problem Ln terms of corrosion resistance, and also there is no need for depositing gold plating in excess 6 - i 1 of the amount required actually, thus there is no fear of the cost thereof becoming expensive.
It is to be noted that the foregoing description
CD is merely representative of a preferred embodiment oil the invention, and that the invention is not to be limited thereto, but is to be determined by the scope of the appended claims.
Claims (13)
1 11 1. A terminal or contact having gold plating deposited thereon, comprising a non-crystalline alloy plating layer deposited on the surface of a substrate metal, and a gold plating layer deposited on the noncrystalline alloy plating layer.
2. A terminal or contact as claimed in claim 1, wherein said noncrystalline alloy plating layer is Ni-P.
3. A terminal or contact as claimed in claim 1, wherein said noncrystalline alloy plating layer is Ni-B.
4. A terminal or contact as claimed in claim 1, wherein said noncrystalline alloy plating layer is Ni-Fe-P.
5. A terminal or contact as claimed in claim 1, wherein said noncrystalline alloy plating layer is Co-P.
6. A terminal or contact as claimed in claim 1, wherein said noncrystalline alloy plating layer is Ni-P-W 1
7. A terminal or contact as claimed in claim 1, wherein said non- crystalline alloy plating layer is Co-Ni-P.
8. A terminal or contact as claimed in claim 1, whd'rein said noncrystalline alloy plating layer is Co-W.
9. A terminal or contact as claimed in claim 1, wherein said noncrystalline alloy plating layer is Fe-W.
10. A terminal or contact as claimed in claim 1, wherein said noncrystalline alloy plating layer is Co-Re.
11. A terminal or contact as claimed in claim 1, wherein said noncrystalline alloy plating layer is Cr-W.
12. A terminal or contact as claimed in claim 1, wherein said noncrystalline alloy plating layer is Cr-Mo.
13. A terminal or contact substantially as described herein with reference to Figure 1 of the accompanying drawings.
Published 1989 atThe Patent Office, State House, 66.71 High Holbom. LondonWClR 4TP. Further copies maybe obtained from The Patent Office. Sales Branch, St Mazy. Cray, Orpingtor., Kent BR5 3RD. Printed by ILultiplex techniques ltd. St MUT Cray. Kent, Con 1'87
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28941587A JPH01132072A (en) | 1987-11-18 | 1987-11-18 | Gold plated parts of terminal, contact, and the like |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB8826815D0 GB8826815D0 (en) | 1988-12-21 |
| GB2212516A true GB2212516A (en) | 1989-07-26 |
Family
ID=17742945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8826815A Withdrawn GB2212516A (en) | 1987-11-18 | 1988-11-16 | Gold plated terminal or contact |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH01132072A (en) |
| DE (1) | DE3838971A1 (en) |
| GB (1) | GB2212516A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2252669A (en) * | 1991-02-05 | 1992-08-12 | Mitsubishi Electric Corp | Method for manufacturing semiconductor device |
| CN104694928A (en) * | 2009-07-10 | 2015-06-10 | 克斯塔里克公司 | Coated articles and methods |
| US10541189B2 (en) | 2016-12-28 | 2020-01-21 | Denka Company Limited | Heat dissipation component for semiconductor element |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0359972A (en) * | 1989-07-27 | 1991-03-14 | Yazaki Corp | Electrical contact |
| JP3693300B2 (en) * | 1993-09-03 | 2005-09-07 | 日本特殊陶業株式会社 | External connection terminal of semiconductor package and manufacturing method thereof |
| US6039615A (en) * | 1996-03-15 | 2000-03-21 | The Whitaker Corporation | Female electrical terminal having overstress members |
| KR19990066462A (en) * | 1998-01-26 | 1999-08-16 | 윤종용 | Grounding Assembly of the Monitor |
| US6335107B1 (en) * | 1999-09-23 | 2002-01-01 | Lucent Technologies Inc. | Metal article coated with multilayer surface finish for porosity reduction |
| KR20010055949A (en) * | 1999-12-13 | 2001-07-04 | 류정열 | 250 terminal having a emboss structure |
| JP5489049B2 (en) * | 2008-01-28 | 2014-05-14 | 住友電気工業株式会社 | Foil-shaped conductor, wiring member, and manufacturing method of wiring member |
| JP2012043841A (en) * | 2010-08-13 | 2012-03-01 | Murata Mfg Co Ltd | Laminated ceramic electronic component and method of manufacturing the same |
| DE102015220688A1 (en) * | 2015-10-22 | 2017-04-27 | Zf Friedrichshafen Ag | Electrical plug and method of manufacture |
| JP7011142B2 (en) * | 2016-09-30 | 2022-01-26 | 日亜化学工業株式会社 | Manufacturing method of light emitting device, package for light emitting device and light emitting device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2129441A (en) * | 1982-11-05 | 1984-05-16 | Standard Telephones Cables Ltd | Plated electrical contacts |
| EP0160761A1 (en) * | 1984-05-11 | 1985-11-13 | Burlington Industries, Inc. | Amorphous transition metal alloy, thin gold coated, electrical contact |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54111502A (en) * | 1978-02-20 | 1979-08-31 | Inoue Japax Res Inc | Gas evolution by electrolysis of water |
| DE3345162C1 (en) * | 1983-12-14 | 1984-11-15 | Degussa Ag, 6000 Frankfurt | Materials for weak current contacts |
-
1987
- 1987-11-18 JP JP28941587A patent/JPH01132072A/en active Pending
-
1988
- 1988-11-16 GB GB8826815A patent/GB2212516A/en not_active Withdrawn
- 1988-11-18 DE DE3838971A patent/DE3838971A1/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2129441A (en) * | 1982-11-05 | 1984-05-16 | Standard Telephones Cables Ltd | Plated electrical contacts |
| EP0160761A1 (en) * | 1984-05-11 | 1985-11-13 | Burlington Industries, Inc. | Amorphous transition metal alloy, thin gold coated, electrical contact |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2252669A (en) * | 1991-02-05 | 1992-08-12 | Mitsubishi Electric Corp | Method for manufacturing semiconductor device |
| US5272111A (en) * | 1991-02-05 | 1993-12-21 | Mitsubishi Denki Kabushiki Kaisha | Method for manufacturing semiconductor device contact |
| GB2252669B (en) * | 1991-02-05 | 1995-03-22 | Mitsubishi Electric Corp | Method for manufacturing a semiconductor device having gilded contact pads |
| CN104694928A (en) * | 2009-07-10 | 2015-06-10 | 克斯塔里克公司 | Coated articles and methods |
| US9074294B2 (en) | 2009-07-10 | 2015-07-07 | Xtalic Corporation | Coated articles and methods |
| US9765438B2 (en) | 2009-07-10 | 2017-09-19 | Xtalic Corporation | Coated articles and methods |
| US11634831B2 (en) * | 2009-07-10 | 2023-04-25 | Xtalic Corporation | Coated articles |
| US10541189B2 (en) | 2016-12-28 | 2020-01-21 | Denka Company Limited | Heat dissipation component for semiconductor element |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01132072A (en) | 1989-05-24 |
| GB8826815D0 (en) | 1988-12-21 |
| DE3838971C2 (en) | 1991-03-28 |
| DE3838971A1 (en) | 1989-06-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB2212516A (en) | Gold plated terminal or contact | |
| CN100397718C (en) | Press-fit terminal | |
| US6083633A (en) | Multi-layer diffusion barrier for a tin coated electrical connector | |
| US5071518A (en) | Method of making an electrical multilayer interconnect | |
| JP5396139B2 (en) | Press-fit terminal | |
| EP1086807B1 (en) | Metal article coated with multilayer surface finish for porosity reduction | |
| US5733466A (en) | Electrolytic method of depositing gold connectors on a printed circuit board | |
| US4925394A (en) | Ceramic-coated terminal for electrical connection | |
| US20030091855A1 (en) | Plated material, method of producing same, and electrical/electronic part using same | |
| CN103518006A (en) | Corrosion resistant electrical conductor | |
| US4572925A (en) | Printed circuit boards with solderable plating finishes and method of making the same | |
| US9004960B2 (en) | Connector with gold-palladium plated contacts | |
| CN1318644C (en) | Stack structure of electronic apparatus and method for electroless plating of gold | |
| US4895771A (en) | Electrical contact surface coating | |
| US6572420B2 (en) | Electrical contacts with specialized surface treatments | |
| US7233072B2 (en) | Electronic part and surface treatment method of the same | |
| WO1987005057A1 (en) | Electrical contact surface coating | |
| JP4896391B2 (en) | Plating contact and contact plating method | |
| JPS63114083A (en) | Lead frame for connector | |
| JP2003328157A (en) | Plated material, production method thereof and electrical and electronic parts obtained by using the same | |
| JP3161805B2 (en) | Method of forming an electrolytic corrosion resistant surface treatment film | |
| CN111755933A (en) | Method for manufacturing conductive terminal | |
| US5116458A (en) | Electrical edge contact member and a method of manufacturing same | |
| JPS6212189A (en) | Manufacture of printed wiring board | |
| EP0443275B1 (en) | Electrical edge contact member and a method of manufacturing same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |