GB8826815D0 - Gold plated terminal/contact - Google Patents

Gold plated terminal/contact

Info

Publication number
GB8826815D0
GB8826815D0 GB888826815A GB8826815A GB8826815D0 GB 8826815 D0 GB8826815 D0 GB 8826815D0 GB 888826815 A GB888826815 A GB 888826815A GB 8826815 A GB8826815 A GB 8826815A GB 8826815 D0 GB8826815 D0 GB 8826815D0
Authority
GB
United Kingdom
Prior art keywords
contact
gold plated
plated terminal
terminal
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB888826815A
Other versions
GB2212516A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Publication of GB8826815D0 publication Critical patent/GB8826815D0/en
Publication of GB2212516A publication Critical patent/GB2212516A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Contacts (AREA)
  • Non-Insulated Conductors (AREA)
GB8826815A 1987-11-18 1988-11-16 Gold plated terminal or contact Withdrawn GB2212516A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28941587A JPH01132072A (en) 1987-11-18 1987-11-18 Gold plated parts of terminal, contact, and the like

Publications (2)

Publication Number Publication Date
GB8826815D0 true GB8826815D0 (en) 1988-12-21
GB2212516A GB2212516A (en) 1989-07-26

Family

ID=17742945

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8826815A Withdrawn GB2212516A (en) 1987-11-18 1988-11-16 Gold plated terminal or contact

Country Status (3)

Country Link
JP (1) JPH01132072A (en)
DE (1) DE3838971A1 (en)
GB (1) GB2212516A (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0359972A (en) * 1989-07-27 1991-03-14 Yazaki Corp Electrical contact
JP2731040B2 (en) * 1991-02-05 1998-03-25 三菱電機株式会社 Method for manufacturing semiconductor device
JP3693300B2 (en) * 1993-09-03 2005-09-07 日本特殊陶業株式会社 External connection terminal of semiconductor package and manufacturing method thereof
US6039615A (en) * 1996-03-15 2000-03-21 The Whitaker Corporation Female electrical terminal having overstress members
KR19990066462A (en) * 1998-01-26 1999-08-16 윤종용 Grounding Assembly of the Monitor
US6335107B1 (en) * 1999-09-23 2002-01-01 Lucent Technologies Inc. Metal article coated with multilayer surface finish for porosity reduction
KR20010055949A (en) * 1999-12-13 2001-07-04 류정열 250 terminal having a emboss structure
JP5489049B2 (en) * 2008-01-28 2014-05-14 住友電気工業株式会社 Foil-shaped conductor, wiring member, and manufacturing method of wiring member
US8652649B2 (en) * 2009-07-10 2014-02-18 Xtalic Corporation Coated articles and methods
JP2012043841A (en) * 2010-08-13 2012-03-01 Murata Mfg Co Ltd Laminated ceramic electronic component and method of manufacturing the same
DE102015220688A1 (en) * 2015-10-22 2017-04-27 Zf Friedrichshafen Ag Electrical plug and method of manufacture
JP7011142B2 (en) * 2016-09-30 2022-01-26 日亜化学工業株式会社 Manufacturing method of light emitting device, package for light emitting device and light emitting device
JP7000347B2 (en) * 2016-12-28 2022-01-19 デンカ株式会社 Heat dissipation parts for semiconductor devices

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54111502A (en) * 1978-02-20 1979-08-31 Inoue Japax Res Inc Gas evolution by electrolysis of water
GB2129441B (en) * 1982-11-05 1985-12-11 Standard Telephones Cables Ltd Gold plating
DE3345162C1 (en) * 1983-12-14 1984-11-15 Degussa Ag, 6000 Frankfurt Materials for weak current contacts
EP0160761B1 (en) * 1984-05-11 1989-02-08 Burlington Industries, Inc. Amorphous transition metal alloy, thin gold coated, electrical contact

Also Published As

Publication number Publication date
DE3838971C2 (en) 1991-03-28
JPH01132072A (en) 1989-05-24
GB2212516A (en) 1989-07-26
DE3838971A1 (en) 1989-06-01

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)