JPS63114083A - Lead frame for connector - Google Patents
Lead frame for connectorInfo
- Publication number
- JPS63114083A JPS63114083A JP25887086A JP25887086A JPS63114083A JP S63114083 A JPS63114083 A JP S63114083A JP 25887086 A JP25887086 A JP 25887086A JP 25887086 A JP25887086 A JP 25887086A JP S63114083 A JPS63114083 A JP S63114083A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- plating
- connector
- layer
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 52
- 239000010949 copper Substances 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 239000010935 stainless steel Substances 0.000 claims description 12
- 229910001220 stainless steel Inorganic materials 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 36
- 229910000881 Cu alloy Inorganic materials 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000004080 punching Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 4
- 238000005253 cladding Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- -1 and furthermore Chemical compound 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- XTYUEDCPRIMJNG-UHFFFAOYSA-N copper zirconium Chemical compound [Cu].[Zr] XTYUEDCPRIMJNG-UHFFFAOYSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000004881 precipitation hardening Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明はコネクターに使用される導電リードフレームに
関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a conductive lead frame used in a connector.
〈従来の技術〉
プリント基板用、電子機器の接続用等のコネクターは機
械的特性（強度、弾性、加工性等）と導電性とを兼ね備
えていることが必要であり、これを満足する構成材料と
してベリリウム銅合金が優れているため、これが一般的
に広く使用されている。<Conventional technology> Connectors for printed circuit boards, for connecting electronic devices, etc. must have both mechanical properties (strength, elasticity, workability, etc.) and electrical conductivity, and constituent materials that satisfy these requirements are required. As beryllium-copper alloys are excellent, they are generally widely used.
しかし、ベリリウム銅合金は高価でありコネクターの製
造コストが高くなるため、その代替となる材料として種
々の銅合金が開発されているが、未だベリリウム銅合金
より優れた性能を発揮するものはない。However, since beryllium copper alloy is expensive and the manufacturing cost of the connector increases, various copper alloys have been developed as alternative materials, but none yet exhibits superior performance to beryllium copper alloy.
また、上記単一の合金に代えて、ステンレス等のバネ材
料に銅等の金属を被覆したクラツド材が開発されており
、上記ベリリウム銅合金と同様の性能を発揮している。In addition, instead of the single alloy mentioned above, a clad material in which a spring material such as stainless steel is coated with a metal such as copper has been developed, and exhibits the same performance as the beryllium copper alloy described above.
このクラツド材は、例えばステンレス鋼板の両面を銅で
被覆した［：ｕ／ＳＯ５／Ｃｕの３層構造の板材であり
、このクラツド材からコネクター用リードフレームを製
造するには、クラツド材を所望の形状に打抜き加工する
ことにより行われる。この打抜き加工により製造された
コネクター用リードフレームの端子部２の断面を第３図
に示す。同図に示すように、端子部２の上下面は銅層５
により覆われているが、端子部２の側端面６は切断によ
りステンレス３が露出しているため、コネクターとして
使用した場合、導電性が低下する。そのため側端面６の
ステンレス露出部分に銅めっきを施すことも考えられる
が、これではめつき工程が付加され、コネクター用リー
ドフレームの製造工程の複雑化を招く。This cladding material is, for example, a stainless steel plate coated with copper on both sides, and has a three-layer structure of [:u/SO5/Cu. This is done by punching into a shape. FIG. 3 shows a cross section of the terminal portion 2 of the connector lead frame manufactured by this punching process. As shown in the figure, the upper and lower surfaces of the terminal portion 2 are covered with copper layers 5.
However, since the stainless steel 3 is exposed by cutting the side end surface 6 of the terminal portion 2, the conductivity will be reduced when used as a connector. For this reason, it is conceivable to perform copper plating on the exposed stainless steel portion of the side end face 6, but this would add a plating process and complicate the manufacturing process of the connector lead frame.
また、クラツド材は、材料を調質するための熱処理の温
度が高くなるため被覆金属に純銅を用いることはできず
、耐熱型の銅合金（例えばジルコニウム銅等）を用いな
ければならない。そのため導電率を高くすることができ
ず、しかも耐熱型の銅合金は純銅よりも高価であるため
、製造コストが高くなるという欠点がある。Further, for the clad material, pure copper cannot be used as the coating metal because the temperature of the heat treatment for refining the material is high, and a heat-resistant copper alloy (for example, zirconium copper, etc.) must be used. Therefore, it is not possible to increase the electrical conductivity, and heat-resistant copper alloys are more expensive than pure copper, so they have the disadvantage of increasing manufacturing costs.
〈発明が解決しようとする問題点〉
本発明の目的は、上述した従来技術の欠点を解消し、コ
ネクターが機械的特性と導電性とを兼ね備え、製造が簡
単なコネクター用リードフレームを提供することにある
。<Problems to be Solved by the Invention> An object of the present invention is to eliminate the above-mentioned drawbacks of the prior art, provide a lead frame for a connector that has both mechanical properties and conductivity, and is easy to manufacture. It is in.
〈問題点を解決するための手段〉 このような目的は、以下の本発明によって達成される。〈Means for solving problems〉 Such objects are achieved by the present invention as described below.
即ち本発明は、ステンレス等の鉄系のバネ用材料で構成
されるリードフレームに、少なくとも１層の金属めっき
を施したことを特徴とするコネクター用リードフレーム
を提供するものである。That is, the present invention provides a lead frame for a connector, characterized in that the lead frame is made of an iron-based spring material such as stainless steel, and is coated with at least one layer of metal plating.
リードフレームに施す金属めっきは１層でも２層以上で
もよく、好ましくは厚さ１０戸以上の銅めっきを施した
もの、その上層にニッケルめフきを施したもの、更には
その上層に金、銀、錫、半田よりなる群から選ばれた少
なくとも１種の金属を全面または部分的にめっきしたも
のでもよい。The metal plating applied to the lead frame may be one layer or two or more layers, preferably copper plating with a thickness of 10 layers or more, nickel plating on the upper layer, and furthermore gold plating on the upper layer. It may be entirely or partially plated with at least one metal selected from the group consisting of silver, tin, and solder.
そして、バネ用材料はステンレスであるのがよい。The material for the spring is preferably stainless steel.
以下、本発明のコネクター用リードフレームの構成を詳
細に説明する。Hereinafter, the structure of the lead frame for a connector of the present invention will be explained in detail.
本発明のコネクター用リードフレームは、ステンレスの
ような鉄系金属のバネ用材料製の原板に対し、好ましく
はプレス打抜き加工を施して所望のパターン形状のリー
ドフレームを作製し、該リードフレームに少なくとも１
層の金属めっき、好ましくは厚さ１０μｍ以上の銅めっ
きを施したものである。The lead frame for a connector of the present invention is produced by punching a base plate made of a ferrous metal spring material such as stainless steel, preferably by press punching, to produce a lead frame in a desired pattern shape. 1
The layer is plated with metal, preferably copper plating with a thickness of 10 μm or more.
バネ用材料としては、例えばＳＯ５３０４、１７・７Ｐ
Ｈステンレス鋼等析出硬化型のステンレス材を用いるの
が好ましいが、後述する銅めっきを厚さ１０μｍ以上と
する等めっき厚が厚い場合には十分な耐食性が得られる
ため、一般のバネ用鋼材であってもよい。Examples of spring materials include SO5304, 17.7P
It is preferable to use precipitation hardening stainless steel materials such as H stainless steel, but sufficient corrosion resistance can be obtained when the plating thickness is thicker, such as when the copper plating has a thickness of 10 μm or more, which will be described later. There may be.
コネクター用リードフレーム１のパターン形状としては
、例えば第１図に部分的に示すように、複数の端子部２
が並設されているものがある。As for the pattern shape of the lead frame 1 for a connector, for example, as partially shown in FIG.
There are some that are arranged side by side.
このようなパターン形状のリードフレーム１に加工する
手段しては、バネ用材料製原板に対しプレス打抜き加工
を施すのがよいが、材料によってはフォトエツチング等
の他の手段を用いて加工することも可能である。As a means of processing the lead frame 1 in such a pattern shape, it is preferable to perform a press punching process on an original plate made of a spring material, but depending on the material, processing may be performed using other means such as photo etching. is also possible.
本発明のコネクター用リードフレーム１に施される金属
めっきは１層でも２層以上でもよく、また、めっき金属
は以下に示すもの、あるいはその組み合せが可能である
。ただし、本発明における金属めっきは、以下の例示に
限定されるものではない。The metal plating applied to the connector lead frame 1 of the present invention may be one layer or two or more layers, and the plating metal may be the following or a combination thereof. However, the metal plating in the present invention is not limited to the following examples.
（１）１層めっき
リードフレームの全面に銅を厚さ１０μｍ以上めっきす
る。(1) Single-layer plating Copper is plated on the entire surface of the lead frame to a thickness of 10 μm or more.
銅は導電性に優れるため、銅めっきにより機械的特性に
優れたリードフレームに高い導電性を付与することがで
きる。クラツド材では前述のごとく耐熱性を考慮して被
覆金属に純銅を用いることができず、耐熱型銅合金を用
いることを余儀なくされるため、本発明ではクラツド材
よりも高い導電性を得ることができる。Since copper has excellent conductivity, copper plating can impart high conductivity to a lead frame with excellent mechanical properties. As mentioned above, with clad materials, pure copper cannot be used as the coating metal due to heat resistance, and a heat-resistant copper alloy must be used. Therefore, in the present invention, it is not possible to obtain higher conductivity than clad materials. can.
なお、めっき厚を１０μｍ以上とする理由は、厚さ１０
μｍ未満ではコネクターの導電性が低下するからである
。The reason why the plating thickness is 10 μm or more is that the plating thickness is 10 μm or more.
This is because if the thickness is less than μm, the conductivity of the connector decreases.
（２）２層めっき
第１層（下層）：全面鋼めっき（厚さ任意）第２層（上
層）：全面ニッケルめっき
銅めっきの上にニッケルめっきを重ねることにより、銅
の腐食を防止することができる。(2) Two-layer plating 1st layer (lower layer): All-over steel plating (any thickness) 2nd layer (upper layer): All-over nickel plating By layering nickel plating on top of copper plating, copper corrosion is prevented. Can be done.
（３）３層めっき
第１層（下層）：全面鋼めっき（厚さ任意）第２層（中
間層）：全面ニッケルめフき第３層（上層）：全面また
は部分金めっき（４）４層めっき
前記（３）の３層めっきにおける金めつき層（第３層）
の上層に、さらに半田部分めワき（第４層）を施す。(3) Three-layer plating 1st layer (lower layer): Full steel plating (any thickness) 2nd layer (middle layer): Full nickel plating 3rd layer (upper layer): Full or partial gold plating (4) 4 Gold plating layer (third layer) in the three-layer plating described in (3) above
On the top layer, apply a solder grain (fourth layer).
このような各種めっきはコネクターの使用目的に応じて
適宜選択することができるが、いずれの場合でも、第２
図に示すように、バネ用材料３をめっき層４が完全に被
覆しているため、高い導電性を確保することができる。These various platings can be selected as appropriate depending on the intended use of the connector, but in any case, the second
As shown in the figure, since the plating layer 4 completely covers the spring material 3, high conductivity can be ensured.
これに対し、従来めクラツド材を用いたコネクター用リ
ードフレームでは、第３図に示すように、端子部２の側
端面６でステンレス３が露出しているため導電性が劣る
。On the other hand, in the conventional lead frame for a connector using a metal clad material, as shown in FIG. 3, the stainless steel 3 is exposed at the side end surface 6 of the terminal portion 2, so that the conductivity is poor.
なお、本発明のコネクター用リードフレームに施すめっ
きの方法としては電気めっき、溶融めっき等、めっき金
属の種類に応じていずれの方法を採用してもよい。The method for plating the connector lead frame of the present invention may be electroplating, hot-dip plating, or any other method depending on the type of metal to be plated.
このように本発明のコネクター用リードフレーム１はバ
ネ用材料３が機械的特性を担い、これを被覆するめっき
層４が優れた導電性を担うものである。As described above, in the connector lead frame 1 of the present invention, the spring material 3 is responsible for mechanical properties, and the plating layer 4 covering this is responsible for excellent electrical conductivity.
〈実施例〉
（本発明例１）
ＳＯ５３０４の原板にプレス打抜き加工を施して、第１
図に示すパターン形状のコネクター用リードフレームを
作製した。このリードフレームの全面に純銅（ｃｏｎｄ
１００％）を電気めっきした。めっき厚は１０μｍで
あった。<Example> (Example 1 of the present invention) A press punching process was performed on an original sheet of SO5304, and the first
A lead frame for a connector with the pattern shown in the figure was manufactured. The entire surface of this lead frame is made of pure copper (cond).
100%) was electroplated. The plating thickness was 10 μm.
（本発明例２）
本発明例１と同様のリードフレームを作製し、この全面
に純銅を電気めっきし、さらにその上にニッケルを全面
に電気ぬりきした。銅めフきの厚さは１０μｍ、ニッケ
ルめっきの厚さは３μｍであった。(Example 2 of the present invention) A lead frame similar to that of Example 1 of the present invention was produced, and the entire surface of the lead frame was electroplated with pure copper, and furthermore, nickel was electroplated on the entire surface. The thickness of the copper plating was 10 μm, and the thickness of the nickel plating was 3 μm.
（本発明例３）
本発明例２で得たリードフレームのニッケルめっき層の
上に厚さ０．５μｍの金の部分めっきを施した。(Example 3 of the present invention) On the nickel plating layer of the lead frame obtained in Example 2 of the present invention, partial gold plating with a thickness of 0.5 μm was performed.
（本発明例４）
本発明例３で得たリードフレームの金めつき層の上に厚
さ３μｍの半田の部分めっきを施した。(Example 4 of the present invention) The gold plating layer of the lead frame obtained in Example 3 of the present invention was partially plated with solder having a thickness of 3 μm.
（比較例）
Ｃｕ／Ｓｌ］Ｓ／Ｃｕで構成された３層クラツド材にプ
レス打抜き加工を施して、上記本発明例と同様のパター
ン形状のコネクター用リードフレームを作製した。(Comparative Example) A lead frame for a connector having the same pattern shape as the above-mentioned example of the present invention was produced by subjecting a three-layer cladding material composed of Cu/Sl]S/Cu to a press punching process.
上記本発明例１〜４および比較例について、リードフレ
ームの機械的特性（強度、弾性）および導電性を調べた
ところ、本発明例１〜４のコネクター用リードフレーム
は、いずれも機械的特性、導電性共に優れていることが
認められた。When the mechanical properties (strength, elasticity) and conductivity of the lead frames of the above-mentioned Invention Examples 1 to 4 and Comparative Examples were investigated, it was found that the connector lead frames of Invention Examples 1 to 4 had mechanical properties, It was recognized that both conductivity was excellent.
〈発明の効果〉
本発明のコネクター用リードフレームによれば、鉄系の
バネ用材料で構成されるリードフレームに少なくとも１
層の金属めっき、特に厚さ１０μｍ以上の銅めっきを施
したことにより、機械的諸特性に優れかつ導電性の高い
コネクターを得ることができる。<Effects of the Invention> According to the lead frame for a connector of the present invention, at least one
By applying a layer of metal plating, particularly copper plating with a thickness of 10 μm or more, a connector with excellent mechanical properties and high conductivity can be obtained.
さらに、本発明のコネクター用リードフレームは製造工
程が少なく、設備上および材料コスト上から安価に製造
することができるので、大量生産にとって有利である。Furthermore, the connector lead frame of the present invention requires fewer manufacturing steps and can be manufactured at low cost in terms of equipment and material costs, which is advantageous for mass production.
第１図は、本発明のコネクター用リードフレームのパタ
ーン形状の一例を示す部分平面図である。
第２図は、第１図における■−■線での断面図である。
第３図は、従来のクラツド材で構成されるコネクター用
リードフレームの端子部の断面図である。
符号の説明
１・・・コネクター用リードフレーム、２・・・端子部
、
３・・・バネ用材料（ステンレス）、
４・−めっき層、
５・・・銅層、
６・・・側端面
Ｆ Ｉ Ｇ、１FIG. 1 is a partial plan view showing an example of the pattern shape of a lead frame for a connector according to the present invention. FIG. 2 is a sectional view taken along the line ■-■ in FIG. 1. FIG. 3 is a sectional view of a terminal portion of a lead frame for a connector made of a conventional cladding material. Explanation of symbols 1... Lead frame for connector, 2... Terminal part, 3... Spring material (stainless steel), 4... Plating layer, 5... Copper layer, 6... Side end surface F IG, 1
Claims (5)
、少なくとも１層の金属めっきを施したことを特徴とす
るコネクター用リードフレーム。(1) A lead frame for a connector, characterized in that the lead frame is made of an iron-based spring material and is coated with at least one layer of metal plating.
を施したものである特許請求の範囲第１項記載のコネク
ター用リードフレーム。(2) The lead frame for a connector according to claim 1, wherein the metal plating is copper plating with a thickness of 10 μm or more.
ニッケルめっきを施したものである特許請求の範囲第１
項記載のコネクター用リードフレーム。(3) The metal plating is copper plating and nickel plating on top of the copper plating.
Lead frame for the connector described in section.
ニッケルめっきを施し、更にその上層に金、銀、錫およ
び半田よりなる群から選ばれた少なくとも１種の金属を
全面または部分的にめっきしたものである特許請求の範
囲第１項記載のコネクター用リードフレーム。(4) The metal plating is performed by applying copper plating, applying nickel plating on the upper layer, and further applying at least one metal selected from the group consisting of gold, silver, tin, and solder on the entire surface or in part. The lead frame for a connector according to claim 1, which is plated.
囲第１項〜第４項のいずれかに記載のコネクター用リー
ドフレーム。(5) The lead frame for a connector according to any one of claims 1 to 4, wherein the spring material is stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25887086A JPS63114083A (en) | 1986-10-30 | 1986-10-30 | Lead frame for connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25887086A JPS63114083A (en) | 1986-10-30 | 1986-10-30 | Lead frame for connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63114083A true JPS63114083A (en) | 1988-05-18 |
Family
ID=17326181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25887086A Pending JPS63114083A (en) | 1986-10-30 | 1986-10-30 | Lead frame for connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63114083A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06346934A (en) * | 1993-04-16 | 1994-12-20 | Shinko Kosen Kogyo Kk | Steel for chromogenic spring, spring product and manufacture of spring product |
| JPH10134869A (en) * | 1996-10-30 | 1998-05-22 | Yazaki Corp | Terminal material and terminal |
| JP2003147579A (en) * | 2001-11-13 | 2003-05-21 | Yazaki Corp | Terminal |
| JP2010108854A (en) * | 2008-10-31 | 2010-05-13 | Autonetworks Technologies Ltd | Connector |
| JP2018060792A (en) * | 2016-10-07 | 2018-04-12 | ティーイー コネクティビティ ジャーマニー ゲゼルシャフト ミット ベシュレンクテル ハフツンクＴＥ Ｃｏｎｎｅｃｔｉｖｉｔｙ Ｇｅｒｍａｎｙ ＧｍｂＨ | Plug connector |
-
1986
- 1986-10-30 JP JP25887086A patent/JPS63114083A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06346934A (en) * | 1993-04-16 | 1994-12-20 | Shinko Kosen Kogyo Kk | Steel for chromogenic spring, spring product and manufacture of spring product |
| JPH10134869A (en) * | 1996-10-30 | 1998-05-22 | Yazaki Corp | Terminal material and terminal |
| JP2003147579A (en) * | 2001-11-13 | 2003-05-21 | Yazaki Corp | Terminal |
| JP2010108854A (en) * | 2008-10-31 | 2010-05-13 | Autonetworks Technologies Ltd | Connector |
| JP2018060792A (en) * | 2016-10-07 | 2018-04-12 | ティーイー コネクティビティ ジャーマニー ゲゼルシャフト ミット ベシュレンクテル ハフツンクＴＥ Ｃｏｎｎｅｃｔｉｖｉｔｙ Ｇｅｒｍａｎｙ ＧｍｂＨ | Plug connector |
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