GB2190862A - Machining of workpieces made of brittle materials - Google Patents
Machining of workpieces made of brittle materials Download PDFInfo
- Publication number
- GB2190862A GB2190862A GB08711757A GB8711757A GB2190862A GB 2190862 A GB2190862 A GB 2190862A GB 08711757 A GB08711757 A GB 08711757A GB 8711757 A GB8711757 A GB 8711757A GB 2190862 A GB2190862 A GB 2190862A
- Authority
- GB
- United Kingdom
- Prior art keywords
- workpiece
- grinding wheel
- axis
- grinding
- workpiece surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000003754 machining Methods 0.000 title abstract description 12
- 239000000463 material Substances 0.000 title description 7
- 238000000034 method Methods 0.000 claims abstract description 17
- 239000002178 crystalline material Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000013598 vector Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19863616943 DE3616943A1 (de) | 1986-05-20 | 1986-05-20 | Verfahren zur abtragenden bearbeitung von werkstuecken aus sproedbruechigen werkstoffen |
Publications (2)
Publication Number | Publication Date |
---|---|
GB8711757D0 GB8711757D0 (en) | 1987-06-24 |
GB2190862A true GB2190862A (en) | 1987-12-02 |
Family
ID=6301216
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08711757A Withdrawn GB2190862A (en) | 1986-05-20 | 1987-05-19 | Machining of workpieces made of brittle materials |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS6322257A (enrdf_load_stackoverflow) |
KR (1) | KR870010922A (enrdf_load_stackoverflow) |
DE (1) | DE3616943A1 (enrdf_load_stackoverflow) |
FR (1) | FR2598955A1 (enrdf_load_stackoverflow) |
GB (1) | GB2190862A (enrdf_load_stackoverflow) |
IT (1) | IT1207300B (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1990006834A1 (en) * | 1988-12-22 | 1990-06-28 | Falzetti Nicholas T | Sanding machine |
US7018268B2 (en) | 2002-04-09 | 2006-03-28 | Strasbaugh | Protection of work piece during surface processing |
EP1961517A1 (en) * | 2007-02-23 | 2008-08-27 | Atme Menéndez S.L. | Polishing apparatus for concrete specimens |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU4845396A (en) * | 1996-03-04 | 1997-09-22 | Teikoku Denso Co., Ltd. | Resin disk polishing method and apparatus |
DE102022125705A1 (de) * | 2022-10-05 | 2024-04-11 | Atm Qness Gmbh | Teller-Schleif-/Poliergerät |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB238802A (en) * | 1925-03-10 | 1925-08-27 | Arthur John Charles Brookes | Improved method of and apparatus for producing parallel slip and block measuring gauges |
US3699722A (en) * | 1970-11-23 | 1972-10-24 | Radiation Inc | Precision polishing of semiconductor crystal wafers |
GB2124114A (en) * | 1982-05-18 | 1984-02-15 | Mueller Georg Nuernberg | Method and apparatus for the grinding of workpiece |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5414357B2 (enrdf_load_stackoverflow) * | 1972-01-20 | 1979-06-06 |
-
1986
- 1986-05-20 DE DE19863616943 patent/DE3616943A1/de active Granted
-
1987
- 1987-05-11 FR FR8706553A patent/FR2598955A1/fr not_active Withdrawn
- 1987-05-13 IT IT8720490A patent/IT1207300B/it active
- 1987-05-18 JP JP62119138A patent/JPS6322257A/ja active Pending
- 1987-05-19 GB GB08711757A patent/GB2190862A/en not_active Withdrawn
- 1987-05-20 KR KR870004990A patent/KR870010922A/ko not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB238802A (en) * | 1925-03-10 | 1925-08-27 | Arthur John Charles Brookes | Improved method of and apparatus for producing parallel slip and block measuring gauges |
US3699722A (en) * | 1970-11-23 | 1972-10-24 | Radiation Inc | Precision polishing of semiconductor crystal wafers |
GB2124114A (en) * | 1982-05-18 | 1984-02-15 | Mueller Georg Nuernberg | Method and apparatus for the grinding of workpiece |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1990006834A1 (en) * | 1988-12-22 | 1990-06-28 | Falzetti Nicholas T | Sanding machine |
US7018268B2 (en) | 2002-04-09 | 2006-03-28 | Strasbaugh | Protection of work piece during surface processing |
EP1961517A1 (en) * | 2007-02-23 | 2008-08-27 | Atme Menéndez S.L. | Polishing apparatus for concrete specimens |
Also Published As
Publication number | Publication date |
---|---|
IT8720490A0 (it) | 1987-05-13 |
JPS6322257A (ja) | 1988-01-29 |
GB8711757D0 (en) | 1987-06-24 |
FR2598955A1 (fr) | 1987-11-27 |
DE3616943C2 (enrdf_load_stackoverflow) | 1988-08-04 |
IT1207300B (it) | 1989-05-17 |
KR870010922A (ko) | 1987-12-18 |
DE3616943A1 (de) | 1987-11-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4663890A (en) | Method for machining workpieces of brittle hard material into wafers | |
US5351446A (en) | Method and apparatus for the rotary sawing of brittle and hard materials | |
US4896459A (en) | Apparatus for manufacturing thin wafers of hard, non-metallic material such as for use as semiconductor substrates | |
JPH11320356A (ja) | 薄板ワークの平面研削方法およびその研削装置 | |
US6045436A (en) | Process for the material-abrading machining of the edge of a semiconductor wafer | |
GB2190862A (en) | Machining of workpieces made of brittle materials | |
US4881518A (en) | Apparatus for manufacturing and handling thin wafers | |
US5285597A (en) | Method and arrangement for subdividing semiconductor bars into semiconductor wafers | |
NL8301700A (nl) | Slijpwerkwijze en inrichting voor het uitvoeren van de werkwijze alsmede bewerking van werkstukken uit bros-brokkelige materialen. | |
JP3848779B2 (ja) | 内面研削装置 | |
EP0315711A1 (en) | Method and apparatus for machining hard, brittle and difficulty-machineable workpieces | |
GB2149330A (en) | Machining of workpieces consisting of brittle/friable materials | |
JPH0212699B2 (enrdf_load_stackoverflow) | ||
US5291691A (en) | Method and apparatus for dressing an electroplated grinding wheel | |
GB2256822A (en) | Rounding off the edges of semiconductor discs | |
WO2018003429A1 (ja) | ブレードのドレッシング機構及び該機構を備えた切削装置及び該機構を用いたブレードのドレッシング方法 | |
JPS6377647A (ja) | 板状体の研削方法及びその装置 | |
GB2116085A (en) | Grinding machine and method of grinding a workpiece | |
JP2613081B2 (ja) | ウエハ外周部の鏡面研磨方法 | |
JPH03213265A (ja) | ラップ盤の定盤 | |
SU1314400A1 (ru) | Способ резки монокристаллических слитков | |
JPH0115363B2 (enrdf_load_stackoverflow) | ||
JP2762200B2 (ja) | ウエーハ面取部研磨用バフの総形溝加工装置 | |
JPH02185359A (ja) | 研削方法及びその装置 | |
JPS591141A (ja) | 平らな表面の研削方法およびその方法を実施するための装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |