GB2109732B - Wire bonding apparatus for semiconductor device - Google Patents

Wire bonding apparatus for semiconductor device

Info

Publication number
GB2109732B
GB2109732B GB08227326A GB8227326A GB2109732B GB 2109732 B GB2109732 B GB 2109732B GB 08227326 A GB08227326 A GB 08227326A GB 8227326 A GB8227326 A GB 8227326A GB 2109732 B GB2109732 B GB 2109732B
Authority
GB
United Kingdom
Prior art keywords
semiconductor device
wire bonding
bonding apparatus
capillary
ultrasonic horns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08227326A
Other languages
English (en)
Other versions
GB2109732A (en
Inventor
Kenzi Miyazima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Publication of GB2109732A publication Critical patent/GB2109732A/en
Application granted granted Critical
Publication of GB2109732B publication Critical patent/GB2109732B/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
GB08227326A 1981-09-25 1982-09-24 Wire bonding apparatus for semiconductor device Expired GB2109732B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56150769A JPS5852838A (ja) 1981-09-25 1981-09-25 半導体装置のワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
GB2109732A GB2109732A (en) 1983-06-08
GB2109732B true GB2109732B (en) 1985-03-27

Family

ID=15504010

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08227326A Expired GB2109732B (en) 1981-09-25 1982-09-24 Wire bonding apparatus for semiconductor device

Country Status (3)

Country Link
US (1) US4466565A (enExample)
JP (1) JPS5852838A (enExample)
GB (1) GB2109732B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4815001A (en) * 1986-05-30 1989-03-21 Crestek, Inc. Ultrasonic wire bonding quality monitor and method
JP3049526B2 (ja) * 1992-06-23 2000-06-05 株式会社新川 超音波ワイヤボンデイング方法
US5494207A (en) * 1994-05-20 1996-02-27 National Semiconductor Corporation Wire bonder transducer arrangement and method
DE4439470C2 (de) * 1994-11-08 1999-05-20 Herrmann Ultraschalltechnik Vorrichtung zum Ultraschallbearbeiten eines Werkstücks
US5772103A (en) * 1996-09-25 1998-06-30 Hofius, Sr.; David V. Method and apparatus for friction torque welding
US6121716A (en) * 1997-07-11 2000-09-19 The United States Of America As Represented By The United States Department Of Energy Apparatus and method for prevention of cracking in welded brittle alloys
JP3566039B2 (ja) * 1997-07-29 2004-09-15 株式会社新川 ボンディング装置
US6296726B1 (en) 2000-06-13 2001-10-02 Silgan Containers Corporation Method and apparatus for spin welding container closures
JP5930423B2 (ja) * 2014-05-09 2016-06-08 株式会社カイジョー ボンディング装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3212695A (en) * 1962-10-03 1965-10-19 North American Aviation Inc Welding control device
US3357090A (en) * 1963-05-23 1967-12-12 Transitron Electronic Corp Vibratory welding tip and method of welding
SU423592A1 (ru) * 1972-12-07 1974-04-15 Л. Н. Петров Устройство для ультразвуковой сварки

Also Published As

Publication number Publication date
GB2109732A (en) 1983-06-08
JPS6342855B2 (enExample) 1988-08-25
JPS5852838A (ja) 1983-03-29
US4466565A (en) 1984-08-21

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19980924