GB2098001A - A package for a semiconductor chip - Google Patents

A package for a semiconductor chip Download PDF

Info

Publication number
GB2098001A
GB2098001A GB8212795A GB8212795A GB2098001A GB 2098001 A GB2098001 A GB 2098001A GB 8212795 A GB8212795 A GB 8212795A GB 8212795 A GB8212795 A GB 8212795A GB 2098001 A GB2098001 A GB 2098001A
Authority
GB
United Kingdom
Prior art keywords
chip
package
members
power
accordance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB8212795A
Other languages
English (en)
Other versions
GB2098001B (https=
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Publication of GB2098001B publication Critical patent/GB2098001B/en
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB2098001A publication Critical patent/GB2098001A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/475—Capacitors in combination with leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
GB8212795A 1981-05-06 1982-05-04 A package for a semiconductor chip Withdrawn GB2098001A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US26103781A 1981-05-06 1981-05-06

Publications (2)

Publication Number Publication Date
GB2098001B GB2098001B (https=)
GB2098001A true GB2098001A (en) 1982-11-10

Family

ID=22991703

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8212795A Withdrawn GB2098001A (en) 1981-05-06 1982-05-04 A package for a semiconductor chip

Country Status (6)

Country Link
EP (1) EP0077818B1 (https=)
JP (1) JPS58500734A (https=)
CA (1) CA1188010A (https=)
DE (1) DE3279461D1 (https=)
GB (1) GB2098001A (https=)
WO (1) WO1982003947A1 (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4502098A (en) * 1981-02-10 1985-02-26 Brown David F Circuit assembly
EP0164794A3 (en) * 1984-06-14 1987-03-04 Monolithic Memories, Inc. Multi-layer heat sinking integrated circuit package
FR2609841A1 (fr) * 1987-01-20 1988-07-22 Toshiba Kk Dispositif de circuit integre a semi-conducteurs
EP0275973A3 (en) * 1987-01-19 1988-09-14 Sumitomo Electric Industries Limited Integrated circuit package
FR2651373A1 (fr) * 1989-08-28 1991-03-01 Mitsubishi Electric Corp Dispositif a semi-conducteurs a boitier en resine.
RU2331138C1 (ru) * 2006-12-26 2008-08-10 Закрытое акционерное общество "Научно-производственное объединение "НИИТАЛ" (ЗАО "НПО "НИИТАЛ") Корпус интегральной схемы
USD774606S1 (en) * 2013-03-13 2016-12-20 Green Keepers, Inc. Golf tee

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60192359A (ja) * 1984-03-14 1985-09-30 Nec Corp 半導体メモリ装置
DE3424876A1 (de) * 1984-07-06 1986-02-06 Telefunken Fernseh Und Rundfunk Gmbh, 3000 Hannover Integrierter schaltkreis

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3268778A (en) * 1962-08-17 1966-08-23 Fairchild Camera Instr Co Conductive devices and method for making the same
US3554821A (en) * 1967-07-17 1971-01-12 Rca Corp Process for manufacturing microminiature electrical component mounting assemblies
US3535486A (en) * 1968-07-16 1970-10-20 Lucas Industries Ltd Electrical printed circuit assemblies
JPS5332233B1 (https=) * 1968-12-25 1978-09-07
US3713006A (en) * 1971-02-08 1973-01-23 Trw Inc Hybrid transistor
US3728589A (en) * 1971-04-16 1973-04-17 Rca Corp Semiconductor assembly
US3969752A (en) * 1973-12-03 1976-07-13 Power Hybrids, Inc. Hybrid transistor
US3999142A (en) * 1975-11-12 1976-12-21 The United States Of America As Represented By The Secretary Of The Army Variable tuning and feedback on high power microwave transistor carrier amplifier
US4234666A (en) * 1978-07-26 1980-11-18 Western Electric Company, Inc. Carrier tapes for semiconductor devices
US4249196A (en) * 1978-08-21 1981-02-03 Burroughs Corporation Integrated circuit module with integral capacitor
JPS5582454A (en) * 1978-12-15 1980-06-21 Toshiba Corp Container for integrated circuit element
FR2456388A1 (fr) * 1979-05-10 1980-12-05 Thomson Brandt Microboitier de circuit electronique, et circuit hybride comportant un tel microboitier
JPS568854A (en) * 1979-07-04 1981-01-29 Mitsubishi Electric Corp Package for semiconductor device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4502098A (en) * 1981-02-10 1985-02-26 Brown David F Circuit assembly
EP0164794A3 (en) * 1984-06-14 1987-03-04 Monolithic Memories, Inc. Multi-layer heat sinking integrated circuit package
EP0275973A3 (en) * 1987-01-19 1988-09-14 Sumitomo Electric Industries Limited Integrated circuit package
FR2609841A1 (fr) * 1987-01-20 1988-07-22 Toshiba Kk Dispositif de circuit integre a semi-conducteurs
FR2651373A1 (fr) * 1989-08-28 1991-03-01 Mitsubishi Electric Corp Dispositif a semi-conducteurs a boitier en resine.
RU2331138C1 (ru) * 2006-12-26 2008-08-10 Закрытое акционерное общество "Научно-производственное объединение "НИИТАЛ" (ЗАО "НПО "НИИТАЛ") Корпус интегральной схемы
USD774606S1 (en) * 2013-03-13 2016-12-20 Green Keepers, Inc. Golf tee

Also Published As

Publication number Publication date
EP0077818B1 (en) 1989-02-22
CA1188010A (en) 1985-05-28
DE3279461D1 (en) 1989-03-30
JPS58500734A (ja) 1983-05-06
JPH0530069B2 (https=) 1993-05-07
EP0077818A1 (en) 1983-05-04
WO1982003947A1 (en) 1982-11-11
GB2098001B (https=)
EP0077818A4 (en) 1985-04-24

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19940504