DE3279461D1 - A pacakage for a semiconductor chip having a capacitor as an integral part thereof - Google Patents
A pacakage for a semiconductor chip having a capacitor as an integral part thereofInfo
- Publication number
- DE3279461D1 DE3279461D1 DE8282901705T DE3279461T DE3279461D1 DE 3279461 D1 DE3279461 D1 DE 3279461D1 DE 8282901705 T DE8282901705 T DE 8282901705T DE 3279461 T DE3279461 T DE 3279461T DE 3279461 D1 DE3279461 D1 DE 3279461D1
- Authority
- DE
- Germany
- Prior art keywords
- pacakage
- capacitor
- semiconductor chip
- integral part
- integral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49589—Capacitor integral with or on the leadframe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US26103781A | 1981-05-06 | 1981-05-06 | |
PCT/US1982/000530 WO1982003947A1 (en) | 1981-05-06 | 1982-04-26 | A package for a semiconductor chip having a capacitor as an integral part thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3279461D1 true DE3279461D1 (en) | 1989-03-30 |
Family
ID=22991703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8282901705T Expired DE3279461D1 (en) | 1981-05-06 | 1982-04-26 | A pacakage for a semiconductor chip having a capacitor as an integral part thereof |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0077818B1 (de) |
JP (1) | JPS58500734A (de) |
CA (1) | CA1188010A (de) |
DE (1) | DE3279461D1 (de) |
GB (1) | GB2098001A (de) |
WO (1) | WO1982003947A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4502098A (en) * | 1981-02-10 | 1985-02-26 | Brown David F | Circuit assembly |
JPS60192359A (ja) * | 1984-03-14 | 1985-09-30 | Nec Corp | 半導体メモリ装置 |
EP0164794B1 (de) * | 1984-06-14 | 1990-07-25 | Advanced Micro Devices, Inc. | Mehrschicht-Wärmesenkpackung für integrierte Schaltung |
DE3424876A1 (de) * | 1984-07-06 | 1986-02-06 | Telefunken Fernseh Und Rundfunk Gmbh, 3000 Hannover | Integrierter schaltkreis |
JPH088321B2 (ja) * | 1987-01-19 | 1996-01-29 | 住友電気工業株式会社 | 集積回路パツケ−ジ |
US4922324A (en) * | 1987-01-20 | 1990-05-01 | Kabushiki Kaisha Toshiba | Semiconductor integrated circuit device |
JPH0810744B2 (ja) * | 1989-08-28 | 1996-01-31 | 三菱電機株式会社 | 半導体装置 |
USD774606S1 (en) * | 2013-03-13 | 2016-12-20 | Green Keepers, Inc. | Golf tee |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3268778A (en) * | 1962-08-17 | 1966-08-23 | Fairchild Camera Instr Co | Conductive devices and method for making the same |
US3554821A (en) * | 1967-07-17 | 1971-01-12 | Rca Corp | Process for manufacturing microminiature electrical component mounting assemblies |
US3535486A (en) * | 1968-07-16 | 1970-10-20 | Lucas Industries Ltd | Electrical printed circuit assemblies |
JPS5332233B1 (de) * | 1968-12-25 | 1978-09-07 | ||
US3713006A (en) * | 1971-02-08 | 1973-01-23 | Trw Inc | Hybrid transistor |
US3728589A (en) * | 1971-04-16 | 1973-04-17 | Rca Corp | Semiconductor assembly |
US3969752A (en) * | 1973-12-03 | 1976-07-13 | Power Hybrids, Inc. | Hybrid transistor |
US3999142A (en) * | 1975-11-12 | 1976-12-21 | The United States Of America As Represented By The Secretary Of The Army | Variable tuning and feedback on high power microwave transistor carrier amplifier |
US4234666A (en) * | 1978-07-26 | 1980-11-18 | Western Electric Company, Inc. | Carrier tapes for semiconductor devices |
US4249196A (en) * | 1978-08-21 | 1981-02-03 | Burroughs Corporation | Integrated circuit module with integral capacitor |
JPS5582454A (en) * | 1978-12-15 | 1980-06-21 | Toshiba Corp | Container for integrated circuit element |
FR2456388A1 (fr) * | 1979-05-10 | 1980-12-05 | Thomson Brandt | Microboitier de circuit electronique, et circuit hybride comportant un tel microboitier |
JPS568854A (en) * | 1979-07-04 | 1981-01-29 | Mitsubishi Electric Corp | Package for semiconductor device |
-
1982
- 1982-04-22 CA CA000401458A patent/CA1188010A/en not_active Expired
- 1982-04-26 DE DE8282901705T patent/DE3279461D1/de not_active Expired
- 1982-04-26 EP EP19820901705 patent/EP0077818B1/de not_active Expired
- 1982-04-26 WO PCT/US1982/000530 patent/WO1982003947A1/en active IP Right Grant
- 1982-04-26 JP JP50171382A patent/JPS58500734A/ja active Granted
- 1982-05-04 GB GB8212795A patent/GB2098001A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP0077818B1 (de) | 1989-02-22 |
EP0077818A4 (de) | 1985-04-24 |
GB2098001A (en) | 1982-11-10 |
JPS58500734A (ja) | 1983-05-06 |
EP0077818A1 (de) | 1983-05-04 |
GB2098001B (de) | |
WO1982003947A1 (en) | 1982-11-11 |
CA1188010A (en) | 1985-05-28 |
JPH0530069B2 (de) | 1993-05-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3368350D1 (en) | Semiconductor integrated circuit capacitor | |
DE3279013D1 (en) | Semiconductor integrated circuit | |
GB2116389B (en) | A semiconductor memory | |
DE3277758D1 (en) | Semiconductor chip mounting module | |
GB2098396B (en) | A semiconductor memory | |
GB2162398B (en) | A semiconductor memory | |
DE3279429D1 (en) | Semiconductor integrated memory circuit | |
GB2091008B (en) | A semiconductor memory | |
GB2091459B (en) | Semiconductor integrated circuit | |
JPS57141096A (en) | Integrated semiconductor memory | |
DE3272424D1 (en) | Semiconductor integrated circuit | |
GB2127640B (en) | A semiconductor memory | |
DE3264667D1 (en) | Diode for monolithic integrated circuit | |
DE3279461D1 (en) | A pacakage for a semiconductor chip having a capacitor as an integral part thereof | |
DE3264963D1 (en) | Semiconductor integrated circuit | |
GB2127246B (en) | A semiconductor memory | |
JPS57169275A (en) | Single chip integrated circuit | |
GB2117201B (en) | A semiconductor memory | |
JPS57187881A (en) | Connector for integrated circuit package | |
MY8700643A (en) | A semiconductor memory | |
SG87087G (en) | A semiconductor memory | |
JPS57165080A (en) | Device for manufacturing semiconductor integrated circuit |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |