GB1588477A - Prefabricated composite metallic heat-transmitting plate unit - Google Patents

Prefabricated composite metallic heat-transmitting plate unit Download PDF

Info

Publication number
GB1588477A
GB1588477A GB22253/78A GB2225378A GB1588477A GB 1588477 A GB1588477 A GB 1588477A GB 22253/78 A GB22253/78 A GB 22253/78A GB 2225378 A GB2225378 A GB 2225378A GB 1588477 A GB1588477 A GB 1588477A
Authority
GB
United Kingdom
Prior art keywords
heat
copper
plate unit
holes
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB22253/78A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semi-Alloys Inc
Original Assignee
Semi-Alloys Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semi-Alloys Inc filed Critical Semi-Alloys Inc
Publication of GB1588477A publication Critical patent/GB1588477A/en
Expired legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB22253/78A 1977-06-29 1978-05-25 Prefabricated composite metallic heat-transmitting plate unit Expired GB1588477A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US81108477A 1977-06-29 1977-06-29

Publications (1)

Publication Number Publication Date
GB1588477A true GB1588477A (en) 1981-04-23

Family

ID=25205506

Family Applications (1)

Application Number Title Priority Date Filing Date
GB22253/78A Expired GB1588477A (en) 1977-06-29 1978-05-25 Prefabricated composite metallic heat-transmitting plate unit

Country Status (7)

Country Link
JP (1) JPS5412569A (https=)
CA (1) CA1083263A (https=)
DE (1) DE2826252A1 (https=)
FR (1) FR2396263A1 (https=)
GB (1) GB1588477A (https=)
IT (1) IT1105422B (https=)
NL (1) NL7806751A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2280062A (en) * 1993-07-12 1995-01-18 Korea Electronics Telecomm Method of packaging a power semiconductor device and package produced by the method

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4283464A (en) * 1979-05-08 1981-08-11 Norman Hascoe Prefabricated composite metallic heat-transmitting plate unit
SE420964B (sv) * 1980-03-27 1981-11-09 Asea Ab Kompositmaterial och sett for dess framstellning
US4427993A (en) * 1980-11-21 1984-01-24 General Electric Company Thermal stress relieving bimetallic plate
US4396936A (en) * 1980-12-29 1983-08-02 Honeywell Information Systems, Inc. Integrated circuit chip package with improved cooling means
FR2511193A1 (fr) * 1981-08-07 1983-02-11 Thomson Csf Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique
US5039335A (en) * 1988-10-21 1991-08-13 Texas Instruments Incorporated Composite material for a circuit system and method of making
CA1316303C (en) * 1988-12-23 1993-04-20 Thijs Eerkes Composite structure
JPH02231751A (ja) * 1989-03-03 1990-09-13 Sumitomo Special Metals Co Ltd リードフレーム用材料
US5310520A (en) * 1993-01-29 1994-05-10 Texas Instruments Incorporated Circuit system, a composite material for use therein, and a method of making the material
JP2000503489A (ja) * 1996-11-08 2000-03-21 ダブリュ．エル．ゴア アンド アソシエイツ，インコーポレイティド 熱膨張率をコントロールするための銅層に形成された可変的穿孔密度の使用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE533745A (https=) * 1953-11-30
US3296501A (en) * 1962-11-07 1967-01-03 Westinghouse Electric Corp Metallic ceramic composite contacts for semiconductor devices
GB1004020A (en) * 1964-04-24 1965-09-08 Standard Telephones Cables Ltd Improvements in or relating to the mounting of electrical components
US3368112A (en) * 1964-12-18 1968-02-06 Navy Usa Shielding of electrical circuits by metal deposition
US3928907A (en) * 1971-11-18 1975-12-30 John Chisholm Method of making thermal attachment to porous metal surfaces
JPS5039065A (https=) * 1973-08-08 1975-04-10
FR2305025A1 (fr) * 1975-03-21 1976-10-15 Thomson Csf Element de liaison reliant un dispositif semi-conducteur a son support et dispositif comportant un tel element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2280062A (en) * 1993-07-12 1995-01-18 Korea Electronics Telecomm Method of packaging a power semiconductor device and package produced by the method
GB2280062B (en) * 1993-07-12 1997-04-09 Korea Electronics Telecomm Method of packaging a power semiconductor device and package produced by the method

Also Published As

Publication number Publication date
IT1105422B (it) 1985-11-04
NL7806751A (nl) 1979-01-03
FR2396263B1 (https=) 1984-04-13
FR2396263A1 (fr) 1979-01-26
JPS5412569A (en) 1979-01-30
DE2826252A1 (de) 1979-01-04
CA1083263A (en) 1980-08-05
IT7849996A0 (it) 1978-06-22

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee