GB1570824A - Process for providing openings or shapings in ceramic substrates by laser - Google Patents

Process for providing openings or shapings in ceramic substrates by laser Download PDF

Info

Publication number
GB1570824A
GB1570824A GB8206/77A GB820677A GB1570824A GB 1570824 A GB1570824 A GB 1570824A GB 8206/77 A GB8206/77 A GB 8206/77A GB 820677 A GB820677 A GB 820677A GB 1570824 A GB1570824 A GB 1570824A
Authority
GB
United Kingdom
Prior art keywords
laser
substrate
shapings
wafer
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8206/77A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
VALFIVRE SpA
Original Assignee
VALFIVRE SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by VALFIVRE SpA filed Critical VALFIVRE SpA
Publication of GB1570824A publication Critical patent/GB1570824A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
GB8206/77A 1976-02-27 1977-02-25 Process for providing openings or shapings in ceramic substrates by laser Expired GB1570824A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT20681/76A IT1124751B (it) 1976-02-27 1976-02-27 Procedimento per ottenere aperture o sagomature in substrati ceramici mediante laser

Publications (1)

Publication Number Publication Date
GB1570824A true GB1570824A (en) 1980-07-09

Family

ID=11170469

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8206/77A Expired GB1570824A (en) 1976-02-27 1977-02-25 Process for providing openings or shapings in ceramic substrates by laser

Country Status (6)

Country Link
BE (1) BE851898A (de)
CH (1) CH614150A5 (de)
DE (1) DE2708465A1 (de)
GB (1) GB1570824A (de)
IT (1) IT1124751B (de)
NL (1) NL7702144A (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3446589A1 (de) * 1983-12-28 1985-07-11 René Marly le Roi Lefevre Verfahren zum herstellen von piezoelektrischen miniaturbauelementen mit hilfe von laser-bearbeitung
GB2151978A (en) * 1983-12-29 1985-07-31 Toshiba Ceramics Co Method of and apparatus for machining a ceramic member
GB2162122A (en) * 1984-05-18 1986-01-29 Maschf Augsburg Nuernberg Ag A method of enhancing an ice-breaking operation

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2687596A1 (fr) * 1992-02-26 1993-08-27 Souriau & Cie Procede de percage d'une virole pour fibre optique.

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3446589A1 (de) * 1983-12-28 1985-07-11 René Marly le Roi Lefevre Verfahren zum herstellen von piezoelektrischen miniaturbauelementen mit hilfe von laser-bearbeitung
GB2152281A (en) * 1983-12-28 1985-07-31 Rene Lefevre Process for producing miniature piezoelectric devices using laser machining and devices obtained by this process
GB2151978A (en) * 1983-12-29 1985-07-31 Toshiba Ceramics Co Method of and apparatus for machining a ceramic member
GB2162122A (en) * 1984-05-18 1986-01-29 Maschf Augsburg Nuernberg Ag A method of enhancing an ice-breaking operation

Also Published As

Publication number Publication date
NL7702144A (nl) 1977-08-30
DE2708465A1 (de) 1977-09-01
CH614150A5 (en) 1979-11-15
IT1124751B (it) 1986-05-14
BE851898A (fr) 1977-06-16

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee