IT1124751B - Procedimento per ottenere aperture o sagomature in substrati ceramici mediante laser - Google Patents

Procedimento per ottenere aperture o sagomature in substrati ceramici mediante laser

Info

Publication number
IT1124751B
IT1124751B IT20681/76A IT2068176A IT1124751B IT 1124751 B IT1124751 B IT 1124751B IT 20681/76 A IT20681/76 A IT 20681/76A IT 2068176 A IT2068176 A IT 2068176A IT 1124751 B IT1124751 B IT 1124751B
Authority
IT
Italy
Prior art keywords
shaping
laser
procedure
ceramic substrates
openings
Prior art date
Application number
IT20681/76A
Other languages
English (en)
Inventor
Gianfranco Cirri
Original Assignee
Magneti Marelli Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Magneti Marelli Spa filed Critical Magneti Marelli Spa
Priority to IT20681/76A priority Critical patent/IT1124751B/it
Priority to GB8206/77A priority patent/GB1570824A/en
Priority to CH243177A priority patent/CH614150A5/xx
Priority to DE19772708465 priority patent/DE2708465A1/de
Priority to NL7702144A priority patent/NL7702144A/xx
Priority to BE175321A priority patent/BE851898A/xx
Priority to US05/861,707 priority patent/US4169976A/en
Application granted granted Critical
Publication of IT1124751B publication Critical patent/IT1124751B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
IT20681/76A 1976-02-27 1976-02-27 Procedimento per ottenere aperture o sagomature in substrati ceramici mediante laser IT1124751B (it)

Priority Applications (7)

Application Number Priority Date Filing Date Title
IT20681/76A IT1124751B (it) 1976-02-27 1976-02-27 Procedimento per ottenere aperture o sagomature in substrati ceramici mediante laser
GB8206/77A GB1570824A (en) 1976-02-27 1977-02-25 Process for providing openings or shapings in ceramic substrates by laser
CH243177A CH614150A5 (en) 1976-02-27 1977-02-25 Process for obtaining openings or outlines in ceramic substrates by laser
DE19772708465 DE2708465A1 (de) 1976-02-27 1977-02-26 Verfahren zur bildung von oeffnungen oder ausnehmungen in keramischen unterlagen
NL7702144A NL7702144A (nl) 1976-02-27 1977-02-28 Werkwijze voor het vormen van openingen of pro- fielen in een keramisch substraat.
BE175321A BE851898A (fr) 1976-02-27 1977-02-28 Procede d'obtention d'ouvertures ou de profils dans des substrats ceramiques au moyen d'un laser
US05/861,707 US4169976A (en) 1976-02-27 1977-12-19 Process for cutting or shaping of a substrate by laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT20681/76A IT1124751B (it) 1976-02-27 1976-02-27 Procedimento per ottenere aperture o sagomature in substrati ceramici mediante laser

Publications (1)

Publication Number Publication Date
IT1124751B true IT1124751B (it) 1986-05-14

Family

ID=11170469

Family Applications (1)

Application Number Title Priority Date Filing Date
IT20681/76A IT1124751B (it) 1976-02-27 1976-02-27 Procedimento per ottenere aperture o sagomature in substrati ceramici mediante laser

Country Status (6)

Country Link
BE (1) BE851898A (it)
CH (1) CH614150A5 (it)
DE (1) DE2708465A1 (it)
GB (1) GB1570824A (it)
IT (1) IT1124751B (it)
NL (1) NL7702144A (it)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2557732B1 (fr) * 1983-12-28 1986-04-11 Lefevre Rene Procede de realisation de dispositifs piezoelectriques miniatures utilisant un usinage par laser et dispositifs obtenus par ce procede
US4650619A (en) * 1983-12-29 1987-03-17 Toshiba Ceramics Co., Ltd. Method of machining a ceramic member
DE3433961A1 (de) * 1984-05-18 1985-11-21 M.A.N. Maschinenfabrik Augsburg-Nürnberg AG, 8000 München Verfahren zum unterstuetzen eines eisbrechvorganges
FR2687596A1 (fr) * 1992-02-26 1993-08-27 Souriau & Cie Procede de percage d'une virole pour fibre optique.

Also Published As

Publication number Publication date
NL7702144A (nl) 1977-08-30
BE851898A (fr) 1977-06-16
GB1570824A (en) 1980-07-09
DE2708465A1 (de) 1977-09-01
CH614150A5 (en) 1979-11-15

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