CH614150A5 - Process for obtaining openings or outlines in ceramic substrates by laser - Google Patents

Process for obtaining openings or outlines in ceramic substrates by laser

Info

Publication number
CH614150A5
CH614150A5 CH243177A CH243177A CH614150A5 CH 614150 A5 CH614150 A5 CH 614150A5 CH 243177 A CH243177 A CH 243177A CH 243177 A CH243177 A CH 243177A CH 614150 A5 CH614150 A5 CH 614150A5
Authority
CH
Switzerland
Prior art keywords
outlines
laser
ceramic substrates
openings
obtaining
Prior art date
Application number
CH243177A
Other languages
English (en)
Inventor
Gianfranco Cirri
Original Assignee
Valfivre Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valfivre Spa filed Critical Valfivre Spa
Publication of CH614150A5 publication Critical patent/CH614150A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
CH243177A 1976-02-27 1977-02-25 Process for obtaining openings or outlines in ceramic substrates by laser CH614150A5 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT20681/76A IT1124751B (it) 1976-02-27 1976-02-27 Procedimento per ottenere aperture o sagomature in substrati ceramici mediante laser

Publications (1)

Publication Number Publication Date
CH614150A5 true CH614150A5 (en) 1979-11-15

Family

ID=11170469

Family Applications (1)

Application Number Title Priority Date Filing Date
CH243177A CH614150A5 (en) 1976-02-27 1977-02-25 Process for obtaining openings or outlines in ceramic substrates by laser

Country Status (6)

Country Link
BE (1) BE851898A (de)
CH (1) CH614150A5 (de)
DE (1) DE2708465A1 (de)
GB (1) GB1570824A (de)
IT (1) IT1124751B (de)
NL (1) NL7702144A (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2557732B1 (fr) * 1983-12-28 1986-04-11 Lefevre Rene Procede de realisation de dispositifs piezoelectriques miniatures utilisant un usinage par laser et dispositifs obtenus par ce procede
US4650619A (en) * 1983-12-29 1987-03-17 Toshiba Ceramics Co., Ltd. Method of machining a ceramic member
DE3433961A1 (de) * 1984-05-18 1985-11-21 M.A.N. Maschinenfabrik Augsburg-Nürnberg AG, 8000 München Verfahren zum unterstuetzen eines eisbrechvorganges
FR2687596A1 (fr) * 1992-02-26 1993-08-27 Souriau & Cie Procede de percage d'une virole pour fibre optique.

Also Published As

Publication number Publication date
GB1570824A (en) 1980-07-09
NL7702144A (nl) 1977-08-30
DE2708465A1 (de) 1977-09-01
IT1124751B (it) 1986-05-14
BE851898A (fr) 1977-06-16

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Legal Events

Date Code Title Description
PL Patent ceased