GB1531826A - Article comprising a resinous surface and an electrolessly formed metal layer firmly adhered to at least a portion of said surface - Google Patents

Article comprising a resinous surface and an electrolessly formed metal layer firmly adhered to at least a portion of said surface

Info

Publication number
GB1531826A
GB1531826A GB30744/76A GB3074476A GB1531826A GB 1531826 A GB1531826 A GB 1531826A GB 30744/76 A GB30744/76 A GB 30744/76A GB 3074476 A GB3074476 A GB 3074476A GB 1531826 A GB1531826 A GB 1531826A
Authority
GB
United Kingdom
Prior art keywords
phase
article
metal layer
formed metal
firmly adhered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB30744/76A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of GB1531826A publication Critical patent/GB1531826A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L13/00—Compositions of rubbers containing carboxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
GB30744/76A 1975-07-25 1976-07-23 Article comprising a resinous surface and an electrolessly formed metal layer firmly adhered to at least a portion of said surface Expired GB1531826A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US59877075A 1975-07-25 1975-07-25

Publications (1)

Publication Number Publication Date
GB1531826A true GB1531826A (en) 1978-11-08

Family

ID=24396845

Family Applications (1)

Application Number Title Priority Date Filing Date
GB30744/76A Expired GB1531826A (en) 1975-07-25 1976-07-23 Article comprising a resinous surface and an electrolessly formed metal layer firmly adhered to at least a portion of said surface

Country Status (13)

Country Link
JP (1) JPS5953295B2 (it)
AT (1) AT362008B (it)
AU (1) AU503695B2 (it)
CA (1) CA1077643A (it)
CH (1) CH636631A5 (it)
DE (1) DE2633094B2 (it)
FR (1) FR2333024A1 (it)
GB (1) GB1531826A (it)
IL (1) IL50093A (it)
IT (1) IT1066020B (it)
NL (1) NL185935C (it)
SE (1) SE7608413L (it)
ZA (1) ZA763010B (it)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2200122A (en) * 1987-01-14 1988-07-27 Kollmorgen Corp Bonding compositions for printed circuit boards
GB2224739A (en) * 1988-08-30 1990-05-16 Japan Synthetic Rubber Co Ltd Modified epoxy compositions

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2809917B1 (de) * 1978-03-08 1979-07-26 Dynamit Nobel Ag Basismaterial zum Herstellen gedruckter Schaltungen nach Additivverfahren und Verfahren zum Herstellen desselben
DE2828288C2 (de) * 1978-06-28 1982-04-15 Dynamit Nobel Ag, 5210 Troisdorf Verfahren zur Herstellung von Basismaterial für gedruckte Schaltungen
US4797508A (en) * 1986-09-19 1989-01-10 Firan Corporation Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
JP4722954B2 (ja) * 2008-03-17 2011-07-13 イビデン株式会社 プリント配線板用接着剤および、プリント配線板用接着剤層の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT310285B (de) * 1966-02-22 1973-09-25 Photocircuits Corp Verfahren zur Herstellung eines Schichtkörpers für gedruckte Schaltungen
DE1790293B2 (de) * 1966-02-22 1973-12-13 Photocircuits Corp., Glen Cove, N.Y. (V.St.A.) Verfahren zur Herstellung von ge druckten Schaltungen Ausscheidung aus 1665314

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2200122A (en) * 1987-01-14 1988-07-27 Kollmorgen Corp Bonding compositions for printed circuit boards
GB2200122B (en) * 1987-01-14 1990-10-17 Kollmorgen Corp Bonding compositions for the manufacture of additive printed wiring boards and articles made with the bonding composition
GB2224739A (en) * 1988-08-30 1990-05-16 Japan Synthetic Rubber Co Ltd Modified epoxy compositions
GB2224739B (en) * 1988-08-30 1992-09-23 Japan Synthetic Rubber Co Ltd Modified epoxy composition

Also Published As

Publication number Publication date
ZA763010B (en) 1977-04-27
SE7608413L (sv) 1977-01-26
AU1525576A (en) 1978-01-05
IL50093A0 (en) 1976-09-30
AU503695B2 (en) 1979-09-13
NL185935B (nl) 1990-03-16
JPS5215569A (en) 1977-02-05
JPS5953295B2 (ja) 1984-12-24
AT362008B (de) 1981-04-27
IL50093A (en) 1980-01-31
ATA545376A (de) 1980-09-15
CA1077643A (en) 1980-05-13
FR2333024B1 (it) 1979-05-25
DE2633094B2 (de) 1979-08-30
CH636631A5 (en) 1983-06-15
FR2333024A1 (fr) 1977-06-24
IT1066020B (it) 1985-03-04
DE2633094A1 (de) 1977-01-27
NL185935C (nl) 1990-08-16
DE2633094C3 (it) 1987-02-12
NL7608242A (nl) 1977-01-27

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19930723