GB1492447A - Semiconductor devices - Google Patents

Semiconductor devices

Info

Publication number
GB1492447A
GB1492447A GB21385/75A GB2138575A GB1492447A GB 1492447 A GB1492447 A GB 1492447A GB 21385/75 A GB21385/75 A GB 21385/75A GB 2138575 A GB2138575 A GB 2138575A GB 1492447 A GB1492447 A GB 1492447A
Authority
GB
United Kingdom
Prior art keywords
zone
layer
photo
layers
oxide layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB21385/75A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19742435905 external-priority patent/DE2435905C3/de
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of GB1492447A publication Critical patent/GB1492447A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D10/00Bipolar junction transistors [BJT]
    • H10D10/40Vertical BJTs
    • H10D10/441Vertical BJTs having an emitter-base junction ending at a main surface of the body and a base-collector junction ending at a lateral surface of the body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105After-treatment
    • H01L21/311Etching the insulating layers by chemical or physical means
    • H01L21/31105Etching inorganic layers
    • H01L21/31111Etching inorganic layers by chemical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Bipolar Transistors (AREA)
GB21385/75A 1974-07-25 1975-05-20 Semiconductor devices Expired GB1492447A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19742435905 DE2435905C3 (de) 1974-07-25 Verfahren zum Herstellen einer Halbleiteranordnung

Publications (1)

Publication Number Publication Date
GB1492447A true GB1492447A (en) 1977-11-16

Family

ID=5921549

Family Applications (1)

Application Number Title Priority Date Filing Date
GB21385/75A Expired GB1492447A (en) 1974-07-25 1975-05-20 Semiconductor devices

Country Status (6)

Country Link
US (1) US3963524A (enExample)
JP (1) JPS5140773A (enExample)
CA (1) CA1070028A (enExample)
FR (1) FR2280201A1 (enExample)
GB (1) GB1492447A (enExample)
IT (1) IT1039921B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2117969A (en) * 1982-01-25 1983-10-19 Hitachi Ltd Method of fabricating semiconductor integrated circuit devices

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4143455A (en) * 1976-03-11 1979-03-13 Siemens Aktiengesellschaft Method of producing a semiconductor component
JPS5367383A (en) * 1976-08-08 1978-06-15 Fairchild Camera Instr Co Method of producing small ic implantation logic semiconductor
JPS6035818B2 (ja) * 1976-09-22 1985-08-16 日本電気株式会社 半導体装置の製造方法
US4135954A (en) * 1977-07-12 1979-01-23 International Business Machines Corporation Method for fabricating self-aligned semiconductor devices utilizing selectively etchable masking layers
US4233934A (en) * 1978-12-07 1980-11-18 General Electric Company Guard ring for TGZM processing
JPS6028135B2 (ja) * 1979-05-18 1985-07-03 富士通株式会社 半導体装置の製造方法
JPS58108737A (ja) * 1982-11-15 1983-06-28 Nec Corp 半導体装置の製造方法
IT1231913B (it) * 1987-10-23 1992-01-15 Sgs Microelettronica Spa Procedimento di fabbricazione di transistori ad alta frequenza.

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3979768A (en) * 1966-03-23 1976-09-07 Hitachi, Ltd. Semiconductor element having surface coating comprising silicon nitride and silicon oxide films
BE759667A (fr) * 1969-12-01 1971-06-01 Philips Nv Procede permettant la fabrication d'un dispositif semiconducteur, et dispositif semiconducteur obtenu par la mise en oeuvre de ce procede
GB1332931A (en) * 1970-01-15 1973-10-10 Mullard Ltd Methods of manufacturing a semiconductor device
US3756861A (en) * 1972-03-13 1973-09-04 Bell Telephone Labor Inc Bipolar transistors and method of manufacture
US3793088A (en) * 1972-11-15 1974-02-19 Bell Telephone Labor Inc Compatible pnp and npn devices in an integrated circuit
US3898105A (en) * 1973-10-25 1975-08-05 Mostek Corp Method for making FET circuits

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2117969A (en) * 1982-01-25 1983-10-19 Hitachi Ltd Method of fabricating semiconductor integrated circuit devices
US4469535A (en) * 1982-01-25 1984-09-04 Hitachi, Ltd. Method of fabricating semiconductor integrated circuit devices

Also Published As

Publication number Publication date
FR2280201A1 (fr) 1976-02-20
DE2435905B2 (de) 1976-08-26
JPS5140773A (en) 1976-04-05
DE2435905A1 (de) 1976-02-05
FR2280201B1 (enExample) 1983-03-18
CA1070028A (en) 1980-01-15
US3963524A (en) 1976-06-15
IT1039921B (it) 1979-12-10

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee