GB1492447A - Semiconductor devices - Google Patents
Semiconductor devicesInfo
- Publication number
- GB1492447A GB1492447A GB21385/75A GB2138575A GB1492447A GB 1492447 A GB1492447 A GB 1492447A GB 21385/75 A GB21385/75 A GB 21385/75A GB 2138575 A GB2138575 A GB 2138575A GB 1492447 A GB1492447 A GB 1492447A
- Authority
- GB
- United Kingdom
- Prior art keywords
- zone
- layer
- photo
- layers
- oxide layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- 239000013078 crystal Substances 0.000 abstract 3
- 238000005530 etching Methods 0.000 abstract 3
- 239000004922 lacquer Substances 0.000 abstract 3
- 150000004767 nitrides Chemical class 0.000 abstract 2
- 230000001590 oxidative effect Effects 0.000 abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 229910052581 Si3N4 Inorganic materials 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 238000005468 ion implantation Methods 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D10/00—Bipolar junction transistors [BJT]
- H10D10/40—Vertical BJTs
- H10D10/441—Vertical BJTs having an emitter-base junction ending at a main surface of the body and a base-collector junction ending at a lateral surface of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19742435905 DE2435905C3 (de) | 1974-07-25 | Verfahren zum Herstellen einer Halbleiteranordnung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1492447A true GB1492447A (en) | 1977-11-16 |
Family
ID=5921549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB21385/75A Expired GB1492447A (en) | 1974-07-25 | 1975-05-20 | Semiconductor devices |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3963524A (enExample) |
| JP (1) | JPS5140773A (enExample) |
| CA (1) | CA1070028A (enExample) |
| FR (1) | FR2280201A1 (enExample) |
| GB (1) | GB1492447A (enExample) |
| IT (1) | IT1039921B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2117969A (en) * | 1982-01-25 | 1983-10-19 | Hitachi Ltd | Method of fabricating semiconductor integrated circuit devices |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4143455A (en) * | 1976-03-11 | 1979-03-13 | Siemens Aktiengesellschaft | Method of producing a semiconductor component |
| JPS5367383A (en) * | 1976-08-08 | 1978-06-15 | Fairchild Camera Instr Co | Method of producing small ic implantation logic semiconductor |
| JPS6035818B2 (ja) * | 1976-09-22 | 1985-08-16 | 日本電気株式会社 | 半導体装置の製造方法 |
| US4135954A (en) * | 1977-07-12 | 1979-01-23 | International Business Machines Corporation | Method for fabricating self-aligned semiconductor devices utilizing selectively etchable masking layers |
| US4233934A (en) * | 1978-12-07 | 1980-11-18 | General Electric Company | Guard ring for TGZM processing |
| JPS6028135B2 (ja) * | 1979-05-18 | 1985-07-03 | 富士通株式会社 | 半導体装置の製造方法 |
| JPS58108737A (ja) * | 1982-11-15 | 1983-06-28 | Nec Corp | 半導体装置の製造方法 |
| IT1231913B (it) * | 1987-10-23 | 1992-01-15 | Sgs Microelettronica Spa | Procedimento di fabbricazione di transistori ad alta frequenza. |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3979768A (en) * | 1966-03-23 | 1976-09-07 | Hitachi, Ltd. | Semiconductor element having surface coating comprising silicon nitride and silicon oxide films |
| BE759667A (fr) * | 1969-12-01 | 1971-06-01 | Philips Nv | Procede permettant la fabrication d'un dispositif semiconducteur, et dispositif semiconducteur obtenu par la mise en oeuvre de ce procede |
| GB1332931A (en) * | 1970-01-15 | 1973-10-10 | Mullard Ltd | Methods of manufacturing a semiconductor device |
| US3756861A (en) * | 1972-03-13 | 1973-09-04 | Bell Telephone Labor Inc | Bipolar transistors and method of manufacture |
| US3793088A (en) * | 1972-11-15 | 1974-02-19 | Bell Telephone Labor Inc | Compatible pnp and npn devices in an integrated circuit |
| US3898105A (en) * | 1973-10-25 | 1975-08-05 | Mostek Corp | Method for making FET circuits |
-
1975
- 1975-05-20 GB GB21385/75A patent/GB1492447A/en not_active Expired
- 1975-06-18 CA CA229,648A patent/CA1070028A/en not_active Expired
- 1975-07-09 US US05/594,341 patent/US3963524A/en not_active Expired - Lifetime
- 1975-07-18 IT IT25538/75A patent/IT1039921B/it active
- 1975-07-23 FR FR7522979A patent/FR2280201A1/fr active Granted
- 1975-07-25 JP JP50091009A patent/JPS5140773A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2117969A (en) * | 1982-01-25 | 1983-10-19 | Hitachi Ltd | Method of fabricating semiconductor integrated circuit devices |
| US4469535A (en) * | 1982-01-25 | 1984-09-04 | Hitachi, Ltd. | Method of fabricating semiconductor integrated circuit devices |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2280201A1 (fr) | 1976-02-20 |
| DE2435905B2 (de) | 1976-08-26 |
| JPS5140773A (en) | 1976-04-05 |
| DE2435905A1 (de) | 1976-02-05 |
| FR2280201B1 (enExample) | 1983-03-18 |
| CA1070028A (en) | 1980-01-15 |
| US3963524A (en) | 1976-06-15 |
| IT1039921B (it) | 1979-12-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |