GB1491570A - Fluid cooling systems for electrical components - Google Patents

Fluid cooling systems for electrical components

Info

Publication number
GB1491570A
GB1491570A GB1034477A GB1034477A GB1491570A GB 1491570 A GB1491570 A GB 1491570A GB 1034477 A GB1034477 A GB 1034477A GB 1034477 A GB1034477 A GB 1034477A GB 1491570 A GB1491570 A GB 1491570A
Authority
GB
United Kingdom
Prior art keywords
fluid cooling
electrical components
cooling systems
connector
passage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1034477A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of GB1491570A publication Critical patent/GB1491570A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L37/00—Couplings of the quick-acting type
    • F16L37/28—Couplings of the quick-acting type with fluid cut-off means
    • F16L37/30—Couplings of the quick-acting type with fluid cut-off means with fluid cut-off means in each of two pipe-end fittings
    • F16L37/32—Couplings of the quick-acting type with fluid cut-off means with fluid cut-off means in each of two pipe-end fittings at least one of two lift valves being opened automatically when the coupling is applied
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

1491570 Pipe couplings AMP Inc 18 Oct 1975 10344/77 Divided out of 1491569 Heading F2G [Also in Divisions H1 and H2] The subject-matter of this Specification is identical with that of the parent Specification, but the claims relate to an electrical connector assembly for a closed fluid cooling system for electronic apparatus, comprising two matable connectors each including an insulating housing, an electrical contact in a passage in the housing for engaging the corresponding contact of the other connector, and a coupling in a passage for co-operating with a substantially identical coupling in the other connector to permit fluid to flow through the connectors when they are mated together.
GB1034477A 1975-10-18 1975-10-18 Fluid cooling systems for electrical components Expired GB1491570A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4288275A GB1491569A (en) 1975-10-18 1975-10-18 Fluid cooling systems for electrical components

Publications (1)

Publication Number Publication Date
GB1491570A true GB1491570A (en) 1977-11-09

Family

ID=10426376

Family Applications (2)

Application Number Title Priority Date Filing Date
GB4288275A Expired GB1491569A (en) 1975-10-18 1975-10-18 Fluid cooling systems for electrical components
GB1034477A Expired GB1491570A (en) 1975-10-18 1975-10-18 Fluid cooling systems for electrical components

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB4288275A Expired GB1491569A (en) 1975-10-18 1975-10-18 Fluid cooling systems for electrical components

Country Status (3)

Country Link
FR (1) FR2330247A1 (en)
GB (2) GB1491569A (en)
HK (2) HK16979A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2631165A1 (en) * 1988-05-05 1989-11-10 Moulene Daniel TEMPERATURE CONDITIONING MEDIUM FOR SMALL OBJECTS SUCH AS SEMICONDUCTOR COMPONENTS AND THERMAL REGULATION METHOD USING THE SAME
EP0448806A1 (en) * 1990-03-29 1991-10-02 Siemens Aktiengesellschaft Cooling device for component drawers
WO2006004869A2 (en) * 2004-06-30 2006-01-12 Teradyne, Inc. Heat exchange apparatus with parallel flow

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2436263A1 (en) * 1978-09-15 1980-04-11 Paris & Du Rhone Heat proof screen for starter motor switch - comprises curved sheet metal held by outer spring wire clip
US4339260A (en) * 1981-01-12 1982-07-13 Owens-Illinois, Inc. Environmentally protected electronic control for a glassware forming machine
DE4008420A1 (en) * 1990-03-16 1991-09-19 Asea Brown Boveri QUICK RELEASE COUPLING
GB2297651B (en) * 1995-02-03 1999-05-26 Gec Marconi Avionics Holdings Electrical apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2631165A1 (en) * 1988-05-05 1989-11-10 Moulene Daniel TEMPERATURE CONDITIONING MEDIUM FOR SMALL OBJECTS SUCH AS SEMICONDUCTOR COMPONENTS AND THERMAL REGULATION METHOD USING THE SAME
US5034688A (en) * 1988-05-05 1991-07-23 Ets Gourdon Temperature conditioning support for small objects such as semi-conductor components and thermal regulation process using said support
EP0448806A1 (en) * 1990-03-29 1991-10-02 Siemens Aktiengesellschaft Cooling device for component drawers
WO2006004869A2 (en) * 2004-06-30 2006-01-12 Teradyne, Inc. Heat exchange apparatus with parallel flow
WO2006004869A3 (en) * 2004-06-30 2006-06-08 Teradyne Inc Heat exchange apparatus with parallel flow
US7187549B2 (en) 2004-06-30 2007-03-06 Teradyne, Inc. Heat exchange apparatus with parallel flow

Also Published As

Publication number Publication date
GB1491569A (en) 1977-11-09
HK16979A (en) 1979-04-06
FR2330247B1 (en) 1979-06-29
HK17079A (en) 1979-04-06
FR2330247A1 (en) 1977-05-27

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee