GB1485484A - Compositions for use in forming a doped oxide film - Google Patents
Compositions for use in forming a doped oxide filmInfo
- Publication number
- GB1485484A GB1485484A GB40047/74A GB4004774A GB1485484A GB 1485484 A GB1485484 A GB 1485484A GB 40047/74 A GB40047/74 A GB 40047/74A GB 4004774 A GB4004774 A GB 4004774A GB 1485484 A GB1485484 A GB 1485484A
- Authority
- GB
- United Kingdom
- Prior art keywords
- composition
- dopant
- wafer
- acid
- sept
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000203 mixture Substances 0.000 title abstract 6
- WFDIJRYMOXRFFG-UHFFFAOYSA-N acetic acid anhydride Natural products CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 abstract 4
- 239000002019 doping agent Substances 0.000 abstract 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 abstract 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 2
- 239000002904 solvent Substances 0.000 abstract 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 abstract 2
- DJHGAFSJWGLOIV-UHFFFAOYSA-N Arsenic acid Chemical compound O[As](O)(O)=O DJHGAFSJWGLOIV-UHFFFAOYSA-N 0.000 abstract 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 abstract 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Natural products CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 abstract 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 1
- ZQSAMWXOYNJGII-UHFFFAOYSA-N [acetyloxy(diethoxy)silyl] acetate Chemical compound CCO[Si](OCC)(OC(C)=O)OC(C)=O ZQSAMWXOYNJGII-UHFFFAOYSA-N 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 229910052785 arsenic Inorganic materials 0.000 abstract 1
- 229910052796 boron Inorganic materials 0.000 abstract 1
- 229910052810 boron oxide Inorganic materials 0.000 abstract 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 238000007598 dipping method Methods 0.000 abstract 1
- 235000019441 ethanol Nutrition 0.000 abstract 1
- 125000005909 ethyl alcohol group Chemical group 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- FDWREHZXQUYJFJ-UHFFFAOYSA-M gold monochloride Chemical compound [Cl-].[Au+] FDWREHZXQUYJFJ-UHFFFAOYSA-M 0.000 abstract 1
- 229910052698 phosphorus Inorganic materials 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 229910052814 silicon oxide Inorganic materials 0.000 abstract 1
- 238000009987 spinning Methods 0.000 abstract 1
- 238000005507 spraying Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- BBNXUBWWWZGUCP-UHFFFAOYSA-M triethoxysilanylium;acetate Chemical compound CC([O-])=O.CCO[Si+](OCC)OCC BBNXUBWWWZGUCP-UHFFFAOYSA-M 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
- 239000011701 zinc Substances 0.000 abstract 1
- 235000005074 zinc chloride Nutrition 0.000 abstract 1
- 239000011592 zinc chloride Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
- H01L21/02129—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being boron or phosphorus doped silicon oxides, e.g. BPSG, BSG or PSG
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
- C30B31/02—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion materials in the solid state
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/2225—Diffusion sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/225—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
- H01L21/2251—Diffusion into or out of group IV semiconductors
- H01L21/2254—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
- H01L21/2255—Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides the applied layer comprising oxides only, e.g. P2O5, PSG, H3BO3, doped oxides
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Formation Of Insulating Films (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
1485484 Semi-conductor devices TEXAS INSTRUMENTS Inc 13 Sept 1974 [19 Sept 1973] 40047/74 Heading H1K A conductivity type determining dopant is diffused into a semi-conductive wafer by applying to a surface of the wafer a composition comprising tetraethyl orthosilicate, acetic acid or acetic anhydride, and the dopant in a solvent, which composition has been refluxed to reach equilibrium, and heating the coated substrate to a temperature at which a silicon oxide layer containing the dopant is formed, and then heating to a diffusion temperature. The equilibrium mixture is stated to include ethyl acetate, diethoxysilicondiacetate and triethoxysilicon acetate. The solvent is preferably ethylalcohol. The composition may be applied by spinning, spraying or dipping. For a silicon wafer the dopant may be B, P, As or Au, the latter for lifetime control, included in the composition as boron oxide, orthophosphorio acid or P 2 O 5 , orthoarsenic acid or gold chloride respectively. For a gallium arsenide wafer, zinc may be included as zinc chloride.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US39890773A | 1973-09-19 | 1973-09-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1485484A true GB1485484A (en) | 1977-09-14 |
Family
ID=23577297
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB40047/74A Expired GB1485484A (en) | 1973-09-19 | 1974-09-13 | Compositions for use in forming a doped oxide film |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS5058982A (en) |
DE (1) | DE2440148A1 (en) |
FR (1) | FR2245407B3 (en) |
GB (1) | GB1485484A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0104412A1 (en) * | 1982-09-23 | 1984-04-04 | Allied Corporation | Polymeric boron-nitrogen dopant |
US4578283A (en) * | 1982-09-23 | 1986-03-25 | Allied Corporation | Polymeric boron nitrogen dopant |
GB2209245A (en) * | 1987-08-28 | 1989-05-04 | Gen Electric Co Plc | Method of producing a three-dimensional structure |
EP0834489A1 (en) * | 1996-10-04 | 1998-04-08 | Dow Corning Corporation | Thick opaque ceramic coatings |
US10134942B2 (en) | 2012-12-28 | 2018-11-20 | Merck Patent Gmbh | Doping media for the local doping of silicon wafers |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101836833B (en) * | 2010-04-09 | 2011-12-21 | 扬州维邦园林机械有限公司 | Automatic back scrubbing machine |
EP2938760A1 (en) * | 2012-12-28 | 2015-11-04 | Merck Patent GmbH | Liquid doping media for the local doping of silicon wafers |
-
1974
- 1974-06-10 FR FR7419939A patent/FR2245407B3/fr not_active Expired
- 1974-07-10 JP JP49079062A patent/JPS5058982A/ja active Pending
- 1974-08-21 DE DE2440148A patent/DE2440148A1/en not_active Withdrawn
- 1974-09-13 GB GB40047/74A patent/GB1485484A/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0104412A1 (en) * | 1982-09-23 | 1984-04-04 | Allied Corporation | Polymeric boron-nitrogen dopant |
US4578283A (en) * | 1982-09-23 | 1986-03-25 | Allied Corporation | Polymeric boron nitrogen dopant |
GB2209245A (en) * | 1987-08-28 | 1989-05-04 | Gen Electric Co Plc | Method of producing a three-dimensional structure |
EP0834489A1 (en) * | 1996-10-04 | 1998-04-08 | Dow Corning Corporation | Thick opaque ceramic coatings |
US10134942B2 (en) | 2012-12-28 | 2018-11-20 | Merck Patent Gmbh | Doping media for the local doping of silicon wafers |
Also Published As
Publication number | Publication date |
---|---|
FR2245407A1 (en) | 1975-04-25 |
FR2245407B3 (en) | 1977-04-08 |
JPS5058982A (en) | 1975-05-22 |
DE2440148A1 (en) | 1975-03-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
49R | Reference inserted (sect. 9/1949) | ||
PS | Patent sealed [section 19, patents act 1949] | ||
SP | Amendment (slips) printed | ||
PE20 | Patent expired after termination of 20 years |
Effective date: 19940912 |