GB1479358A - Circuit wiring machines - Google Patents

Circuit wiring machines

Info

Publication number
GB1479358A
GB1479358A GB2959975A GB2959975A GB1479358A GB 1479358 A GB1479358 A GB 1479358A GB 2959975 A GB2959975 A GB 2959975A GB 2959975 A GB2959975 A GB 2959975A GB 1479358 A GB1479358 A GB 1479358A
Authority
GB
United Kingdom
Prior art keywords
wires
clamp
lowered
workpiece
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2959975A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1479358A publication Critical patent/GB1479358A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Manufacture Of Motors, Generators (AREA)
  • Wire Processing (AREA)
GB2959975A 1974-07-31 1975-07-15 Circuit wiring machines Expired GB1479358A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/493,371 US3960309A (en) 1974-07-31 1974-07-31 Fine wire twisted pair routing and connecting system

Publications (1)

Publication Number Publication Date
GB1479358A true GB1479358A (en) 1977-07-13

Family

ID=23959964

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2959975A Expired GB1479358A (en) 1974-07-31 1975-07-15 Circuit wiring machines

Country Status (7)

Country Link
US (1) US3960309A (https=)
JP (1) JPS5917554B2 (https=)
BR (1) BR7504902A (https=)
CA (1) CA1035557A (https=)
DE (1) DE2533609C3 (https=)
FR (1) FR2281035A1 (https=)
GB (1) GB1479358A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2120152A (en) * 1982-05-10 1983-11-30 Kollmorgen Tech Corp Rapid soldering of wire to terminal pads

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4268739A (en) * 1978-03-09 1981-05-19 United Wiring & Manufacturing Co. Automated wiring apparatus
US4361261A (en) * 1978-11-22 1982-11-30 Kulicke & Soffa Industries, Inc. Apparatus for wire bonding
US4239144A (en) * 1978-11-22 1980-12-16 Kulicke & Soffa Industries, Inc. Apparatus for wire bonding
FR2458978A2 (fr) * 1979-06-07 1981-01-02 Commissariat Energie Atomique Procede et dispositif d'interconnexions de composants electronique
JPS5626788A (en) * 1979-08-14 1981-03-14 Asahi Glass Co Ltd Solder bonding device for ceramic body
JPS5638897A (en) * 1979-09-05 1981-04-14 Fujitsu Ltd Discrete wire arraying system
FR2466936A1 (fr) * 1979-09-28 1981-04-10 Cii Honeywell Bull Appareil de cablage a la surface d'un substrat d'interconnexion
JPS5698900A (en) 1980-01-07 1981-08-08 Hitachi Ltd Device for automatically wiring printed circuit board
JPS5698895A (en) * 1980-01-07 1981-08-08 Hitachi Ltd Device for transmitting drive force to rotor
US4341014A (en) * 1980-05-07 1982-07-27 Cooper Industries, Inc. Method and apparatus for interconnecting pairs of terminals with a pretwisted pair of insulated wires
JPS571291A (en) * 1980-06-02 1982-01-06 Hitachi Ltd Wire supplying mechanism
JPS57153493A (en) * 1981-03-18 1982-09-22 Fujitsu Ltd Method of positioning wire
GB2095134B (en) * 1981-03-25 1984-11-07 Lansing Bagnall Ltd Wire-laying tool
FR2507855A1 (fr) * 1981-06-11 1982-12-17 Kurganov Vladimir Tete de distribution d'une machine de cablage automatique
JPS57210694A (en) * 1981-06-19 1982-12-24 Hitachi Ltd Method and device for soldering via resistance reflow
DE3126109A1 (de) * 1981-07-02 1983-01-20 Vladimir Semenovič Saratov Borisov Einrichtung zur montage eines drahtes auf einer platte
FR2509950A1 (fr) * 1981-07-16 1983-01-21 Egorenkov Arvit Dispositif pour le montage d'un cable sur une plaque
DE3211714A1 (de) * 1982-03-30 1983-10-06 Siemens Ag Verfahren zur herstellung von zwillingsleitungen mit definiertem wellenwiderstand
US4550871A (en) * 1982-08-24 1985-11-05 Asm Assembly Automation Ltd. Four-motion wire bonder
US4499648A (en) * 1982-09-29 1985-02-19 Amp Incorporated Automatic wiring apparatus with rotatable insertion tooling
DE3344651A1 (de) * 1983-12-09 1985-06-13 Siemens AG, 1000 Berlin und 8000 München Verfahren und vorrichtung zum automatischen verlegen von zusatzdraehten auf flachbaugruppen
US4693778A (en) * 1985-07-19 1987-09-15 Kollmorgen Technologies Corporation Apparatus for making scribed circuit boards and circuit board modifications
JPS62238700A (ja) * 1986-04-09 1987-10-19 アポロ精工株式会社 プリント基板用ジヤンパ線配線装置
JPS6398920A (ja) * 1986-10-15 1988-04-30 文化自動車工業株式会社 ワイヤハ−ネス製造装置
JPS6398919A (ja) * 1986-10-15 1988-04-30 文化自動車工業株式会社 ワイヤハ−ネス製造装置
JPS63136420A (ja) * 1986-11-28 1988-06-08 文化自動車工業株式会社 布線装置
IT1204967B (it) * 1987-03-30 1989-03-10 Mario Scavino Dispositivo ad assi ortogonali,con motori lineari per il posizionamento e lavorazione di pezzi,in particolare per la microsaldatura di fili su composnenti elettronici
US5042146A (en) * 1990-02-06 1991-08-27 Watson Troy M Method and apparatus of making an electrical interconnection on a circuit board
US5421930A (en) * 1993-11-01 1995-06-06 American Telephone And Telegraph Company Optical fiber routing method and apparatus
US5813590A (en) * 1995-12-18 1998-09-29 Micron Technology, Inc. Extended travel wire bonding machine
DE102005003370A1 (de) * 2005-01-24 2006-07-27 Juma Pcb Gmbh Verfahren zur durchgehenden Verlegung eines Leitungsdrahtes auf einer Leiterplatte und Vorrichtung zur Durchführung des Verfahrens
CN103177978B (zh) * 2011-12-23 2015-11-18 大族激光科技产业集团股份有限公司 高频转动机构及引线键合机
CN109560523B (zh) * 2018-12-05 2024-06-25 浙江泰昌实业有限公司 一种零电位线夹
CN111531488B (zh) * 2020-05-29 2021-10-22 河南万基铝业股份有限公司 一种铝管的切割夹持装置
US12515860B2 (en) * 2020-08-18 2026-01-06 Cpi Card Group—Minnesota, Inc. Tamper evident card package and method
CN112601382B (zh) * 2020-12-18 2022-01-04 南京海索信息科技有限公司 一种实验板用布线装置及其使用方法
DE102023003296A1 (de) * 2023-08-09 2025-02-13 Mercedes-Benz Group AG Verfahren zum elektrisch leitfähigen Verbinden von Kontaktstellen

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3103735A (en) * 1959-04-06 1963-09-17 Gardner Denver Co Positioning apparatus
US3769699A (en) * 1969-06-30 1973-11-06 Raytheon Co Method of making a memory storage device
US3646307A (en) * 1970-09-24 1972-02-29 Ibm Wiring apparatus
US3734386A (en) * 1971-06-30 1973-05-22 Ibm Wiring apparatus with wire path forming means
US3773240A (en) * 1972-03-06 1973-11-20 Texas Instruments Inc Automatic bonding machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2120152A (en) * 1982-05-10 1983-11-30 Kollmorgen Tech Corp Rapid soldering of wire to terminal pads

Also Published As

Publication number Publication date
FR2281035A1 (fr) 1976-02-27
FR2281035B1 (https=) 1979-06-08
JPS5140762A (https=) 1976-04-05
CA1035557A (en) 1978-08-01
DE2533609A1 (de) 1976-02-19
DE2533609B2 (de) 1978-12-07
BR7504902A (pt) 1977-03-01
US3960309A (en) 1976-06-01
JPS5917554B2 (ja) 1984-04-21
DE2533609C3 (de) 1979-08-16

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee