GB1426874A - Method of sealing electrical component envelopes - Google Patents

Method of sealing electrical component envelopes

Info

Publication number
GB1426874A
GB1426874A GB2068872A GB2068872A GB1426874A GB 1426874 A GB1426874 A GB 1426874A GB 2068872 A GB2068872 A GB 2068872A GB 2068872 A GB2068872 A GB 2068872A GB 1426874 A GB1426874 A GB 1426874A
Authority
GB
United Kingdom
Prior art keywords
pressure
kovar
lead
gold
per square
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2068872A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Components Ltd
Original Assignee
Mullard Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mullard Ltd filed Critical Mullard Ltd
Priority to GB2068872A priority Critical patent/GB1426874A/en
Priority to DE2318736A priority patent/DE2318736A1/de
Priority to US352872A priority patent/US3896542A/en
Priority to NL7305889A priority patent/NL7305889A/xx
Priority to IT68203/73A priority patent/IT980933B/it
Priority to JP48049640A priority patent/JPS4962084A/ja
Priority to FR7315884A priority patent/FR2183214A1/fr
Publication of GB1426874A publication Critical patent/GB1426874A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Ceramic Products (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
GB2068872A 1972-05-03 1972-05-03 Method of sealing electrical component envelopes Expired GB1426874A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
GB2068872A GB1426874A (en) 1972-05-03 1972-05-03 Method of sealing electrical component envelopes
DE2318736A DE2318736A1 (de) 1972-05-03 1973-04-13 Verfahren zum abdichten von umhuellungen fuer elektrische teile
US352872A US3896542A (en) 1972-05-03 1973-04-20 Method of sealing electrical component envelopes
NL7305889A NL7305889A (enExample) 1972-05-03 1973-04-27
IT68203/73A IT980933B (it) 1972-05-03 1973-04-30 Procedimento per sigillare involu cri di componenti elettrici
JP48049640A JPS4962084A (enExample) 1972-05-03 1973-05-02
FR7315884A FR2183214A1 (enExample) 1972-05-03 1973-05-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2068872A GB1426874A (en) 1972-05-03 1972-05-03 Method of sealing electrical component envelopes

Publications (1)

Publication Number Publication Date
GB1426874A true GB1426874A (en) 1976-03-03

Family

ID=10150028

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2068872A Expired GB1426874A (en) 1972-05-03 1972-05-03 Method of sealing electrical component envelopes

Country Status (7)

Country Link
US (1) US3896542A (enExample)
JP (1) JPS4962084A (enExample)
DE (1) DE2318736A1 (enExample)
FR (1) FR2183214A1 (enExample)
GB (1) GB1426874A (enExample)
IT (1) IT980933B (enExample)
NL (1) NL7305889A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2502722A1 (fr) * 1981-03-26 1982-10-01 Sperry Ltd Procede de realisation d'un joint hermetique pour gyroscope a laser, joint realise et gyroscope ainsi equipe
GB2130528A (en) * 1982-11-16 1984-06-06 Philips Nv Method of manufacturing an ink jet printer comprising one or more jet nozzles

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4262300A (en) * 1978-11-03 1981-04-14 Isotronics, Inc. Microcircuit package formed of multi-components
US4291815B1 (en) * 1980-02-19 1998-09-29 Semiconductor Packaging Materi Ceramic lid assembly for hermetic sealing of a semiconductor chip
JPS60156757U (ja) * 1984-03-28 1985-10-18 株式会社　フジ電科 気密端子
US4640438A (en) * 1986-03-17 1987-02-03 Comienco Limited Cover for semiconductor device packages
US4919291A (en) * 1987-11-23 1990-04-24 Santa Barbara Research Center Metallurgically improved tip-off tube for a vacuum enclosure
NL8800902A (nl) * 1988-04-08 1989-11-01 Philips Nv Werkwijze voor het aanbrengen van een halfgeleiderlichaam op een drager.
NL8800901A (nl) * 1988-04-08 1989-11-01 Philips Nv Combinatie van een drager en een halfgeleiderlichaam en werkwijze voor het vervaardigen van een dergelijke combinatie.
US5168425A (en) * 1991-10-16 1992-12-01 General Electric Company Mounting arrangements for high voltage/high power semiconductors
DE102019135171A1 (de) * 2019-12-19 2021-06-24 Rogers Germany Gmbh Lotmaterial, Verfahren zur Herstellung eines solchen Lotmaterials und Verwendung eines solchen Lotmaterials zur Anbindung einer Metallschicht an eine Keramikschicht

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2671746A (en) * 1950-06-17 1954-03-09 Richard D Brew & Company Inc Bonding system
US2965962A (en) * 1954-12-07 1960-12-27 Rca Corp Hermetic seal and method of making the same
US3203083A (en) * 1961-02-08 1965-08-31 Texas Instruments Inc Method of manufacturing a hermetically sealed semiconductor capsule
US3383454A (en) * 1964-01-10 1968-05-14 Gti Corp Micromodular package
US3340602A (en) * 1965-02-01 1967-09-12 Philco Ford Corp Process for sealing
US3478416A (en) * 1967-02-15 1969-11-18 North American Rockwell Bonding of beryllium members
US3543383A (en) * 1967-02-20 1970-12-01 Gen Electrodynamics Corp Indium seal
GB1198257A (en) * 1967-04-29 1970-07-08 Int Computers Ltd Improvements in Methods of Bonding Electrical Conductors
US3772764A (en) * 1970-08-03 1973-11-20 Gen Motors Corp Method of making enclosure for a semiconductor device
US3711939A (en) * 1970-11-10 1973-01-23 M Stoll Method and apparatus for sealing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2502722A1 (fr) * 1981-03-26 1982-10-01 Sperry Ltd Procede de realisation d'un joint hermetique pour gyroscope a laser, joint realise et gyroscope ainsi equipe
GB2130528A (en) * 1982-11-16 1984-06-06 Philips Nv Method of manufacturing an ink jet printer comprising one or more jet nozzles

Also Published As

Publication number Publication date
IT980933B (it) 1974-10-10
NL7305889A (enExample) 1973-11-06
JPS4962084A (enExample) 1974-06-15
DE2318736A1 (de) 1973-11-15
US3896542A (en) 1975-07-29
FR2183214A1 (enExample) 1973-12-14

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee