GB1426874A - Method of sealing electrical component envelopes - Google Patents

Method of sealing electrical component envelopes

Info

Publication number
GB1426874A
GB1426874A GB2068872A GB2068872A GB1426874A GB 1426874 A GB1426874 A GB 1426874A GB 2068872 A GB2068872 A GB 2068872A GB 2068872 A GB2068872 A GB 2068872A GB 1426874 A GB1426874 A GB 1426874A
Authority
GB
United Kingdom
Prior art keywords
pressure
kovar
lead
gold
per square
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2068872A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Components Ltd
Original Assignee
Mullard Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mullard Ltd filed Critical Mullard Ltd
Priority to GB2068872A priority Critical patent/GB1426874A/en
Priority to DE2318736A priority patent/DE2318736A1/de
Priority to US352872A priority patent/US3896542A/en
Priority to NL7305889A priority patent/NL7305889A/xx
Priority to IT68203/73A priority patent/IT980933B/it
Priority to JP48049640A priority patent/JPS4962084A/ja
Priority to FR7315884A priority patent/FR2183214A1/fr
Publication of GB1426874A publication Critical patent/GB1426874A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Ceramic Products (AREA)
GB2068872A 1972-05-03 1972-05-03 Method of sealing electrical component envelopes Expired GB1426874A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
GB2068872A GB1426874A (en) 1972-05-03 1972-05-03 Method of sealing electrical component envelopes
DE2318736A DE2318736A1 (de) 1972-05-03 1973-04-13 Verfahren zum abdichten von umhuellungen fuer elektrische teile
US352872A US3896542A (en) 1972-05-03 1973-04-20 Method of sealing electrical component envelopes
NL7305889A NL7305889A (enExample) 1972-05-03 1973-04-27
IT68203/73A IT980933B (it) 1972-05-03 1973-04-30 Procedimento per sigillare involu cri di componenti elettrici
JP48049640A JPS4962084A (enExample) 1972-05-03 1973-05-02
FR7315884A FR2183214A1 (enExample) 1972-05-03 1973-05-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2068872A GB1426874A (en) 1972-05-03 1972-05-03 Method of sealing electrical component envelopes

Publications (1)

Publication Number Publication Date
GB1426874A true GB1426874A (en) 1976-03-03

Family

ID=10150028

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2068872A Expired GB1426874A (en) 1972-05-03 1972-05-03 Method of sealing electrical component envelopes

Country Status (7)

Country Link
US (1) US3896542A (enExample)
JP (1) JPS4962084A (enExample)
DE (1) DE2318736A1 (enExample)
FR (1) FR2183214A1 (enExample)
GB (1) GB1426874A (enExample)
IT (1) IT980933B (enExample)
NL (1) NL7305889A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2502722A1 (fr) * 1981-03-26 1982-10-01 Sperry Ltd Procede de realisation d'un joint hermetique pour gyroscope a laser, joint realise et gyroscope ainsi equipe
GB2130528A (en) * 1982-11-16 1984-06-06 Philips Nv Method of manufacturing an ink jet printer comprising one or more jet nozzles

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4262300A (en) * 1978-11-03 1981-04-14 Isotronics, Inc. Microcircuit package formed of multi-components
US4291815B1 (en) * 1980-02-19 1998-09-29 Semiconductor Packaging Materi Ceramic lid assembly for hermetic sealing of a semiconductor chip
JPS60156757U (ja) * 1984-03-28 1985-10-18 株式会社　フジ電科 気密端子
US4640438A (en) * 1986-03-17 1987-02-03 Comienco Limited Cover for semiconductor device packages
US4919291A (en) * 1987-11-23 1990-04-24 Santa Barbara Research Center Metallurgically improved tip-off tube for a vacuum enclosure
NL8800902A (nl) * 1988-04-08 1989-11-01 Philips Nv Werkwijze voor het aanbrengen van een halfgeleiderlichaam op een drager.
NL8800901A (nl) * 1988-04-08 1989-11-01 Philips Nv Combinatie van een drager en een halfgeleiderlichaam en werkwijze voor het vervaardigen van een dergelijke combinatie.
US5168425A (en) * 1991-10-16 1992-12-01 General Electric Company Mounting arrangements for high voltage/high power semiconductors
DE102019135171A1 (de) * 2019-12-19 2021-06-24 Rogers Germany Gmbh Lotmaterial, Verfahren zur Herstellung eines solchen Lotmaterials und Verwendung eines solchen Lotmaterials zur Anbindung einer Metallschicht an eine Keramikschicht

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2671746A (en) * 1950-06-17 1954-03-09 Richard D Brew & Company Inc Bonding system
US2965962A (en) * 1954-12-07 1960-12-27 Rca Corp Hermetic seal and method of making the same
US3203083A (en) * 1961-02-08 1965-08-31 Texas Instruments Inc Method of manufacturing a hermetically sealed semiconductor capsule
US3383454A (en) * 1964-01-10 1968-05-14 Gti Corp Micromodular package
US3340602A (en) * 1965-02-01 1967-09-12 Philco Ford Corp Process for sealing
US3478416A (en) * 1967-02-15 1969-11-18 North American Rockwell Bonding of beryllium members
US3543383A (en) * 1967-02-20 1970-12-01 Gen Electrodynamics Corp Indium seal
GB1198257A (en) * 1967-04-29 1970-07-08 Int Computers Ltd Improvements in Methods of Bonding Electrical Conductors
US3772764A (en) * 1970-08-03 1973-11-20 Gen Motors Corp Method of making enclosure for a semiconductor device
US3711939A (en) * 1970-11-10 1973-01-23 M Stoll Method and apparatus for sealing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2502722A1 (fr) * 1981-03-26 1982-10-01 Sperry Ltd Procede de realisation d'un joint hermetique pour gyroscope a laser, joint realise et gyroscope ainsi equipe
GB2130528A (en) * 1982-11-16 1984-06-06 Philips Nv Method of manufacturing an ink jet printer comprising one or more jet nozzles

Also Published As

Publication number Publication date
IT980933B (it) 1974-10-10
NL7305889A (enExample) 1973-11-06
DE2318736A1 (de) 1973-11-15
JPS4962084A (enExample) 1974-06-15
FR2183214A1 (enExample) 1973-12-14
US3896542A (en) 1975-07-29

Similar Documents

Publication Publication Date Title
GB1426873A (en) Methods of pressure bonding a ceramic member to another member
GB1389542A (en) Methods of securing a semiconductor body to a support
FR2406893B1 (enExample)
KR100271113B1 (ko) 글래스/금속 패키지 및 그 제조 방법
GB1426874A (en) Method of sealing electrical component envelopes
GB1333848A (en) Method of bonding metal bodies together by vibratory energy
GB2084399B (en) Mounting a semiconductor device
GB1001171A (en) Semiconductor devices
CN106449542A (zh) 一种视窗气密无硅胶的半导体发光芯片的封装结构
IE32179L (en) Bonding workpieces to substrates.
GB2061155A (en) Pressure-bonding metal and/or ceramic members by using an interposed silver foil
US3337781A (en) Encapsulation means for a semiconductor device
FR2269793B1 (enExample)
US3233309A (en) Method of producing electrically asymmetrical semiconductor device of symmetrical mechanical design
GB1331028A (en) Method of soldering a semiconductor plate
GB1077656A (en) Improvements in or relating to semiconductor devices
GB1378218A (en) Semiconductor components
JPS63262858A (ja) 半導体装置
GB917416A (en) Improvements in and relating to methods of securing together parts of ceramic material
JPS6136969A (ja) 半導体固体撮像装置
JPS568851A (en) Lead wire connecting method of semiconductor device
JPS5745262A (en) Sealing and fitting structure of semiconductor device
GB1292982A (en) Method of brazing
JP3138186B2 (ja) 半導体装置
GB836919A (en) A ceramic to metal seal and method of forming same

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee