NL7305889A - - Google Patents
Info
- Publication number
- NL7305889A NL7305889A NL7305889A NL7305889A NL7305889A NL 7305889 A NL7305889 A NL 7305889A NL 7305889 A NL7305889 A NL 7305889A NL 7305889 A NL7305889 A NL 7305889A NL 7305889 A NL7305889 A NL 7305889A
- Authority
- NL
- Netherlands
Links
Classifications
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- H10P72/0441—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/023—Thermo-compression bonding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
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- H10W70/421—
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- H10W76/134—
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- H10W95/00—
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- H10W70/682—
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- H10W70/685—
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Ceramic Products (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2068872A GB1426874A (en) | 1972-05-03 | 1972-05-03 | Method of sealing electrical component envelopes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7305889A true NL7305889A (enExample) | 1973-11-06 |
Family
ID=10150028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7305889A NL7305889A (enExample) | 1972-05-03 | 1973-04-27 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3896542A (enExample) |
| JP (1) | JPS4962084A (enExample) |
| DE (1) | DE2318736A1 (enExample) |
| FR (1) | FR2183214A1 (enExample) |
| GB (1) | GB1426874A (enExample) |
| IT (1) | IT980933B (enExample) |
| NL (1) | NL7305889A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1989004740A1 (en) * | 1987-11-23 | 1989-06-01 | Santa Barbara Research Center | Metallurgically improved tip-off tube for a vacuum enclosure |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4262300A (en) * | 1978-11-03 | 1981-04-14 | Isotronics, Inc. | Microcircuit package formed of multi-components |
| US4291815B1 (en) * | 1980-02-19 | 1998-09-29 | Semiconductor Packaging Materi | Ceramic lid assembly for hermetic sealing of a semiconductor chip |
| JPS57170581A (en) * | 1981-03-26 | 1982-10-20 | Sperry Rand Ltd | Seal and method of forming same |
| DE3242283A1 (de) * | 1982-11-16 | 1984-05-17 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Verfahren zur herstellung eines ein- oder mehrduesigen tintenstrahldruckers |
| JPS60156757U (ja) * | 1984-03-28 | 1985-10-18 | 株式会社 フジ電科 | 気密端子 |
| US4640438A (en) * | 1986-03-17 | 1987-02-03 | Comienco Limited | Cover for semiconductor device packages |
| NL8800901A (nl) * | 1988-04-08 | 1989-11-01 | Philips Nv | Combinatie van een drager en een halfgeleiderlichaam en werkwijze voor het vervaardigen van een dergelijke combinatie. |
| NL8800902A (nl) * | 1988-04-08 | 1989-11-01 | Philips Nv | Werkwijze voor het aanbrengen van een halfgeleiderlichaam op een drager. |
| US5168425A (en) * | 1991-10-16 | 1992-12-01 | General Electric Company | Mounting arrangements for high voltage/high power semiconductors |
| DE102019135171A1 (de) * | 2019-12-19 | 2021-06-24 | Rogers Germany Gmbh | Lotmaterial, Verfahren zur Herstellung eines solchen Lotmaterials und Verwendung eines solchen Lotmaterials zur Anbindung einer Metallschicht an eine Keramikschicht |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2671746A (en) * | 1950-06-17 | 1954-03-09 | Richard D Brew & Company Inc | Bonding system |
| US2965962A (en) * | 1954-12-07 | 1960-12-27 | Rca Corp | Hermetic seal and method of making the same |
| US3203083A (en) * | 1961-02-08 | 1965-08-31 | Texas Instruments Inc | Method of manufacturing a hermetically sealed semiconductor capsule |
| US3383454A (en) * | 1964-01-10 | 1968-05-14 | Gti Corp | Micromodular package |
| US3340602A (en) * | 1965-02-01 | 1967-09-12 | Philco Ford Corp | Process for sealing |
| US3478416A (en) * | 1967-02-15 | 1969-11-18 | North American Rockwell | Bonding of beryllium members |
| US3543383A (en) * | 1967-02-20 | 1970-12-01 | Gen Electrodynamics Corp | Indium seal |
| GB1198257A (en) * | 1967-04-29 | 1970-07-08 | Int Computers Ltd | Improvements in Methods of Bonding Electrical Conductors |
| US3772764A (en) * | 1970-08-03 | 1973-11-20 | Gen Motors Corp | Method of making enclosure for a semiconductor device |
| US3711939A (en) * | 1970-11-10 | 1973-01-23 | M Stoll | Method and apparatus for sealing |
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1972
- 1972-05-03 GB GB2068872A patent/GB1426874A/en not_active Expired
-
1973
- 1973-04-13 DE DE2318736A patent/DE2318736A1/de active Pending
- 1973-04-20 US US352872A patent/US3896542A/en not_active Expired - Lifetime
- 1973-04-27 NL NL7305889A patent/NL7305889A/xx unknown
- 1973-04-30 IT IT68203/73A patent/IT980933B/it active
- 1973-05-02 JP JP48049640A patent/JPS4962084A/ja active Pending
- 1973-05-03 FR FR7315884A patent/FR2183214A1/fr not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1989004740A1 (en) * | 1987-11-23 | 1989-06-01 | Santa Barbara Research Center | Metallurgically improved tip-off tube for a vacuum enclosure |
| US4919291A (en) * | 1987-11-23 | 1990-04-24 | Santa Barbara Research Center | Metallurgically improved tip-off tube for a vacuum enclosure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4962084A (enExample) | 1974-06-15 |
| IT980933B (it) | 1974-10-10 |
| DE2318736A1 (de) | 1973-11-15 |
| FR2183214A1 (enExample) | 1973-12-14 |
| US3896542A (en) | 1975-07-29 |
| GB1426874A (en) | 1976-03-03 |