FR2183214A1 - - Google Patents

Info

Publication number
FR2183214A1
FR2183214A1 FR7315884A FR7315884A FR2183214A1 FR 2183214 A1 FR2183214 A1 FR 2183214A1 FR 7315884 A FR7315884 A FR 7315884A FR 7315884 A FR7315884 A FR 7315884A FR 2183214 A1 FR2183214 A1 FR 2183214A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7315884A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2183214A1 publication Critical patent/FR2183214A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Ceramic Products (AREA)
FR7315884A 1972-05-03 1973-05-03 Withdrawn FR2183214A1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2068872A GB1426874A (en) 1972-05-03 1972-05-03 Method of sealing electrical component envelopes

Publications (1)

Publication Number Publication Date
FR2183214A1 true FR2183214A1 (enExample) 1973-12-14

Family

ID=10150028

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7315884A Withdrawn FR2183214A1 (enExample) 1972-05-03 1973-05-03

Country Status (7)

Country Link
US (1) US3896542A (enExample)
JP (1) JPS4962084A (enExample)
DE (1) DE2318736A1 (enExample)
FR (1) FR2183214A1 (enExample)
GB (1) GB1426874A (enExample)
IT (1) IT980933B (enExample)
NL (1) NL7305889A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2440675A1 (fr) * 1978-11-03 1980-05-30 Isotronics Inc Boitier de microcircuit en plusieurs pieces
EP0238181A3 (en) * 1986-03-17 1989-07-26 Cominco Ltd. Cover for semiconductor device packages

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4291815B1 (en) * 1980-02-19 1998-09-29 Semiconductor Packaging Materi Ceramic lid assembly for hermetic sealing of a semiconductor chip
JPS57170581A (en) * 1981-03-26 1982-10-20 Sperry Rand Ltd Seal and method of forming same
DE3242283A1 (de) * 1982-11-16 1984-05-17 Philips Patentverwaltung Gmbh, 2000 Hamburg Verfahren zur herstellung eines ein- oder mehrduesigen tintenstrahldruckers
JPS60156757U (ja) * 1984-03-28 1985-10-18 株式会社　フジ電科 気密端子
US4919291A (en) * 1987-11-23 1990-04-24 Santa Barbara Research Center Metallurgically improved tip-off tube for a vacuum enclosure
NL8800902A (nl) * 1988-04-08 1989-11-01 Philips Nv Werkwijze voor het aanbrengen van een halfgeleiderlichaam op een drager.
NL8800901A (nl) * 1988-04-08 1989-11-01 Philips Nv Combinatie van een drager en een halfgeleiderlichaam en werkwijze voor het vervaardigen van een dergelijke combinatie.
US5168425A (en) * 1991-10-16 1992-12-01 General Electric Company Mounting arrangements for high voltage/high power semiconductors
DE102019135171A1 (de) * 2019-12-19 2021-06-24 Rogers Germany Gmbh Lotmaterial, Verfahren zur Herstellung eines solchen Lotmaterials und Verwendung eines solchen Lotmaterials zur Anbindung einer Metallschicht an eine Keramikschicht

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2671746A (en) * 1950-06-17 1954-03-09 Richard D Brew & Company Inc Bonding system
US2965962A (en) * 1954-12-07 1960-12-27 Rca Corp Hermetic seal and method of making the same
US3203083A (en) * 1961-02-08 1965-08-31 Texas Instruments Inc Method of manufacturing a hermetically sealed semiconductor capsule
US3383454A (en) * 1964-01-10 1968-05-14 Gti Corp Micromodular package
US3340602A (en) * 1965-02-01 1967-09-12 Philco Ford Corp Process for sealing
US3478416A (en) * 1967-02-15 1969-11-18 North American Rockwell Bonding of beryllium members
US3543383A (en) * 1967-02-20 1970-12-01 Gen Electrodynamics Corp Indium seal
GB1198257A (en) * 1967-04-29 1970-07-08 Int Computers Ltd Improvements in Methods of Bonding Electrical Conductors
US3772764A (en) * 1970-08-03 1973-11-20 Gen Motors Corp Method of making enclosure for a semiconductor device
US3711939A (en) * 1970-11-10 1973-01-23 M Stoll Method and apparatus for sealing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2440675A1 (fr) * 1978-11-03 1980-05-30 Isotronics Inc Boitier de microcircuit en plusieurs pieces
EP0238181A3 (en) * 1986-03-17 1989-07-26 Cominco Ltd. Cover for semiconductor device packages

Also Published As

Publication number Publication date
IT980933B (it) 1974-10-10
GB1426874A (en) 1976-03-03
NL7305889A (enExample) 1973-11-06
JPS4962084A (enExample) 1974-06-15
DE2318736A1 (de) 1973-11-15
US3896542A (en) 1975-07-29

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Legal Events

Date Code Title Description
ST Notification of lapse