FR2440675A1 - Boitier de microcircuit en plusieurs pieces - Google Patents

Boitier de microcircuit en plusieurs pieces

Info

Publication number
FR2440675A1
FR2440675A1 FR7927021A FR7927021A FR2440675A1 FR 2440675 A1 FR2440675 A1 FR 2440675A1 FR 7927021 A FR7927021 A FR 7927021A FR 7927021 A FR7927021 A FR 7927021A FR 2440675 A1 FR2440675 A1 FR 2440675A1
Authority
FR
France
Prior art keywords
microcircuit
box
piece
frame
brases
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7927021A
Other languages
English (en)
Other versions
FR2440675B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Isotronics Inc
Original Assignee
Isotronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Isotronics Inc filed Critical Isotronics Inc
Publication of FR2440675A1 publication Critical patent/FR2440675A1/fr
Application granted granted Critical
Publication of FR2440675B1 publication Critical patent/FR2440675B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

L'INVENTION CONCERNE UN BOITIER DE MICROCIRCUIT EN PLUSIEURS PIECES. IL COMPORTE UNE PARTIE INFERIEURE CONSTITUEE PAR UNE BASE 5 SUR LAQUELLE EST BRASE UN CADRE CONSTITUE PAR PLUSIEURS PIECES 1, 2, 3, 4 DE PAROI LATERALE BRASEES ENSEMBLE. UNE PIECE SUPERIEURE 6 EST EGALEMENT BRASEE SUR LE CADRE ET PRESENTE UNE SURFACE SUPERIEURE UNIFORME SUR LAQUELLE UN COUVERCLE PEUT ETRE SCELLE HERMETIQUEMENT. L'INVENTION S'APPLIQUE NOTAMMENT A DES BOITIERS DE MICROCIRCUITS REALISES EN PETITES SERIES.
FR7927021A 1978-11-03 1979-10-31 Boitier de microcircuit en plusieurs pieces Granted FR2440675A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/957,094 US4262300A (en) 1978-11-03 1978-11-03 Microcircuit package formed of multi-components

Publications (2)

Publication Number Publication Date
FR2440675A1 true FR2440675A1 (fr) 1980-05-30
FR2440675B1 FR2440675B1 (fr) 1984-02-03

Family

ID=25499058

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7927021A Granted FR2440675A1 (fr) 1978-11-03 1979-10-31 Boitier de microcircuit en plusieurs pieces

Country Status (5)

Country Link
US (1) US4262300A (fr)
CA (1) CA1128185A (fr)
DE (1) DE2944276A1 (fr)
FR (1) FR2440675A1 (fr)
GB (1) GB2048572A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0514213A2 (fr) * 1991-05-16 1992-11-19 Shinko Electric Industries Co. Ltd. Procédé de fabrication d'un empaquetage pour des éléments électroniques

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4451540A (en) * 1982-08-30 1984-05-29 Isotronics, Inc. System for packaging of electronic circuits
US4547624A (en) * 1983-12-02 1985-10-15 Isotronics, Inc. Method and apparatus for reducing package height for microcircuit packages
US4716082A (en) * 1986-10-28 1987-12-29 Isotronics, Inc. Duplex glass preforms for hermetic glass-to-metal sealing
DE3837301A1 (de) * 1988-11-03 1990-05-10 Technotron Elektrotechnische G Herstellverfahren fuer hybridschaltkreisgehaeuse
DE3904219C2 (de) * 1988-11-03 1998-12-10 Technotron Elektrotechnische G Verfahren zur Herstellung einer hermetisch verschließbaren Gehäusewanne für ein Hybridschaltkreisgehäuse und danach hergestellte Gehäusewanne
CN100337788C (zh) * 2005-05-25 2007-09-19 马军 金属封装外壳壳体的榫接钎焊加工方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3502786A (en) * 1967-06-14 1970-03-24 Milton Stoll Flat pack spacer of low thermal diffusivity
FR2078980A5 (en) * 1970-02-24 1971-11-05 Owens Illinois Inc Gold-glass composition for bonding siliconde
US3697666A (en) * 1971-09-24 1972-10-10 Diacon Enclosure for incapsulating electronic components
FR2183214A1 (fr) * 1972-05-03 1973-12-14 Philips Nv
FR2183213A1 (fr) * 1972-05-03 1973-12-14 Philips Nv

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3404213A (en) * 1962-07-26 1968-10-01 Owens Illinois Inc Hermetic packages for electronic components
US3340602A (en) * 1965-02-01 1967-09-12 Philco Ford Corp Process for sealing
US3374537A (en) * 1965-03-22 1968-03-26 Philco Ford Corp Method of connecting leads to a semiconductive device
US3408451A (en) * 1965-09-01 1968-10-29 Texas Instruments Inc Electrical device package
US3546543A (en) * 1968-08-30 1970-12-08 Nat Beryllia Corp Hermetically sealed electronic package for semiconductor devices with high current carrying conductors
JPS4913660Y1 (fr) * 1969-06-16 1974-04-04
JPS495597B1 (fr) * 1969-10-17 1974-02-07
US3619734A (en) * 1969-12-17 1971-11-09 Rca Corp Assembly of series connected semiconductor elements having good heat dissipation
US3753054A (en) * 1970-01-02 1973-08-14 Texas Instruments Inc Hermetically sealed electronic package
US3726006A (en) * 1971-04-28 1973-04-10 Us Army Method for sintering thick-film oxidizable silk-screened circuitry
DE2519222B2 (de) * 1975-04-30 1980-05-08 Elmeg Elektro-Mechanik Gmbh, 3150 Peine Gehäuse für Kleingeräte
DE2629207C3 (de) * 1976-06-29 1981-04-23 Siemens AG, 1000 Berlin und 8000 München Gehäuse für elektrische Geräte aus extrudierten Profilteilen
DE2629916A1 (de) * 1976-07-02 1978-03-30 Siemens Ag Gehaeuse zur aufnahme von leiterplatten und mic-substraten

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3502786A (en) * 1967-06-14 1970-03-24 Milton Stoll Flat pack spacer of low thermal diffusivity
FR2078980A5 (en) * 1970-02-24 1971-11-05 Owens Illinois Inc Gold-glass composition for bonding siliconde
US3697666A (en) * 1971-09-24 1972-10-10 Diacon Enclosure for incapsulating electronic components
FR2183214A1 (fr) * 1972-05-03 1973-12-14 Philips Nv
FR2183213A1 (fr) * 1972-05-03 1973-12-14 Philips Nv

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0514213A2 (fr) * 1991-05-16 1992-11-19 Shinko Electric Industries Co. Ltd. Procédé de fabrication d'un empaquetage pour des éléments électroniques
EP0514213A3 (en) * 1991-05-16 1993-05-19 Shinko Electric Industries Co. Ltd. Process for making a package for accommodating electronic elements
US5277357A (en) * 1991-05-16 1994-01-11 Shinko Electric Industries Co., Ltd. Process for making a metal wall of a package used for accommodating electronic elements

Also Published As

Publication number Publication date
CA1128185A (fr) 1982-07-20
GB2048572A (en) 1980-12-10
DE2944276A1 (de) 1980-05-14
FR2440675B1 (fr) 1984-02-03
US4262300A (en) 1981-04-14

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Legal Events

Date Code Title Description
ST Notification of lapse