GB1412052A - Semoconductor structure including an integrated circuit - Google Patents

Semoconductor structure including an integrated circuit

Info

Publication number
GB1412052A
GB1412052A GB2971173A GB2971173A GB1412052A GB 1412052 A GB1412052 A GB 1412052A GB 2971173 A GB2971173 A GB 2971173A GB 2971173 A GB2971173 A GB 2971173A GB 1412052 A GB1412052 A GB 1412052A
Authority
GB
United Kingdom
Prior art keywords
circuit
photoconductive
type
region
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2971173A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Corp
International Business Machines Corp
Original Assignee
International Business Corp
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Corp, International Business Machines Corp filed Critical International Business Corp
Publication of GB1412052A publication Critical patent/GB1412052A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/207—Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/107—Integrated devices having multiple elements covered by H10F30/00 in a repetitive configuration, e.g. radiation detectors comprising photodiode arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/273—Interconnections for measuring or testing, e.g. probe pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/277—Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
GB2971173A 1972-07-03 1973-06-22 Semoconductor structure including an integrated circuit Expired GB1412052A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US26840772A 1972-07-03 1972-07-03

Publications (1)

Publication Number Publication Date
GB1412052A true GB1412052A (en) 1975-10-29

Family

ID=23022865

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2971173A Expired GB1412052A (en) 1972-07-03 1973-06-22 Semoconductor structure including an integrated circuit

Country Status (5)

Country Link
US (1) US3801910A (cg-RX-API-DMAC7.html)
JP (1) JPS562415B2 (cg-RX-API-DMAC7.html)
DE (1) DE2329659A1 (cg-RX-API-DMAC7.html)
FR (1) FR2191266B1 (cg-RX-API-DMAC7.html)
GB (1) GB1412052A (cg-RX-API-DMAC7.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2831787A1 (de) * 1978-07-19 1980-01-31 Siemens Ag Mit hilfe eines elektronen- oder laserstrahls pruefbare, integrierte schaltungsanordnung
GB2177254A (en) * 1985-07-05 1987-01-14 Stc Plc Testing integrated circuits
EP0272506A3 (en) * 1986-12-22 1991-05-29 International Business Machines Corporation Thin film transistor array for liquid crystal displays allowing in-process testing, testing method, and information entry system comprising such an array

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2207404B1 (cg-RX-API-DMAC7.html) * 1972-11-20 1976-04-23 Merlin Gerin
US4053833A (en) * 1974-02-12 1977-10-11 Westinghouse Electric Corporation Contactless test method for integrated circuits
US3956698A (en) * 1974-02-12 1976-05-11 Westinghouse Electric Corporation Contactless test method for integrated circuits
US4404635A (en) * 1981-03-27 1983-09-13 International Business Machines Corporation Programmable integrated circuit and method of testing the circuit before it is programmed
US4482863A (en) * 1981-08-14 1984-11-13 At&T Bell Laboratories Apparatus and method for measuring electronic response of high speed devices and materials
US4439727A (en) * 1981-12-21 1984-03-27 Ibm Corporation Low capacitance pad for semiconductor chip testing
DE3235119A1 (de) * 1982-09-22 1984-03-22 Siemens AG, 1000 Berlin und 8000 München Anordnung fuer die pruefung von mikroverdrahtungen und verfahren zu ihrem betrieb
US4789825A (en) * 1986-05-14 1988-12-06 American Telephone And Telegraph Co., At&T Bell Laboratories Integrated circuit with channel length indicator
US4760249A (en) * 1986-12-22 1988-07-26 Motorola, Inc. Logic array having multiple optical logic inputs
JPS6444042A (en) * 1987-08-12 1989-02-16 Japan Res Dev Corp Wiring of integrated circuit
US5142224A (en) * 1988-12-13 1992-08-25 Comsat Non-destructive semiconductor wafer probing system using laser pulses to generate and detect millimeter wave signals
DE3925552A1 (de) * 1989-08-02 1991-02-14 Licentia Gmbh Abtastkopf
US5059897A (en) * 1989-12-07 1991-10-22 Texas Instruments Incorporated Method and apparatus for testing passive substrates for integrated circuit mounting
US6009284A (en) * 1989-12-13 1999-12-28 The Weinberger Group, L.L.C. System and method for controlling image processing devices from a remote location
US5208531A (en) * 1990-08-13 1993-05-04 Texas Instruments Incorporated Apparatus and method for testing integrated circuits
US5317256A (en) * 1992-05-12 1994-05-31 University Of Michigan High-speed, high-impedance external photoconductive-type sampling probe/pulser
DE59913490D1 (de) * 1998-06-16 2006-07-06 Infineon Technologies Ag Einrichtung zur vermessung und analyse von elektrischen signalen eines integrierten schaltungsbausteins

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1145991A (en) * 1965-03-12 1969-03-19 Mullard Ltd Improvements in and relating to methods of manufacturing electrical circuit arrangements
FR1064185A (fr) * 1967-05-23 1954-05-11 Philips Nv Procédé de fabrication d'un système d'électrodes
US3634927A (en) * 1968-11-29 1972-01-18 Energy Conversion Devices Inc Method of selective wiring of integrated electronic circuits and the article formed thereby

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2831787A1 (de) * 1978-07-19 1980-01-31 Siemens Ag Mit hilfe eines elektronen- oder laserstrahls pruefbare, integrierte schaltungsanordnung
GB2177254A (en) * 1985-07-05 1987-01-14 Stc Plc Testing integrated circuits
EP0272506A3 (en) * 1986-12-22 1991-05-29 International Business Machines Corporation Thin film transistor array for liquid crystal displays allowing in-process testing, testing method, and information entry system comprising such an array

Also Published As

Publication number Publication date
JPS4952988A (cg-RX-API-DMAC7.html) 1974-05-23
DE2329659A1 (de) 1974-01-24
US3801910A (en) 1974-04-02
FR2191266B1 (cg-RX-API-DMAC7.html) 1977-07-29
FR2191266A1 (cg-RX-API-DMAC7.html) 1974-02-01
JPS562415B2 (cg-RX-API-DMAC7.html) 1981-01-20

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee