FR2191266B1 - - Google Patents

Info

Publication number
FR2191266B1
FR2191266B1 FR7322357A FR7322357A FR2191266B1 FR 2191266 B1 FR2191266 B1 FR 2191266B1 FR 7322357 A FR7322357 A FR 7322357A FR 7322357 A FR7322357 A FR 7322357A FR 2191266 B1 FR2191266 B1 FR 2191266B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7322357A
Other versions
FR2191266A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2191266A1 publication Critical patent/FR2191266A1/fr
Application granted granted Critical
Publication of FR2191266B1 publication Critical patent/FR2191266B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/1446—Devices controlled by radiation in a repetitive configuration

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
FR7322357A 1972-07-03 1973-06-13 Expired FR2191266B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US26840772A 1972-07-03 1972-07-03

Publications (2)

Publication Number Publication Date
FR2191266A1 FR2191266A1 (fr) 1974-02-01
FR2191266B1 true FR2191266B1 (fr) 1977-07-29

Family

ID=23022865

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7322357A Expired FR2191266B1 (fr) 1972-07-03 1973-06-13

Country Status (5)

Country Link
US (1) US3801910A (fr)
JP (1) JPS562415B2 (fr)
DE (1) DE2329659A1 (fr)
FR (1) FR2191266B1 (fr)
GB (1) GB1412052A (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2207404B1 (fr) * 1972-11-20 1976-04-23 Merlin Gerin
US3956698A (en) * 1974-02-12 1976-05-11 Westinghouse Electric Corporation Contactless test method for integrated circuits
US4053833A (en) * 1974-02-12 1977-10-11 Westinghouse Electric Corporation Contactless test method for integrated circuits
DE2831787C2 (de) * 1978-07-19 1983-02-17 Siemens AG, 1000 Berlin und 8000 München Mit Hilfe eines Elektronen- oder Laserstrahls prüfbare integrierte Schaltungsanordnung
US4404635A (en) * 1981-03-27 1983-09-13 International Business Machines Corporation Programmable integrated circuit and method of testing the circuit before it is programmed
JPS5825510A (ja) * 1981-08-10 1983-02-15 Yamaha Motor Co Ltd エンジンの組立式クランク軸
US4482863A (en) * 1981-08-14 1984-11-13 At&T Bell Laboratories Apparatus and method for measuring electronic response of high speed devices and materials
US4439727A (en) * 1981-12-21 1984-03-27 Ibm Corporation Low capacitance pad for semiconductor chip testing
DE3235119A1 (de) * 1982-09-22 1984-03-22 Siemens AG, 1000 Berlin und 8000 München Anordnung fuer die pruefung von mikroverdrahtungen und verfahren zu ihrem betrieb
GB2177254B (en) * 1985-07-05 1988-09-01 Stc Plc Testing integrated circuits
US4789825A (en) * 1986-05-14 1988-12-06 American Telephone And Telegraph Co., At&T Bell Laboratories Integrated circuit with channel length indicator
US4760249A (en) * 1986-12-22 1988-07-26 Motorola, Inc. Logic array having multiple optical logic inputs
US4819038A (en) * 1986-12-22 1989-04-04 Ibm Corporation TFT array for liquid crystal displays allowing in-process testing
JPS6444042A (en) * 1987-08-12 1989-02-16 Japan Res Dev Corp Wiring of integrated circuit
US5142224A (en) * 1988-12-13 1992-08-25 Comsat Non-destructive semiconductor wafer probing system using laser pulses to generate and detect millimeter wave signals
DE3925552A1 (de) * 1989-08-02 1991-02-14 Licentia Gmbh Abtastkopf
US5059897A (en) * 1989-12-07 1991-10-22 Texas Instruments Incorporated Method and apparatus for testing passive substrates for integrated circuit mounting
US6009284A (en) * 1989-12-13 1999-12-28 The Weinberger Group, L.L.C. System and method for controlling image processing devices from a remote location
US5208531A (en) * 1990-08-13 1993-05-04 Texas Instruments Incorporated Apparatus and method for testing integrated circuits
US5317256A (en) * 1992-05-12 1994-05-31 University Of Michigan High-speed, high-impedance external photoconductive-type sampling probe/pulser
CN1439101A (zh) * 1998-06-16 2003-08-27 因芬尼昂技术股份公司 用于测量和分析集成电路块的电信号的装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1145991A (en) * 1965-03-12 1969-03-19 Mullard Ltd Improvements in and relating to methods of manufacturing electrical circuit arrangements
FR1064185A (fr) * 1967-05-23 1954-05-11 Philips Nv Procédé de fabrication d'un système d'électrodes
US3634927A (en) * 1968-11-29 1972-01-18 Energy Conversion Devices Inc Method of selective wiring of integrated electronic circuits and the article formed thereby

Also Published As

Publication number Publication date
FR2191266A1 (fr) 1974-02-01
JPS4952988A (fr) 1974-05-23
JPS562415B2 (fr) 1981-01-20
DE2329659A1 (de) 1974-01-24
US3801910A (en) 1974-04-02
GB1412052A (en) 1975-10-29

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Legal Events

Date Code Title Description
ST Notification of lapse