GB1391563A - Faceplate assembly for an image pick-up tube and a method of making the same - Google Patents

Faceplate assembly for an image pick-up tube and a method of making the same

Info

Publication number
GB1391563A
GB1391563A GB5394172A GB5394172A GB1391563A GB 1391563 A GB1391563 A GB 1391563A GB 5394172 A GB5394172 A GB 5394172A GB 5394172 A GB5394172 A GB 5394172A GB 1391563 A GB1391563 A GB 1391563A
Authority
GB
United Kingdom
Prior art keywords
post
tube
coating
hole
interior
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5394172A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of GB1391563A publication Critical patent/GB1391563A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F11/00—Compounds of calcium, strontium, or barium
    • C01F11/20—Halides
    • C01F11/24—Chlorides
    • C01F11/32—Purification
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L97/00—Compositions of lignin-containing materials
    • C08L97/02—Lignocellulosic material, e.g. wood, straw or bagasse
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/92—Means forming part of the tube for the purpose of providing electrical connection to it
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/28—Manufacture of leading-in conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
  • Image-Pickup Tubes, Image-Amplification Tubes, And Storage Tubes (AREA)

Abstract

1391563 Leadthrough conductor SONY CORP 22 Nov 1972 [27 Nov 1971] 53941/72 Heading C1M A lead through is provided in the glass envelope of an image signal pick up tube having an electrode on its interior surface by the steps of coating a metal pass 10 having an enlarged head 14, and a main portion 12 with a deformable metal, boring a hole 30 in the envelope having a diameter between that of the head 14 and main portion 12, inserting the coated post into the hole and pressing the post to hermetically seal the post coating with the hole interior and so that the coating on the post nearest the interior of tube is deformed so as to contact a surface of the electrode. The metal post is preferably of copper and the coating of indium.
GB5394172A 1971-11-27 1972-11-22 Faceplate assembly for an image pick-up tube and a method of making the same Expired GB1391563A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP46095639A JPS4860529A (en) 1971-11-27 1971-11-27

Publications (1)

Publication Number Publication Date
GB1391563A true GB1391563A (en) 1975-04-23

Family

ID=14143067

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5394172A Expired GB1391563A (en) 1971-11-27 1972-11-22 Faceplate assembly for an image pick-up tube and a method of making the same

Country Status (9)

Country Link
US (1) US3854069A (en)
JP (1) JPS4860529A (en)
BE (1) BE514701A (en)
CA (1) CA960285A (en)
DE (1) DE2258019A1 (en)
FR (1) FR2163111A5 (en)
GB (1) GB1391563A (en)
IT (1) IT973746B (en)
NL (2) NL172902C (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS562346Y2 (en) * 1974-05-23 1981-01-20
JPS5530657B2 (en) * 1974-06-14 1980-08-12
JPS54134922A (en) * 1978-04-12 1979-10-19 Hitachi Ltd Pickup tube
NL7806822A (en) * 1978-06-24 1979-12-28 Philips Nv ELECTRICAL DISCHARGE TUBE FITTED WITH A GLASS-SEALED ELECTRICAL FEED AND METHOD FOR THE MANUFACTURE OF SUCH ELECTRICAL CONNECTION.
AUPS303702A0 (en) * 2002-06-20 2002-07-11 Metal Storm Limited A cartridge assembly for multiple projectiles
JP5535280B2 (en) * 2012-07-23 2014-07-02 株式会社不二機販 Method for strengthening welding tip and welding tip

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3040124A (en) * 1956-06-25 1962-06-19 Armour Res Found Transducer head system
US2928968A (en) * 1959-02-27 1960-03-15 Paramount Pictures Corp Cathode-ray tube switching grid support system
NL6408262A (en) * 1964-07-18 1966-01-19
DE1257875B (en) * 1966-02-11 1968-01-04 Standard Elektrik Lorenz Ag Telephone private branch exchange, especially for hotels or hospitals, in which a waiting process can be initiated when busy
US3582978A (en) * 1969-08-28 1971-06-01 Tektronix Inc Rivet-shaped electrical lead-through contact
US3714488A (en) * 1970-09-19 1973-01-30 Matsushita Electronics Corp Pick-up tube envelope sealant extending into groove of annular target support
US3665239A (en) * 1970-11-12 1972-05-23 Tektronix Inc Electrical lead-in tubular socket member for electronic tubes
JPS509859Y1 (en) * 1970-12-24 1975-03-26

Also Published As

Publication number Publication date
CA960285A (en) 1974-12-31
BE514701A (en)
NL172902C (en) 1983-11-01
NL7216073A (en) 1973-05-29
NL81793C (en)
IT973746B (en) 1974-06-10
NL172902B (en) 1983-06-01
JPS4860529A (en) 1973-08-24
US3854069A (en) 1974-12-10
DE2258019A1 (en) 1973-05-30
FR2163111A5 (en) 1973-07-20

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee