GB1385732A - Printed circuit boards - Google Patents

Printed circuit boards

Info

Publication number
GB1385732A
GB1385732A GB3937072A GB3937072A GB1385732A GB 1385732 A GB1385732 A GB 1385732A GB 3937072 A GB3937072 A GB 3937072A GB 3937072 A GB3937072 A GB 3937072A GB 1385732 A GB1385732 A GB 1385732A
Authority
GB
United Kingdom
Prior art keywords
casing
tracks
cross
layer
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3937072A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19712144078 external-priority patent/DE2144078C3/de
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of GB1385732A publication Critical patent/GB1385732A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
GB3937072A 1971-09-02 1972-08-24 Printed circuit boards Expired GB1385732A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712144078 DE2144078C3 (de) 1971-09-02 Leiterplatte mit Uberkreuzungen

Publications (1)

Publication Number Publication Date
GB1385732A true GB1385732A (en) 1975-02-26

Family

ID=5818529

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3937072A Expired GB1385732A (en) 1971-09-02 1972-08-24 Printed circuit boards

Country Status (13)

Country Link
US (1) US3816195A (cg-RX-API-DMAC7.html)
JP (1) JPS4835362A (cg-RX-API-DMAC7.html)
AR (1) AR192815A1 (cg-RX-API-DMAC7.html)
AT (1) AT337292B (cg-RX-API-DMAC7.html)
BE (1) BE788320A (cg-RX-API-DMAC7.html)
CH (1) CH548146A (cg-RX-API-DMAC7.html)
FR (1) FR2151020A1 (cg-RX-API-DMAC7.html)
GB (1) GB1385732A (cg-RX-API-DMAC7.html)
IT (1) IT964325B (cg-RX-API-DMAC7.html)
LU (1) LU65991A1 (cg-RX-API-DMAC7.html)
NL (1) NL7211416A (cg-RX-API-DMAC7.html)
SE (1) SE398036B (cg-RX-API-DMAC7.html)
ZA (1) ZA725894B (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2227887A (en) * 1988-12-24 1990-08-08 Technology Applic Company Limi Making printed circuits

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2546736C3 (de) * 1975-10-17 1980-07-31 Siemens Ag, 1000 Berlin Und 8000 Muenchen Diskretes Überkreuzungschip für einzelne Leiterbahnüberkreuzungen bei Hybridschaltungen und Verfahren zu seiner Herstellung
DE7624175U1 (de) * 1976-07-31 1976-11-25 Wilhelm Ruf Kg, 8000 Muenchen Tastatur
US5089687A (en) * 1990-10-02 1992-02-18 Ppg Industries, Inc. Bus bar jumper for heatable windshield
US5408742A (en) * 1991-10-28 1995-04-25 Martin Marietta Corporation Process for making air bridges for integrated circuits
TW340296B (en) * 1997-02-21 1998-09-11 Ricoh Microelectronics Kk Method and apparatus of concave plate printing, method and apparatus for formation of wiring diagram, the contact electrode and the printed wiring nickel substrate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3366519A (en) * 1964-01-20 1968-01-30 Texas Instruments Inc Process for manufacturing multilayer film circuits
US3395040A (en) * 1965-01-06 1968-07-30 Texas Instruments Inc Process for fabricating cryogenic devices
GB1143957A (en) * 1965-07-13 1969-02-26 Int Computers Ltd Improvements in or relating to electrical circuit structures
US3700445A (en) * 1971-07-29 1972-10-24 Us Navy Photoresist processing method for fabricating etched microcircuits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2227887A (en) * 1988-12-24 1990-08-08 Technology Applic Company Limi Making printed circuits

Also Published As

Publication number Publication date
AT337292B (de) 1977-06-27
IT964325B (it) 1974-01-21
CH548146A (de) 1974-04-11
DE2144078B2 (de) 1975-03-06
DE2144078A1 (de) 1973-03-15
BE788320A (fr) 1973-03-01
FR2151020A1 (cg-RX-API-DMAC7.html) 1973-04-13
ATA686772A (de) 1976-10-15
SE398036B (sv) 1977-11-28
LU65991A1 (cg-RX-API-DMAC7.html) 1973-03-12
ZA725894B (en) 1973-05-30
AR192815A1 (es) 1973-03-14
JPS4835362A (cg-RX-API-DMAC7.html) 1973-05-24
NL7211416A (cg-RX-API-DMAC7.html) 1973-03-06
US3816195A (en) 1974-06-11

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees