GB1376086A - Electroluminescent semiconductor devices - Google Patents

Electroluminescent semiconductor devices

Info

Publication number
GB1376086A
GB1376086A GB887172A GB887172A GB1376086A GB 1376086 A GB1376086 A GB 1376086A GB 887172 A GB887172 A GB 887172A GB 887172 A GB887172 A GB 887172A GB 1376086 A GB1376086 A GB 1376086A
Authority
GB
United Kingdom
Prior art keywords
tube
metal
pin
soldered
diodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB887172A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1376086A publication Critical patent/GB1376086A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/06—Electrode terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Electroluminescent Light Sources (AREA)
GB887172A 1971-03-01 1972-02-25 Electroluminescent semiconductor devices Expired GB1376086A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7106973A FR2127239A5 (enExample) 1971-03-01 1971-03-01

Publications (1)

Publication Number Publication Date
GB1376086A true GB1376086A (en) 1974-12-04

Family

ID=9072675

Family Applications (1)

Application Number Title Priority Date Filing Date
GB887172A Expired GB1376086A (en) 1971-03-01 1972-02-25 Electroluminescent semiconductor devices

Country Status (8)

Country Link
US (1) US3739241A (enExample)
JP (1) JPS53117175U (enExample)
AU (1) AU456731B2 (enExample)
CA (1) CA963566A (enExample)
DE (1) DE2208481A1 (enExample)
FR (1) FR2127239A5 (enExample)
GB (1) GB1376086A (enExample)
IT (1) IT947946B (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040227149A1 (en) * 2003-04-30 2004-11-18 Cree, Inc. High powered light emitter packages with compact optics
US8901585B2 (en) 2003-05-01 2014-12-02 Cree, Inc. Multiple component solid state white light
US9142734B2 (en) 2003-02-26 2015-09-22 Cree, Inc. Composite white light source and method for fabricating
US9431589B2 (en) 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages
US10615324B2 (en) 2013-06-14 2020-04-07 Cree Huizhou Solid State Lighting Company Limited Tiny 6 pin side view surface mount LED

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2155137A5 (enExample) * 1971-10-08 1973-05-18 Radiotechnique Compelec
JPS48102585A (enExample) * 1972-04-04 1973-12-22
GB1383548A (en) * 1972-06-29 1974-02-12 Plessey Co Ltd Light emitting diode assembly
GB1403801A (en) * 1973-01-30 1975-08-28 Standard Telephones Cables Ltd Semiconductor device stud mount
US3860847A (en) * 1973-04-17 1975-01-14 Los Angeles Miniature Products Hermetically sealed solid state lamp
US3946416A (en) * 1973-04-24 1976-03-23 The United States Of America As Represented By The Secretary Of The Army Low impedance diode mounting structure and housing
FR2319268A1 (fr) * 1973-07-03 1977-02-18 Radiotechnique Compelec Diode electroluminescente protegee
US4032963A (en) * 1974-09-03 1977-06-28 Motorola, Inc. Package and method for a semiconductor radiant energy emitting device
US3935501A (en) * 1975-02-13 1976-01-27 Digital Components Corporation Micro-miniature light source assemblage and mounting means therefor
DE2510982A1 (de) * 1975-03-13 1976-09-30 Bosch Gmbh Robert Hybrides halbleiterbauelement
US4054814A (en) * 1975-10-31 1977-10-18 Western Electric Company, Inc. Electroluminescent display and method of making
FR2520934B1 (fr) * 1982-01-29 1985-06-07 Radiotechnique Compelec Dispositif semi-conducteur emetteur de lumiere a multicristaux
DE3642240A1 (de) * 1986-12-10 1988-06-23 Siemens Ag Konstantstrom-lichtemittierende diode (konstantstrom led)
GB8816603D0 (en) * 1988-07-13 1988-08-17 Bt & D Technologies Ltd Optical components
US5488623A (en) * 1990-11-07 1996-01-30 Fuji Electric Co., Ltd. Mold-type semiconductor laser device with reduced light-emitting point displacement during operation
US5444726A (en) * 1990-11-07 1995-08-22 Fuji Electric Co., Ltd. Semiconductor laser device
TW253996B (enExample) * 1992-04-07 1995-08-11 Fuji Electric Co Ltd
JPH09307144A (ja) * 1996-05-14 1997-11-28 Matsushita Electric Ind Co Ltd 発光素子及びその製造方法
US5777433A (en) * 1996-07-11 1998-07-07 Hewlett-Packard Company High refractive index package material and a light emitting device encapsulated with such material
JPH11103097A (ja) * 1997-07-30 1999-04-13 Rohm Co Ltd 半導体発光素子
US6521916B2 (en) * 1999-03-15 2003-02-18 Gentex Corporation Radiation emitter device having an encapsulant with different zones of thermal conductivity
CA2430747C (en) * 2001-01-31 2008-05-20 Gentex Corporation Radiation emitter devices and method of making the same
US6942365B2 (en) * 2002-12-10 2005-09-13 Robert Galli LED lighting assembly
US7121680B2 (en) * 2001-12-10 2006-10-17 Galli Robert D LED lighting assembly with improved heat management
US7652303B2 (en) * 2001-12-10 2010-01-26 Galli Robert D LED lighting assembly
US7118255B2 (en) * 2001-12-10 2006-10-10 Galli Robert D LED lighting assembly with improved heat exchange
US6827468B2 (en) * 2001-12-10 2004-12-07 Robert D. Galli LED lighting assembly
DE10163117C5 (de) * 2001-12-24 2005-12-01 G.L.I. Global Light Industries Gmbh Verfahren zum Herstellen von lichtleitenden LED-Körpern in zwei zeitlich getrennten Stufen
US7153004B2 (en) * 2002-12-10 2006-12-26 Galli Robert D Flashlight housing
US8093620B2 (en) * 2002-12-10 2012-01-10 Galli Robert D LED lighting assembly with improved heat management
US6921927B2 (en) * 2003-08-28 2005-07-26 Agilent Technologies, Inc. System and method for enhanced LED thermal conductivity
CN101438408B (zh) * 2004-11-19 2011-04-20 皇家飞利浦电子股份有限公司 复合led模块
TW200737539A (en) * 2006-03-23 2007-10-01 Ind Tech Res Inst Light-emitting device and manufacturing method
KR101346342B1 (ko) * 2007-03-30 2013-12-31 서울반도체 주식회사 낮은 열저항을 갖는 발광 다이오드 램프
DE102007037821A1 (de) * 2007-08-10 2009-02-12 Osram Gesellschaft mit beschränkter Haftung Leuchtmodul
KR101134063B1 (ko) * 2009-09-30 2012-04-13 주식회사 세미콘라이트 3족 질화물 반도체 발광소자
DE102012104111A1 (de) * 2012-05-10 2013-11-14 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9142734B2 (en) 2003-02-26 2015-09-22 Cree, Inc. Composite white light source and method for fabricating
US20040227149A1 (en) * 2003-04-30 2004-11-18 Cree, Inc. High powered light emitter packages with compact optics
US9666772B2 (en) * 2003-04-30 2017-05-30 Cree, Inc. High powered light emitter packages with compact optics
US8901585B2 (en) 2003-05-01 2014-12-02 Cree, Inc. Multiple component solid state white light
US9431589B2 (en) 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages
US10615324B2 (en) 2013-06-14 2020-04-07 Cree Huizhou Solid State Lighting Company Limited Tiny 6 pin side view surface mount LED

Also Published As

Publication number Publication date
AU456731B2 (en) 1974-12-09
IT947946B (it) 1973-05-30
CA963566A (en) 1975-02-25
US3739241A (en) 1973-06-12
JPS53117175U (enExample) 1978-09-18
DE2208481A1 (de) 1972-09-14
FR2127239A5 (enExample) 1972-10-13
AU3930972A (en) 1973-08-30

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee