GB1367420A - Integrated circuits - Google Patents

Integrated circuits

Info

Publication number
GB1367420A
GB1367420A GB5729972A GB5729972A GB1367420A GB 1367420 A GB1367420 A GB 1367420A GB 5729972 A GB5729972 A GB 5729972A GB 5729972 A GB5729972 A GB 5729972A GB 1367420 A GB1367420 A GB 1367420A
Authority
GB
United Kingdom
Prior art keywords
sio
layer
insulant
photolithographically
deposited
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5729972A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19722207510 external-priority patent/DE2207510C3/de
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of GB1367420A publication Critical patent/GB1367420A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/03—Manufacture or treatment wherein the substrate comprises sapphire, e.g. silicon-on-sapphire [SOS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
GB5729972A 1972-02-17 1972-12-12 Integrated circuits Expired GB1367420A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722207510 DE2207510C3 (de) 1972-02-17 Verfahren zur Herstellung integrierter Schaltungen mit Halbleiterschichten auf isolierendem Substrat

Publications (1)

Publication Number Publication Date
GB1367420A true GB1367420A (en) 1974-09-18

Family

ID=5836253

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5729972A Expired GB1367420A (en) 1972-02-17 1972-12-12 Integrated circuits

Country Status (11)

Country Link
US (1) US4017769A (enExample)
JP (1) JPS4893962A (enExample)
AT (1) AT339372B (enExample)
BE (1) BE795556A (enExample)
CH (1) CH551695A (enExample)
FR (1) FR2172200B1 (enExample)
GB (1) GB1367420A (enExample)
IT (1) IT979053B (enExample)
LU (1) LU67043A1 (enExample)
NL (1) NL7302015A (enExample)
SE (1) SE377003C (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5047580A (enExample) * 1973-08-28 1975-04-28
US4262299A (en) * 1979-01-29 1981-04-14 Rca Corporation Semiconductor-on-insulator device and method for its manufacture
JPS5846174B2 (ja) * 1981-03-03 1983-10-14 株式会社東芝 半導体集積回路

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1160744A (en) * 1965-11-05 1969-08-06 Plessey Co Ltd Improvements in or relating to Semiconductor Devices
US3413145A (en) * 1965-11-29 1968-11-26 Rca Corp Method of forming a crystalline semiconductor layer on an alumina substrate
US3736193A (en) * 1970-10-26 1973-05-29 Fairchild Camera Instr Co Single crystal-polycrystalline process for electrical isolation in integrated circuits

Also Published As

Publication number Publication date
JPS4893962A (enExample) 1973-12-04
BE795556A (fr) 1973-06-18
AT339372B (de) 1977-10-10
LU67043A1 (enExample) 1973-04-19
ATA1035072A (de) 1977-02-15
IT979053B (it) 1974-09-30
SE377003C (sv) 1976-12-20
NL7302015A (enExample) 1973-08-21
US4017769A (en) 1977-04-12
DE2207510A1 (de) 1973-08-30
DE2207510B2 (de) 1974-10-24
FR2172200A1 (enExample) 1973-09-28
CH551695A (de) 1974-07-15
SE377003B (enExample) 1975-06-16
FR2172200B1 (enExample) 1978-04-14

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee