GB1353518A - Phenolic resin-polychloroprene adhesive compositions - Google Patents

Abstract

1353518 Phenolic - resin - polychloroprene adhesives SCHENECTADY CHEMICALS Inc 13 May 1971 14846/71 Headings C3R and C3P An adhesive composition comprises a chloroprene polymer and a thermoplastic heat reaction product of a zinc compound chosen from zinc resinate, zinc carbonate, zinc borate, zinc salicylate and zinc phosphate and an alkalinecondensed phenol-formaldehyde resin made by condensing formaldehyde and an alkyl-substituted phenol and/or an aryl substituted phenol in a HCHO : phenol molar ratio of from 0À395: 1 to 1À30 : 1. The alkyl phenol is preferably a C 2 -C 6 p-alkyl phenol and is preferably used together with a chlorophenol or an arylphenol such as p-phenylphenol, p-tolylphenol, alphamethyl styrylphenol and bisphenol A. The amount of zinc compound used may range from 1-75% wt. based on the final resin. The resin may be prepared in the presence of rosin usually in an amount of 20-45% wt. based on the phenols. The adhesive preferably contains 5-200 p.b.w. of the said resinous reaction product per 100 p.b.w. of polychloroprene; and may also contain a volatile organic solvent and conventional chloroprene adhesive additives. In Examples 1-4, 8-17 resins are prepared from bisphenol A, p-phenylphenol, p-t-butylphenol, formaldehyde, and additionally in Examples 1-4 and 17 rosin, and zinc resinate in Examples 1-11, or zinc salicylate, zinc borate, zinc phosphate or zinc carbonate in Examples 13-17. In Examples 5-7 the procedure of Examples 1-4 is carried out using the following mixtures of phenols: bis-phenol A, alphamethylstyrylphenol or p-chlorophenol, p-t-butylphenol; p-phenylphenol and p-t-butylphenol. The above resins are used in adhesive formulations prepared by blending: Part A comprising Neoprene 100 p.b.w., ZnO 5 p.b.w., MgO 4 p.b.w., antioxidant 2 p.b.w. with Part B comprising any one of the above resins 45 p.b.w., MgO 4À5 p.b.w., H 2 O 2 p.b.w., toluene 47À5 p.b.w.