GB1352557A - Wire scribed circuit boards - Google Patents

Wire scribed circuit boards

Info

Publication number
GB1352557A
GB1352557A GB2517971*A GB2517971A GB1352557A GB 1352557 A GB1352557 A GB 1352557A GB 2517971 A GB2517971 A GB 2517971A GB 1352557 A GB1352557 A GB 1352557A
Authority
GB
United Kingdom
Prior art keywords
circuit boards
wire scribed
scribed circuit
indium
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2517971*A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of GB1352557A publication Critical patent/GB1352557A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Abstract

1352557 Soldering KOLLMORGEN CORP 19 April 1971 [5 March 1970] 25179/71 Heading B3R [Also in Divisions H1 and H2] Through connections in a circuit board consisting of a dielectric board to which are adhered wires 14 Fig. 1G of copper coated with tin, indium or solder are made by projectile pins 23 also coated with tin, indium or solder. The board is heated to fuse the coatings.
GB2517971*A 1970-03-05 1971-04-19 Wire scribed circuit boards Expired GB1352557A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1674270A 1970-03-05 1970-03-05

Publications (1)

Publication Number Publication Date
GB1352557A true GB1352557A (en) 1974-05-08

Family

ID=21778714

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2517971*A Expired GB1352557A (en) 1970-03-05 1971-04-19 Wire scribed circuit boards

Country Status (7)

Country Link
JP (2) JPS5550399B1 (en)
AT (1) AT312731B (en)
CA (1) CA932478A (en)
DE (1) DE2111396B2 (en)
FR (1) FR2084258A5 (en)
GB (1) GB1352557A (en)
NL (1) NL173907C (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7971339B2 (en) 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8028923B2 (en) 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
US8090407B2 (en) 2007-06-27 2012-01-03 On Track Innovations Ltd. Contactless smart SIM
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8413316B2 (en) 2007-09-18 2013-04-09 Hid Global Ireland Teoranta Method for bonding a wire conductor laid on a substrate
WO2013179051A2 (en) * 2012-05-31 2013-12-05 Zytronic Displays Limited Multi-touch sensing panel production method
US8646675B2 (en) 2004-11-02 2014-02-11 Hid Global Gmbh Laying apparatus, contact-making apparatus, movement system, laying and contact-making unit, production system, method for production and a transponder unit
US10078402B2 (en) 2012-05-31 2018-09-18 Zytronic Displays Limited Touch sensitive displays

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2185915B1 (en) * 1972-05-25 1975-08-29 Commissariat Energie Atomique
FR2304247A1 (en) * 1975-03-12 1976-10-08 Commissariat Energie Atomique METHOD AND DEVICE FOR INTERCONNECTING ELECTRONIC COMPONENTS
US4065850A (en) * 1975-08-13 1978-01-03 Kollmorgen Technologies Corporation Method of making multi-wire electrical interconnecting member having a multi-wire matrix of insulated wires mechanically terminated thereon
ZA781637B (en) * 1977-06-20 1979-02-28 Kollmorgen Tech Corp Wire scribed circuit board and method for the manufacture thereof
ZA775455B (en) * 1977-08-09 1978-07-26 Kollmorgen Tech Corp Improved methods and apparatus for making scribed circuit boards
FR2424646A1 (en) * 1978-04-28 1979-11-23 Commissariat Energie Atomique CONNECTION PROCESS OF CONNECTION TERMINALS OF ELECTRICAL ASSEMBLIES
FR2458978A2 (en) * 1979-06-07 1981-01-02 Commissariat Energie Atomique METHOD AND DEVICE FOR INTERCONNECTING ELECTRONIC COMPONENTS
DE3035090C2 (en) * 1979-09-28 1995-01-26 Cii Honeywell Bull Device for wiring substrate surfaces
US4500389A (en) * 1981-04-14 1985-02-19 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components
FR2507853A1 (en) * 1981-06-12 1982-12-17 Brefdent Dominique Re-usable printed circuit board system without etching - has matrix of grooves into which wire conductors are inserted allowing formation of loop on path with aid of tool
US4450623A (en) * 1981-12-18 1984-05-29 Kollmorgen Technologies Corporation Process for the manufacture of circuit boards
EP0168602A1 (en) * 1984-06-25 1986-01-22 Kollmorgen Technologies Corporation Method for making interconnection circuit boards
US4693778A (en) * 1985-07-19 1987-09-15 Kollmorgen Technologies Corporation Apparatus for making scribed circuit boards and circuit board modifications
US4711026A (en) * 1985-07-19 1987-12-08 Kollmorgen Technologies Corporation Method of making wires scribed circuit boards
JPS6292495A (en) * 1985-09-13 1987-04-27 アドバンスト　インターコネクション　テクノロジー　インコーポレイテッド Manufacture of substrate for mutual connection of electronic parts and product manufactured by that method
DE3539040A1 (en) * 1985-11-04 1987-05-07 Telefonbau & Normalzeit Gmbh Track and circuit arrangement for printed circuit boards fitted with integrated circuits
US4972050A (en) * 1989-06-30 1990-11-20 Kollmorgen Corporation Wire scribed circuit boards and methods of their manufacture
US6137054A (en) * 1994-01-25 2000-10-24 Yazaki Corporation Wire-circuit sheet and electric junction box thereof
DE19705934C2 (en) * 1997-02-15 2001-05-17 Cubit Electronics Gmbh Method and device for introducing wire-shaped conductor wires into a substrate
JP4189707B2 (en) * 1998-12-03 2008-12-03 日立化成工業株式会社 Wiring device and method of manufacturing wiring board using the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2958018A (en) * 1955-11-07 1960-10-25 Donald O Kocmich Capacitance operated electronic control
US3234629A (en) * 1962-06-14 1966-02-15 Defiance Printed Circuit Corp Method for producing printed circuits
US3377698A (en) * 1964-09-21 1968-04-16 Gen Motors Corp Method of making an electrical circuit
FR2001647A1 (en) * 1968-02-07 1969-09-26 Photocircuits Corp

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8646675B2 (en) 2004-11-02 2014-02-11 Hid Global Gmbh Laying apparatus, contact-making apparatus, movement system, laying and contact-making unit, production system, method for production and a transponder unit
US7971339B2 (en) 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8090407B2 (en) 2007-06-27 2012-01-03 On Track Innovations Ltd. Contactless smart SIM
US8413316B2 (en) 2007-09-18 2013-04-09 Hid Global Ireland Teoranta Method for bonding a wire conductor laid on a substrate
US8028923B2 (en) 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
WO2013179051A2 (en) * 2012-05-31 2013-12-05 Zytronic Displays Limited Multi-touch sensing panel production method
WO2013179051A3 (en) * 2012-05-31 2014-02-27 Zytronic Displays Limited Multi-touch sensing panel and corresponding production method
EP2856294A2 (en) * 2012-05-31 2015-04-08 Zytronic Displays Limited Multi-touch sensing panel and corresponding production method
CN104541237A (en) * 2012-05-31 2015-04-22 齐特罗尼克显示器有限公司 Multi-touch sensing panel and corresponding production method
US10078402B2 (en) 2012-05-31 2018-09-18 Zytronic Displays Limited Touch sensitive displays
EP2856294B1 (en) * 2012-05-31 2022-09-07 Zytronic Displays Limited Multi-touch sensing panel and corresponding production method

Also Published As

Publication number Publication date
JPS5710592B1 (en) 1982-02-26
CA932478A (en) 1973-08-21
AT312731B (en) 1974-01-10
DE2111396B2 (en) 1976-04-29
NL7103009A (en) 1971-09-07
JPS5550399B1 (en) 1980-12-17
NL173907B (en) 1983-10-17
NL173907C (en) 1984-03-16
DE2111396A1 (en) 1971-09-30
FR2084258A5 (en) 1971-12-17

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Legal Events

Date Code Title Description
PS Patent sealed
PE20 Patent expired after termination of 20 years