FR2507853A1 - Re-usable printed circuit board system without etching - has matrix of grooves into which wire conductors are inserted allowing formation of loop on path with aid of tool - Google Patents

Re-usable printed circuit board system without etching - has matrix of grooves into which wire conductors are inserted allowing formation of loop on path with aid of tool Download PDF

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Publication number
FR2507853A1
FR2507853A1 FR8111789A FR8111789A FR2507853A1 FR 2507853 A1 FR2507853 A1 FR 2507853A1 FR 8111789 A FR8111789 A FR 8111789A FR 8111789 A FR8111789 A FR 8111789A FR 2507853 A1 FR2507853 A1 FR 2507853A1
Authority
FR
France
Prior art keywords
tool
grooves
loop
path
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR8111789A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BREFDENT DOMINIQUE
Original Assignee
BREFDENT DOMINIQUE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BREFDENT DOMINIQUE filed Critical BREFDENT DOMINIQUE
Priority to FR8111789A priority Critical patent/FR2507853A1/en
Publication of FR2507853A1 publication Critical patent/FR2507853A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material

Abstract

The insulating base upon the circuit is constructed and can be used for new circuits. The insulating grid has a network of orthogonal grooves with holes at their intersection points. Both faces of substrate leave a grid of grooves, allowing a high circuit density. Wires are forced into the grooves and are terminated, at the holes, at component connection points. A tool, which has a central and an eccentric prong is inserted into the holes, gripping the end of the wire. The tool is rotated to form a loop in the end of the wire. Connection is made between this loop and the component legs using a conventional solder joint.

Description

La présente invention concerne les réalisations du type "circuits imprimes" permettant de relier électriquement des composants electroniques entre eux, ceux-ci étant déposés sur un support isolant. The present invention relates to embodiments of the "printed circuit" type making it possible to electrically connect electronic components to each other, these being deposited on an insulating support.

Dans les réalisations connues de ce genre, les pistes conductrices sont faites par gravure mécanique, chimique ou encore par un procédé photographique sur une couche métallique, elle mdme déposée sur un support isolant. D'autres dispositifs utilisent l'enroulement d'ln fil mtallique sur les broches d'un support de composant prévu à cet effet, ou encore l'utilisation de rubane métalliques autocollants. In known embodiments of this kind, the conductive tracks are made by mechanical or chemical etching or even by a photographic process on a metal layer, which is itself deposited on an insulating support. Other devices use the winding of a metal wire on the pins of a component support provided for this purpose, or even the use of self-adhesive metallic tape.

Le dispositif suivant l'invention permet d'éviter l'utilIsation de produits chimiques, photographiques, ou encore de supports de composants spéciaux. te support isolant rainuré associé i un outil est caractérisé par l'insertion à force du fil métallique dans les rainures correspondantes et par la création de boucles sur ce meme fil a ide de cet outil. The device according to the invention makes it possible to avoid the use of chemicals, photographs, or even supports for special components. the grooved insulating support associated with a tool is characterized by the forced insertion of the metal wire into the corresponding grooves and by the creation of loops on this same wire a ide of this tool.

Selon la premiere variante, le support isolant peut comporter des rainures sur les deux faces apportant ainsi une densité de cablage plus importante. According to the first variant, the insulating support may have grooves on the two faces, thus providing a higher density of wiring.

Selon une deuxième variante, le fil métallique peut être colle au fond des rainures au lieu d'être encastre. According to a second variant, the metal wire can be glued to the bottom of the grooves instead of being embedded.

Selon une troisième variante, le fil métallique peut être d'une section diffrente permettant ainsi une diminution de l'épaisseur des boucles sur le support isolant. According to a third variant, the metal wire can be of a different section, thus allowing a reduction in the thickness of the loops on the insulating support.

Selon une quatrième variante, la broche centrale do l'outil peut être d'un diamètre différent de maniera à réaliser des boucles adaptes aux dimentions des connections des difforents composants. According to a fourth variant, the central spindle of the tool can be of a different diameter so as to make loops adapted to the dimensions of the connections of the different components.

Le dispositif selon l'invention (plaque plus outil) permet de réaliser tout problème d'interconnection entre composants sans qu'il soit nécessaire d'utiliser d'autres produits que le fil métal lique. The device according to the invention (plate plus tool) makes it possible to carry out any problem of interconnection between components without the need to use products other than metallic wire.

Le dessin annéxé est d'une part une vue en perspective du support
isolant, d'autre part une vue en coupe de l'outil. The appended drawing is on the one hand a perspective view of the support
insulator, on the other hand a sectional view of the tool.

Tel qu'il est représenté, le dispositif comporte un support isolant (I) muni d'un réseau de rainures orthogonales (2) chaque intersection pouvant être percée (3) pour permettre le passage de la connection du composant. tes pistes conductrices sont raliséss par l'insertion à force d'un fil métallique (4). n regard des dif férents trous (3) une boucle est forme avec le fil métallique a l'aide de l'outil (5). La jonction entre la piste conductrice et la connection du composant se fît par passage de celle-ci dans la boucle, et par soudure ensuite comme habituellement.L'insertion du fil métallique (4) est arrête peu avant le trou (3), la broche centrale (6) de l'outil est engagée dans ce trou, le fil (4) devant passer entre cette broche centrale et la broche extérieure (7). As shown, the device comprises an insulating support (I) provided with a network of orthogonal grooves (2) each intersection that can be pierced (3) to allow the connection of the component to pass. your conductive tracks are made by forcefully inserting a metal wire (4). n look at the different holes (3) a loop is formed with the wire using the tool (5). The junction between the conductive track and the component connection was made by passing the latter through the loop, and then by welding as usual. The insertion of the metal wire (4) is stopped shortly before the hole (3), the central spindle (6) of the tool is engaged in this hole, the wire (4) having to pass between this central spindle and the outer spindle (7).

Par un mouvement de rotation de l'outil, le fil se de-forme pour former une boucle. suivant l'amplitude de la rotation, une nouvelle piste peut prendre naissance soit dans le prolongement de la piste origine de la boucle, soit n formant un angle droit.By a rotary movement of the tool, the wire is deformed to form a loop. depending on the amplitude of the rotation, a new track can originate either in the extension of the origin track of the loop, or n forming a right angle.

Le présent dispositif peut Store utilis dans tous les cas où l'utilisateur ne désire pas manipuler de rpoduits chimiques ou photographiques, où lorsqu'il ne ralise que peu de circuits.  The present device can be used in all cases where the user does not wish to handle chemical or photographic products, or when he realizes only a few circuits.

les applications les plus intéressantes sont la réalisation de prototypes ou de circuits définitifs a un moindre colt, les plaques tant réutilisables a chaque instant  the most interesting applications are the production of prototypes or final circuits at a lower cost, the plates being so reusable at all times

Claims (3)

REVENDICATIONS I. Support isolant rainuré (I) associé à un outil (5) dans lequel un fil métallique (4) peut être encastré à force caractérisé par le fait que l'on peut réaliser une boucle sur le trajet de ce même fil i l'aide de l'outil (5).CLAIMS I. Grooved insulating support (I) associated with a tool (5) in which a metal wire (4) can be embedded by force characterized in that one can make a loop on the path of this same wire i l using the tool (5). 2. Support isolant selon la revendication I, caractérisé par le fait qu'il comporte des rainures (2) sur les deux faces augmentant ainsi la densite du cablage. 2. Insulating support according to claim I, characterized in that it has grooves (2) on the two faces thereby increasing the density of the wiring. 3. Support isolant selon les revendications I et 2, caract-rise par le fait que le fil métallique (4) peut être collé au fond des rainures au lieu d'être encastre à force. 3. An insulating support according to claims I and 2, characterized in that the metal wire (4) can be glued to the bottom of the grooves instead of being force-fitted. -. Fil métallique selon la revendicaIon I, caractérisé par le ait outil peut être d'une section différente afin de diminuer l'épaisseur de la boucle sur le support. -. Metal wire according to claim I, characterized by the tool can be of a different section in order to reduce the thickness of the loop on the support. 5. Outil selon la revendication I, caractérise- par le fait qu'il permet de former des boucles d'un diamètre différent adapté aux dimentions des connections des divers composants.  5. Tool according to claim I, characterized in that it allows to form loops of a different diameter adapted to the dimensions of the connections of the various components.
FR8111789A 1981-06-12 1981-06-12 Re-usable printed circuit board system without etching - has matrix of grooves into which wire conductors are inserted allowing formation of loop on path with aid of tool Withdrawn FR2507853A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8111789A FR2507853A1 (en) 1981-06-12 1981-06-12 Re-usable printed circuit board system without etching - has matrix of grooves into which wire conductors are inserted allowing formation of loop on path with aid of tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8111789A FR2507853A1 (en) 1981-06-12 1981-06-12 Re-usable printed circuit board system without etching - has matrix of grooves into which wire conductors are inserted allowing formation of loop on path with aid of tool

Publications (1)

Publication Number Publication Date
FR2507853A1 true FR2507853A1 (en) 1982-12-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
FR8111789A Withdrawn FR2507853A1 (en) 1981-06-12 1981-06-12 Re-usable printed circuit board system without etching - has matrix of grooves into which wire conductors are inserted allowing formation of loop on path with aid of tool

Country Status (1)

Country Link
FR (1) FR2507853A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0174050A2 (en) * 1984-09-06 1986-03-12 Philips Patentverwaltung GmbH Method and apparatus for ranging and guiding flexible insulated conductors
EP0284757A1 (en) * 1987-03-23 1988-10-05 Siemens Aktiengesellschaft Circuit board
US4820189A (en) * 1987-12-17 1989-04-11 Amp Incorporated Method and apparatus for electrical wiring of structural assemblies
DE102018132819A1 (en) * 2018-12-19 2020-07-09 Rehau Ag + Co Process for the production of an electrified plate

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3191100A (en) * 1963-03-07 1965-06-22 Sorvillo Eugene Laminated electric circuit mounting boards
US3516140A (en) * 1967-09-01 1970-06-23 Western Electric Co Wire wrapping tool
DE1690347A1 (en) * 1968-02-24 1971-05-13 Telefunken Patent Method of manufacturing a wiring board
FR2084258A5 (en) * 1970-03-05 1971-12-17 Kollmorgen Corp
DE2508545A1 (en) * 1975-02-27 1976-09-09 Siemens Ag Pattern of connection wires - is shaped and applied to board mechanically and there are contact holders formed by loops in wires
DE2832075A1 (en) * 1978-07-21 1980-01-31 Herbert Ing Grad Langosch Wiring system with board supporting components - uses tool with wire on underside of board around insertion holes

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3191100A (en) * 1963-03-07 1965-06-22 Sorvillo Eugene Laminated electric circuit mounting boards
US3516140A (en) * 1967-09-01 1970-06-23 Western Electric Co Wire wrapping tool
DE1690347A1 (en) * 1968-02-24 1971-05-13 Telefunken Patent Method of manufacturing a wiring board
FR2084258A5 (en) * 1970-03-05 1971-12-17 Kollmorgen Corp
DE2508545A1 (en) * 1975-02-27 1976-09-09 Siemens Ag Pattern of connection wires - is shaped and applied to board mechanically and there are contact holders formed by loops in wires
DE2832075A1 (en) * 1978-07-21 1980-01-31 Herbert Ing Grad Langosch Wiring system with board supporting components - uses tool with wire on underside of board around insertion holes

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0174050A2 (en) * 1984-09-06 1986-03-12 Philips Patentverwaltung GmbH Method and apparatus for ranging and guiding flexible insulated conductors
EP0174050A3 (en) * 1984-09-06 1987-12-23 Philips Patentverwaltung Gmbh Method and apparatus for ranging and guiding flexible insulated conductors
EP0284757A1 (en) * 1987-03-23 1988-10-05 Siemens Aktiengesellschaft Circuit board
US4820189A (en) * 1987-12-17 1989-04-11 Amp Incorporated Method and apparatus for electrical wiring of structural assemblies
EP0321286A1 (en) * 1987-12-17 1989-06-21 The Whitaker Corporation Method and apparatus for electrical wiring of structural assemblies
DE102018132819A1 (en) * 2018-12-19 2020-07-09 Rehau Ag + Co Process for the production of an electrified plate

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