DE2111396B2 - METHOD OF MANUFACTURING ELECTRIC CIRCUIT BOARDS - Google Patents

Description

8. The method according to any one of claims 1 to 5, characterized in that at least one Conductor end point is formed from a metal sleeve that penetrates the carrier material and with electrically connected to the wire of the conductor run

is.

9. The method according to any one of claims 1 to 8, characterized in that first the conductor tracks of the conductor run pattern are applied that then and preferably after Curing of the adhesion-promoting surface layer of the carrier material at the locations of conductor run ends as well as other desired locations holes are made, which the carrier material and penetrate the conductor wire, so that hole walls are formed, some of which the conductor wire end face or faces are formed and then the hole walls be metallized in a manner known per se or provided with pins or sleeves.

10. The method according to claim 9, characterized in that the connection between Wire face and pin or tube is done by soldering or welding.

11. The method according to any one of claims 1 to 8, characterized in that the carrier material initially in a manner known per se with a conductor pattern in the manner of printed circuits is provided that then one or both surfaces with a layer of insulating material are provided, which serves to anchor the wires of a conductor pattern, then the conductor wires applied and anchored at the same time and finally the connection between Printed circuit conductors and those made of wire and the outside world or between conductors of the various conductor patterns according to claim 9 or 10 takes place.

12. The method according to any one of claims 1 to 11, characterized in that the thermal energy for anchoring the wire is supplied as ultrasonic energy during laying.

The present invention relates to a method for producing electrical circuit boards from flat Carrier material and from conductor tracks, consisting of solid or hollow wire, which on the Carrier material are arranged and there a conductor trim Form from wire sections, in which the or the like on a supply drum. located Wire by means of a guide device, such as a nozzle or the like. On the surface of the carrier material is attached.

A known method of this type for applying jumper wires to plate-shaped carriers in nuclear reporting, especially telephone system ^

is characterized in that the jumper wires are fixed by looping into holes in the plates (DT-AS 1245 469). The wiring is done with a routing head, which is preferably automatic is controlled, this according to the sewing machine principle as loose in stripped areas Loop is inserted into openings provided for this purpose in the insulating material carrier in order to be able to use a type Weft to be anchored.

In this way, plate wiring is obtained in which during the laying process the Jumper wire can be subjected to a very large pull without loosening places loosen again and at which heavy components can be attached to the laid jumper wire, without it being torn off the plate, but no wiring that is related to the manufacturing process Repeatability and precise alignment of the wire sections are the ones of interest here Requirement is sufficient.

Another known method (US Pat. No. 2,958,926) involves wiring an electrical Network or a base plate subunit anchored on a plate-shaped insulating material in such a way that folded jumper wire sections are passed through the insulating material and as connecting elements that protrude on the other side. The individuals forming the ladder trains Wires are loose between the anchoring points, i.e. not on the surface of the substrate determined, but only in the specific connection points in the carrier material thereby anchored that special wire loops that extend through the carrier material are formed stick out on the other side. With such anchoring it is necessarily impossible for that to ensure that the individual conductor tracks are firmly and immovable on the surface of the carrier material are set; However, such an immovable setting is not only beneficial to one particularly To achieve high conductor density, it also makes it possible to produce conductor tracks in which the wire a discontinuity in the path between two connection points - for example a kink point, having.

The options were previously only available for printed circuits, but for conductor tracks high density is known to require a lot of time and effort to create the corresponding circuit drawings or photographic images as To prepare templates for the production of the circuits and to transfer them to the carrier plates. Next to The relatively high costs also have other disadvantages associated with these processes. For example the high density printed conductor lines produced in this way are proportionate thin and prone to short circuits and interruptions. Also, printed conductors tend to do so to be firmly bonded to the base that subsequent changes or repairs are very good difficult and costly, if not practical not possible. Printed circuits are therefore undoubtedly only economically attractive for mass production.

The printed circuits were originally designed for the mass production of electronic devices with uncomplicated, proportionate to give away cheap components. For modern technology that requires a high density of conductors on a small scale When there is room for relatively low numbers of items, conventional printed circuit technology is not always advantageous. It will be therefore increasingly used wire circuits of the type mentioned. In the preparation of of wired circuits, the tool costs are lower and they are therefore suitable for small quantities cheaper, the conductor density as a result of the type of installation mentioned but even less than with comparatively printed circuits.

In this context, it is already known for wire-laid circuit boards, the wire sections to be glued to the base (US-PS

i's 3 353 263). The connection page of the Insulation plate provided with an insulating film, and although in an enlarged pad area, so that subsequently again an electrical conductor, the is unwound from a wire spool onto this insulating layer can be laid.

Finally, it is also known to bare wires before their final anchoring and after laying ai'f to be temporarily fixed on a base (US Pat. No. 3,247,314). The temporary holding is done by means of Cling clips and is therefore complex, time consuming and flawed in terms of accuracy.

A device for attaching bare conductor wires to thermoplastic plastic veneer layers should also be provided Find discussion (DT-PS 1 183 151), preferably by heating wire points by electric shock, the laying in insulating panels ^ between two electrodes are made can, which then inevitably can only be of a thermoplastic nature.

The object on which the present invention is based is to create a method of type mentioned at the beginning, in which neither the mentioned defects of the printed circuits nor those of the Wired circuits should be present, so that with great adaptability and subsequently less expensive The possibility of changing the wire circuit results in a high conductor density with precisely reproducible and Permissive laying, including any necessary kink points, becomes possible.

The solution to this problem is achieved by the features specified in claim 1.

Further developments of this solution to the problem and advantageous refinements emerge from the subclaims.

Thus, according to the present method, there are no exact drawings even for the highest conductor densities or photographic templates - as in the case of printed circuits - are more necessary and can be as desired many absolutely identical circuits are made.

The circuit diagram can contain any shaped conductor with kink points and with any number of crossing points. In a characteristic starting form The circuit consists of a conductor with multiple kink points, one at each end Connection Clement possesses.

! The "wired circuit" to be called The appearance of a printed circuit board is largely similar to a printed circuit board. Repairs. Changes and exchanging individual conductors is very easy and can be carried out by hand. If necessary, it is easily possible. To "write" circuits on carrier plates that are already connected to grounding or power

5 * 6

connections or the like are provided, or kink points in a Lcitcrabschnitt is practical on those on the other or even on the unlimited. The conductor track can also settle Side carry a printed circuit board. cross existing conductors. In addition to the

The position of the conductors, whether straight or kinked, is given by the individual conductor sections due to the direct fixation on the top 5 closing elements, additional connection elements surface of the carrier plate can be absolutely unchangeable; Be provided at any points on the carrier plate from the connection points with the connection, for example by drilling or punching elements, the conductors do not have any discontinuity of holes. At least at crossing points must be insulated ^on · ^the wire used. It is therefore

The method for producing with buckling ₁₀ part for the circuits according to the invention in the

dotted ladders should be used in the following with- As a rule, insulated wire,
For example, illustrated with the aid of the drawings. The present method runs as follows

and are described in more detail. It show from:

Fig. 1A to 1H representations of the individual components.

Driving steps of the method _{,, 5} guiding head of a wire guide device.

Fig. 2 is a plan view of a finished, after which the guide head is located above the carrier method manufactured circuit board, plate and is together with the device so in

Fig. 3 is a plan view corresponding to FIG. 2, but its movement sequences are controlled as it is the

Requires wiring diagram after making holes for further requests. In addition, a pre

closing elements, ₂₀ direction provided, which is equal to the surface

3A shows a plan view of the part of the conductor with adhesive properties at the same time as the wire laying

Plate in which the connection elements were attached and with it the wire at the same time

the one that is connected to other components because it touches the surface, is also fixed on it!

^nen ' ^The process will be explained in detail later

Fig. 4 is a plan view of a circuit board, which are _{labeled a5} .

a "wired circuit" covered. As shown in FIGS. 1 to 4, there is the obstruction should, or on the back of such a system 10 made of a carrier plate 11 which is made of thermo should be, plastic or thermosetting resin or made of

Fig. 5 is an enlarged representation of a conductor ceramic, and a coating of a heat plate, which is embedded on one side with a printed _{adhesive 12, which can be hardened on the 3O} meander, in which the insulated conductor carries a "wired" circuit, and which is partially cured before embedding and to which another component is attached to the conductor tracks. The conductor 14 ^was ' made before it came into contact with the surface

Fig. 6 is an enlarged view of another coming of the carrier plate, with a non-conductive one

usable connection _{element, 35} coating of thermosetting resin od the like verse-

Fig. 7 is a schematic representation of the wire, which from the adhesive on the carrier plate

guiding device for carrying out the process surface cannot be attacked and is resistant to

^re " ^s : _ _{.. _ u} . _{J u Λ} . _J " ^{which are} necessary for the complete hardening of the adhesive.

7 A shows a cross section through the temperature with the previous one. The insulation cover on the

direction of FIG. 7 on the support surface on overall wires ₄₀ is not required in every case and in

brought wire, some applications can also use bare wire

Fig. 8 is a perspective view of the fore used,
7 and insulated lead wires are on the support plate

9, 9 A, 9B individual process steps of the loading 11 brought and embedded in this

The process of strengthening with the device of Fig. 7 ₄₅ can be done in such a way that the ladder in the

wire "written" on the support plate. as desired by the programmed guided

According to the method according to the invention, the th guide head is brought onto the carrier plate surface ee wire on or in the surface of a carrier plate, as described above or that this is placed and anchored immediately on or in this. The otherwise geDraht on the surface of the support plate are first adhesively bonded from the start point to the end _50th By applying the conductor tracks, cutting them off there and then pressing them into the surface or the surface from a further starting point to the next surface covering, and then guiding the surface end point and cutting it off again there and cured. For this purpose, the conductors are pressed by means of a roller and so on until the desired circuit diagram is completely pressed into the surface and then the carrier plate is written and anchored. _The thermosetting resin is either used to anchor the wire on the support surface by heating the entire conductor bar or before it is particularly advantageous to cure the surface by heating only the conductor due to pressure or heat or due to sound vibrations or the like. Iso radiation with energy sources such as light _{6o Herten conductors can give adhesive} properties on one or both surfaces or sound. surfaces of the carrier plate are attached. Also can

When using such a carrier plate, the circuit board with connecting elements of all types of surface will be provided at the same time with the wireframe. The process can also be activated for the ER-adhesive property of the surface and the addition of an insulating plate in front of the wire thereby fixed immediately. Be used by the immediate financial ₆₅ handenen printed circuits simply xation of the wire, it is readily possible that in such a case, an insulated wire and a direction of the same conductor laid during the print on the circuit
To change "spelling". The number of specifiable In the manufacture of circuits according to the specified

lying processes, the conductors are preferably made first and the holes punched afterwards or drilled, from the side provided with conductors, so that the conductor ends are clean and conductive develop. Then pins or the like are in the holes. introduced and this with the conductor ends connected by welding or soldering. The hole walls can advantageously be pretreated in this way be that they act catalytically for electroless metal deposition. Can also be used for the carrier plate Use material that is already catalytically active on the metal deposition through a special manufacturing process works.

In Fig. 1A to IH, the carrier plate consists of insulating material, which with an adhesive layer 12, preferably made of a semi-hardened, heat-hardenable Resin so that it is solid at room temperature, but with relatively little exposure to heat Has adhesive properties.

The wire 14 is "written" onto the carrier plate 22 and then firmly connected to it and after the method has been carried out completely results in the circuit shown in FIG. 1B. Of the Wire 14 preferably has an insulating coating 19 in order to short-circuits closely adjacent conductors or to Avoid crossing points. In this way, a very high conductor density can be achieved, see above that multilayer circuits can be avoided in most cases. The solid connection of the Conductor with the surface can be obtained by immersing the conductors in the thermosetting adhesive 12 are pressed in, with the simultaneous application of pressure and heat. Another possibility is to apply a solid cover layer to the adhesive layer 12 and both by thermosetting to be firmly connected to each other. Such a circuit is shown in Fig. IC.

As mentioned earlier, the holes are then drilled at the ends of the conductors or at those points where additional connection elements are desired. End as previously described the conductors in the metallization of the inner wall 15 of the holes. A corresponding illustration can be found in Figure 1D. Fig. 1E shows the connection holes with the Hole inner wall metallization 16. The conductor wires at the desired contact points can, for example can be split by hammering pins and thereby establish intimate contact. at This process eliminates the need for drilling or punching holes. Such a circuit is shown in Fig. IG shown, the pins 23 split the conductor wires 14 at the contact points 14 '. Preferably the Contact pins 23 coated with a easily melting metal or an alloy and by a Heat treatment produced an intimate contact between the lead wires and the connecting pins. If the pins are hollow, they can be designed in the manner of solder lugs. Such an embodiment is shown in Figure 1H. The formed solder lug 27 is covered with a low-melting metal coated like 27 ', by a heat treatment the coating melts and an intimate contact with the Conductor 14 'is made.

Another embodiment is shown in Fig. IF. In this case, the completely laid out circuit is provided with holes 29. Each hole is surrounded by a soldering eyelet 33 with a contact pin 33 '. The contact pins 33 ' protrude beyond the underside of the carrier plate. The conductor 14 'is firmly connected to the solder lug 33. The connection is made in the way that a special wire is used for the conductors, this is insulated with a plastic coating, but has a layer of easily melting metal under this coating. If the wire is now subjected to a heat treatment, for example with a soldering iron or the like, the plastic coating and the one underneath melts

ίο located low melting point metal is also liquid and connects solder lug and wire.

Fig. 2 shows a circuit board containing a plurality of conductors of various lengths and shapes. For example, the conductors 14a and 14b are completely straight and extend beyond the rest of the circuit. Others, such as those shown in Figure 14c, have a number of kink and crossing points with other conductors. Other conductors, such as 14d, are comparatively very short.

Figure 3 shows the circuit board of Figure 2 after holes have been drilled into it. Some of the holes are located at the ends of the ladder. Others, such as hole 15a in conductor 14i>, share the Conductor in two or more conductor segments; the en-

2 _{S of} the conductor segments are in the wall of the hole in order to make good contact with the connection elements. There are also some additional holes on the circuit board that are neither at the wire ends nor even in contact with the conductors. These are intended for other electrical components. The wire thickness used for the conductors is between 8 and 80 μ - wire of 20 μ is very often used - a polyamide, for example, is used as a coating. An insulated wire of 20 μ corresponds in its electrical properties to a printed copper conductor of 40 μ. When using 20 μ conductor wire thickness, the holes in the circuit boards are usually 120 μ; with thinner wire, their clear width is correspondingly smaller, around 50 μ.

In Fig. 4 is a printed circuit board mounted on the back of the circuit board of FIGS shown. The conductor 28 is provided for grounding and power supply.

FIG. 5 shows a cross section through the circuit boards of FIGS. 3 and 4. The conductors 14 are open embedded in the adhesive layer 12 in the manner described above. The component 30 is provided with pins 30a and 3Of? provided, which were introduced into the holes 15 and here on the metallized inner wall of the hole Establish contact with conductors 14. The "wired circuit", which according to the present is made, is connected in a conventional manner with the remaining components. As shown in Fig. 3A connection fingers 8 are provided for this purpose; in FIG. 6 the rivets 102 serve for this purpose.

Various methods have been developed for the actual "wire-writing process". So can In one embodiment, ultrasonic energy is used to secure the wire in the adhesive layer 12 will. This works simultaneously with the guide head. This embodiment is shown in Fig. 7 shown. The wire emerges from a storage

_6th tube out and is brought into the desired position by the movement of the apparatus under the influence of a pressure foot provided with energy by ultrasound; at the same time the surface is softened.

609 518/358

The clearance between the board and the wire-writing device is large enough to avoid wire crossings to allow.

What happens is the following: The wire 14 is up to half its diameter in the adhesive layer embedded. A groove is thereby formed on each side of the wire, as shown in FIG. 7A. This causes the wire to adhere particularly well to the base. The speed of the Process averages 8 cm / sec. A very good adhesive strength is achieved in this way. But it is It is quite conceivable that even higher speeds of up to 30 cm / sec and above can be achieved. In the characteristic embodiment of FIG. 7, the wire becomes according to eight different direction vectors designed. Next to the ultrasonic pressure foot is the guide head with a mechanism provided, which cuts the wire ends and dispenses wire again at the beginning of the new line. the The direction of wire guidance is given by the movement of the work table relative to the guide head. The guide head is controlled automatically. During the "writing process" the leader lays down the wire on the surface of the carrier and at the same time ensures its attachment to this. With everyone The kink point forms and guides the wire in the desired direction. In the end everyone Line he cuts the wire. The automatic control of the guide head causes the big ones Advantages of circuit manufacture by means of "wireframe"; not just that, an exact localization of the conductor run is guaranteed and this is exactly reproducible, but can also they are precisely designated in advance and determined by numerical data.

The method described above can be characterized as follows: The automatically controlled work table receives control pulses in the X or Y direction. Each position affects either the beginning or the end of a ladder section or a kink in the ladder where it changes direction. The work table moves linearly between the individual positions. The guide head responds to control impulses. When the circuit has been completed, it is removed from the workbench and placed in a press for three minutes and at the same time exposed to a suitable temperature. This process serves to solidify the embedded wires in the adhesive layer. This adhesive layer is then fully cured by keeping it at a temperature of about 160 ° C. for about one hour. The control impulses transmitted to the guide head can be, for example, as follows:

(1) Turn the wire feed system clockwise in 1 to 4 steps of 45 ° each.

(2) As (1), but in the opposite direction of rotation:

(3) feed new wire;

(4) lower the pressure foot;

(5) lift the presser foot and cut the wire. ίο The wire-writing device is in its essentials Outlines shown in Figures 8 to 9B. The work table can be controlled by the engine 18 can be moved freely in two coordinates. The plate can therefore be moved in all four directions and their Movement exactly, according to the pre-drawn program, controlled with the program of the guide head is coordinated. The insulated wire 20 passes through the wire guide 21; after leaving it goes out of the wire guide under a U-shaped

ao shaped opening 22 of the guide head 24 therethrough. The guide head is just lifted in the picture; it lowers itself around the wire on the plate surface bring to. A heating coil 25 is coupled to the guide head and holds it on the

a ₅ desired temperature (1) to preheat the thermosetting resin of the cover layer 12 (2) and then to heat this layer to such an extent that it is softened so that the wire can be embedded in it. A cutting device 26 is arranged adjacent to the guide head, between the head and the twist guide 21. The cutting device is not in operation here, it is lowered at the end of each "writing line" or each conductor in order to cut it off from the supply wire. A special mechanism 30 advances a corresponding piece of wire at the beginning of the new line. This mechanism also includes rollers 31 and 32. When the guide head starts moving, it is first lowered so that the legs 34 touch the carrier plates. Then the conductor 14 is partially pressed into the resin coating composition. At the moment in which the guide head touches the coating compound 12, namely, as shown in FIG. 9, at points 35, it begins to heat the resin. The latter is thereby softened and small bumps are formed on the edges. When the head reaches its end position and the legs 34 touch the carrier plate 11, the edge beads 37 have formed around the conductor. The accomplished

J ₀ embedding is shown in Fig. 9 A and 9B; the indentation furrows 38 are produced by the legs 34.

In addition 7 sheets of drawings

Claims (7)

Patent claims: 1. Process for the production of electrical circuit boards from flat carrier material and from Conductor tracks, consisting of solid or hollow wire, which are arranged on the carrier material are and there form a conductor pattern from wire sections, in which the on one Storage drum or the like. Wire located by means of a guide device such as a nozzle or the like. is attached, characterized in that the on the carrier material after wire provided with an insulating layer directly to a predetermined pattern is fixed in its position when it is placed on the surface of the carrier material by the latter Adhesive properties are imparted to the surface when the wire is laid down, so that the conductor tracks are set in their geometric position to each other and to the carrier material and the course of a each ladder line is congruent with that of the guiding device when it is applied traversed path, wherein the path is at least one of the conductor tracks in at least one Point runs discontinuously or has a kink point and at least two conductor tracks one Have cross point, and that the conductor tracks, which have any shape, in their length determined by the two end points of the connection network assigned to the conductor run in question will. 2. The method according to claim 1, characterized in that the carrier material with a Layer is provided, which consists of a thermosetting Material consists, and that this layer at least partially locally when a wire is laid is hardened. 3. The method according to claim 2, characterized in that the thermosetting material The existing layer is first made adhesive by heat when the wire is applied and is hardened to the extent that the wire is clearly and reliably fixed in its position, and that the Layer is fully cured in a later process step. 4. The method according to claim 2 or 3, characterized in that the simultaneous with the application the anchoring of the wire is brought about by the fact that the Wire or the point in contact with this on the surface of the carrier material a component of the wire guide device is supplied with thermal energy, which the anchoring of the conductor material in the surface layer of the carrier material. 5. The method according to any one of claims 1 to 4. characterized in that the wire upon reaching the end point of the relevant Conductor path associated connection network by means of a component of the wire guide device is cut off. 6. The method according to any one of claims 1 to 5, characterized in that at least one Conductor end point by drilling or punching one of the conductor lines and the carrier material penetrating hole is formed, the wall of which in a known manner with a metal coating is provided so that the conductor run ends in the perforated wall metallization. 7. The method according to any one of claims 1 to 5, characterized in that at least one Conductor end point consists of a contact pin that penetrates the carrier material and with electrically connected to the wire of the conductor run