DE2111396A1 - Manufacture of electrical circuits by means of wire writing - Google Patents

Description

PefeBlanwSiti
ΙβίΙθΓ U. FiBHninfl · Berlin ,, March 5th , 1971

lBerHnlO
Oldenburgallee ID 2111396

PHOTOCIRCUITS DIYISTOIi OP KOLLMORGEF CORPORATION

GLEN COVE, NEW YORK, UNITED STATES OF AMERIiCA

MANUFACTURE OF ELECTRICAL CIRCUITS MEANS ^w WIRE MAGAZINE "PROCESS"

The present invention shows a new method for solving the "problems that arise in the production of electrical circuits in modern electronics. The method according to the invention includes wire writing by means of which an electrical circuit is applied to an insulating material and .. is firmly connected to it" The wire is guided line by line from one side to the other according to a desired connection scheme and immediately anchored on the carrier plate, thus producing a wired image of the circuit diagram applied wire ends or can be connected by electrical components

Externally, these circuits are similar to printed circuits, but their manufacture is simpler in that no exact drawings or other graphical representation of the desired circuit is required, and repairs of such wired circuits can be carried out very easily and quickly; are.

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It is common practice to use electrical circuits in an automatic or at least semi-automatic manner for this purpose, the various processes of printed circuit technology are used from the printing and etching technology bia to the additive process. The printed one Circuit technology is characterized by the fact that non-insulated electrical conductors ... directly onto the carrier plate be brought and firmly connected to it. In the process used for this purpose, a sublime or an embossed image of the switching theme in the form of conductive metal on or in the surface of the carrier plate.

, In the manufacture of printed circuit boards

wifid a lot of time and effort is required to find the appropriate Produce circuit drawings or photographic images of the circuits and transfer them to the carrier plates transfer. In addition to the relatively high costs, there are also other disadvantages associated with these methods. For example the printed conductor lines produced in this way are relatively thin and therefore tend to Short circuits and interruptions. In addition, printed conductors tend to be so firmly bonded to the base to be that changes or repairs are very difficult and expensive that that are practically impossible.

Despite what has just been said, printed circuits are for mass production like they are for radios and televisions and other communications equipment are needed / economically attractive, ί / a here the high cost of the print templates play a subordinate role.

Lately it has also been possible to manufacture ugfidjiuokte mini-actuator circuits, and at the same time to greatly increase the conductor density and the number of output conductors per area) in order to meet the needs of modern technology and to develop enough conductors in a small space. in which the conductor cables are arranged one above the other in several levels

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l / l ¹ y

Multi-level circuits are known and introduced in the art. In this way one could meet the needs of the correspond to modern technology, but the manufacturing costs for such multilevel circuits are very high, and Changes to such circuits or repairs are practically impossible.

The printed circuits were originally designed for the mass production of electronic Equipment with uncomplicated, relatively cheap, components to be provided. Pure modern technology, the one A high density of conductors in a small space for relatively small quantities is required, the conventional printed one Circuit technology unusable. Wire circuits are therefore being used to an ever greater extent. at In the manufacture of wired circuits, the tool costs are lower and they are therefore suitable for small quantities cheaper; However, the material costs are higher, the weight is greater and the conductor density is lower than with comparable printed circuits.

The subject of the present invention is a ·. · Method which neither the defect of the printed circuits nor that of wire circuits · The "wire-written circuits" method has the adaptability the wired circuit and the high density of conductors and all the other conveniences of printed circuit boards.

"Wirewritten circuits" have already been developed, these lead an endless wire from one side of the carrier plate to the other, cut the wire at each end of the line and allow the wire to adhere firmly to the carrier plate. In this way, an image of the circuit diagram is placed on the carrier plate. The "wirewritten scarf lines" according to the invention described here are provided with output or connecting wires ^{sinr 1;} to which either connecting wires or electrical components can be connected.

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According to the method according to the invention no exact drawings or photographic templates required, but any number of absolutely identical circuits can be produced.

The circuit diagram can be “conductors of any shape contained in a high density of conductors with almost any number of crossing points. In a characteristic Aub, design form the circuit consists of a conductor "■ · ' with several kink points, at each end a connection element owns.

The "written" circuit is externally similar largely borrowed from a printed circuit board. It can be any many completely identical circuits are made. Repairs, changes and switching off on ' individual ladder is very simple and can be carried out by hand. If necessary / it is also easily possible To "write" circuits on backing plates, that already provided with earthing or power connections or the like are, or on aolchen, on the other or even carry a printed circuit on the same side »

The eriinamv; ar; cMu. ^: lfe method essentially concerns the "writing" with a continuous wire on a Triigerplatte, according to a given circuit diagram with very specific wire sections, which are fixed from point to point on the carrier plate. The wire ends are connected with connection elements. ^ Is such for example metal-plated holes, pins, Lötöseia or the like to connect either the wire ends with each other or with electrical components. The connecting elements may be in either the support plate or be guided by these, and, if it should be desirable / it can also Practice r the support plane of the plate protrude,

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prefabricated "written circuit" consists of a sheet of insulating material and a plurality of preformed wire conductors laid on the surface firmly adhere to the carrier plate. * _ In a characteristic Embodiment is at least one, mostly in one Large number of existing conductors, not straight in its course between the terminals, but with kinks Mistake. The position of the ladder, whether straight or bent, is determined by fixing it on the surface of the carrier plate absolutely unchangeable »apart from the connection points with the connecting elements, the * Do not conduct any discontinuity.

, The process of making with kink points provided head will be clarified in the following description, as well as on the basis of the drawings.

; According to the method according to the invention, the wire is placed on or in the surface of the carrier plate and immediately anchored on or in it. The wire is first led from point 1 to point two, at point two cut off and then led from point 3 to point 4 and there again cut off and so; _fqrt, to ·. the desired. '' ■ circuit diagram completely on the carrier plate is written and anchored there. Any number of absolutely identical circuits can then be "written" will.

There are a number of possibilities for anchoring the wire to the carrier surface, including mechanical and chemical methods. The best results have so far been achieved when the surface or the surface coating of the carrier plate. even through appropriate activation / be it chemically or through the action of pressure or heat or through irradiation with appropriate energy sources / such as light or sound, the adhesion of the wire is effected.

109840/119 θ "

When using a; Such a carrier plate surface is activated at the same time with the wire writing, the adhesive properties of the surface and the wire is thereby fixed immediately. Due to the immediate fixing of the wire, it is easily possible / to change the direction of the same conductor during the "writing" and ao Knickpunfcfeeira conductor see below . The number of these Kfiickpunkte in the same conductor section is virtually "unlimited. -Also, the interconnect also be bent or a conductor can also cross existing ladder, the finished circuit can ^h ei8pielsweise a plurality of conductors verscliieaener large exhibit ^ extending in different directions extend and have kinks and crossing points. In addition to the connection elements given by the individual conductor sections, further connection elements can be provided at any points on the carrier plate / for example by drilling or punching holes, this will be explained later here wa.; "3: - n

Ea goes without saying that the wire is on the ^ -reusungspunkts must be isolated, so it would for the circuits according to the invention in the Hegel insulated wire used.

The production of the circuit boards according to the invention. A method plays in fact as follows: from a supply reel, the wire is guided into the lTührungskopf "Sieser is located above the support plate and is controlled in accordance with this so vde.es-J ^r requires the desired circuit diagram. In addition, a device is provided which, at the same time as the wire is laid, gives the surface adhesive properties and thus fixes the wire to it at the same time as it touches the surface The accompanying drawings serve to describe the method according to the invention.

109840 / 1-1Θ0-

Figures 1A-H are representations of the individual process steps of the process according to the invention. -

Figure 2 is a top plan view of a completed circuit board according to the invention;

Figure 3 is a plan view of the same circuit board as in Figure 2 after holes have been drilled in that board for additional connectors;

Figure 3 A is a plan view of the portion in which the connecting elements have been attached, which are intended only connection to further components of the same circuit board _/;

Figure 4 is a top plan view of a printed circuit board connected to a "wired circuit" should be considered; or one on the back should be attached.

Figure 5 is an enlarged view a circuit board with a printed on one side * ~ - * one, "wired" Circuit carries, and to which a second component was added;

FIG. 6 shows an enlarged illustration of a different connecting element than that in FIG. 3A connection finger shown;

Figure 7 shows a schematic representation of the wire guide apparatus as it is according to the invention Method can be used;

FIG. 7A shows a cross section through the device with the apparatus of FIG. 7 onto the carrier plate surface brought wire;

Figure 8 is a perspective view,

which the apparatus shown in FIG. 7 in more detail shows;

Figures 9,9Λ and 9B show the individual Process steps of the fastening process of the with the • Apparatus of Figure 7 "written" on the carrier plate Wire?

Figure 10 is a more complete representation of the i'igur 9 / apparatus showing some fragments are folded away to provide a better view will j

Figures 11 and 12 are front and side views of the same apparatus.

As shown in Figures 1-4, the

Switchboard 10 has a carrier plate 11 made of thermoplastic or thermosetting resin material or ceramic, which is preferably reinforced and non-conductive. In an exemplary representation of the invention, the carrier plate 11 is provided with an over-eye, in which the insulated conductor wires are embedded, which consists of a thermosetting adhesive /1,2, which is partially cured before the conductor tracks are embedded. Before they come into contact with the carrier plate surface, the conductors are provided with a non-conductive coating 19, which can consist of thermosetting resin or something similar, which cannot be attacked by the adhesive on the carrier plate surface and which is completely resistant to it Hardening of the glue required temperature. The insulation coating on the wires is not required in every case, and in some cases even bare wire can be used in advance. In other cases, however, in which the packing of the conductors is very close and intersections occur, it is

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necessary to choose the wire insulation so that it can withstand the later operating voltage.

Insulated conductor wires have been brought onto the carrier plate 11 and embedded in it be glued to the surface of the carrier plate. After all conductor tracks have been applied, they are pressed into the surface or the surface coating and then the surface is cured. The conductors are pressed into the surface by means of a roller / then the thermosetting resin is cured either by heating the circuit board or by heating the conductors. ^ ¹ Treatment with thermal radiation, ultrasonic vibrations or the like is sufficient for this hardening.

The insulated conductors can be attached to one or both surfaces of the carrier plate by means of the guide head be brought to the surface of the carrier plate 11 in a desired manner, or they can only be brought to one side if the other already has a printed circuit, for example, as will be described later here. Furthermore, the circuit board can have connection elements of all kinds for earthing and mains voltage etc. are provided.

The method according to the invention can therefore also be used to supplement printed items that have already been produced Circuits are used. In an aolo pail The insulated wire will actually be printed over the Circuit written.

■ - 9 109840/1190

In the production of circuits according to the method according to the invention, the conductors are preferably first produced and the holes are punched or drilled afterwards, preferably these are drilled or punched from the side provided with the conductors so that clean and conductive conductor ends are produced. Then pins or tubes are inserted into the holes and these are connected to the conductor ends by welding or soldering or a similar process. Preferably, however, the perforated shells are pretreated in such a way that they act catalytically for the electroless metal deposition. This is usually achieved by sensitizing with a tin-palladium solution, followed by immersion in an electroless metal-plating bath, in which case the metal can be copper or nickel , Gold or a similar metal. The metal layer on the wall of the hole is in close contact with the end of the conductor. Preferably used for the carrier plate material / already durcli a special Herstellungsver which -. "^ Drive catalytically on the metal deposition acts In this case, the S _e naibilisierungsschritt superfluous, and thus also the application of a resist mask that is required during the Sensibiliaierens to the to prevent formation of a .leitfähigen layer on the surface, the intended electrical .Bauteile can be connected in the usual way with the connecting elements by this method. ^a _s i connection elements for electrical components or housing. ■

As already mentioned, the circuit according to the invention combines the advantages of the printed circuit with the advantages of the conventional wire circuit in that it permits both a large conductor density and enables repairs to be carried out easily. In addition, the cylindrical wire shape allows a far greater current capacity with the same duration as printed conductors.

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Al

The present invention has heretofore been made exclusively in its application to wire-shaped electrical conductors ". However, it is readily applicable to optical Conductor applicable, the wire being replaced by an optical beam, and its insulating coating is formed by rays with different optical properties than those of the inner beam. For example, the "insulation jacket" simply has one different refractive index than the "conductor" and thereby prevents the escape of the. inner rays.

Now continue to worry about the drawings. In. 1A int 11 riie carrier plate made of insulating material, which with an adhesive layer 12 preferably consists of a semi-hardened thermosetting resin so that it is not sticky at room temperature, but at a relatively low level. Has heat exposure adhesive properties, is provided.

The wire H is on the carrier plate. 11 "written" unn: "fluidly connected to this and "results in the circuit shown in FIG. 1B after the method has been carried out completely.

The wire 14 preferably has an insulating coating 19 / Um short circuits of closely adjacent conductors or to avoid at crossing points; this way can a very high conductor density can be achieved, so that multilayer circuits avoided in most cases can be.

The solid connection of the conductors to the surface can be achieved in that the conductors are pressed into the thermosetting coating layer 12 using pressure and heat at the same time, another possibility is to apply a solid cover layer to the layer 12 accommodate and to connect both by ^M ärmeaushärtun ^ to each other. Such a circuit is shown in Figure 1C.

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Al

As mentioned earlier ^ the holes then drilled at the ends of the ladder or at those points where additional connection elements are desired. As previously described, end. .....

the conductors in the metallization of the inner wall of the holes. 15 A corresponding bar position can be found in Figure 1D «

FIG. 1E shows the connection holes with the inner wall metallization 16. Various methods for metallizing the inner wall of the hole have already been made here described a,. - ■

Of course, other connection elements than those described above are also possible within the scope of the method according to the invention for producing electrical circuits. For example, the conductor wires can be split at the desired contact points by hammering in pins and thereby an intimate contact can be established. This process eliminates the need for drilling or punching holes. Such a circuit is shown in Figure 1G, the pins 23 split the conductor wires 14 at the contact points 14t. Preferably, the contact pins 23 are a low-melting metal or ¹ he coated alloy and produced by heat-treating an intimate contact between the lead wires and the terminal pins "can of course also before the insertion of the pins!" Are holes drilled and the pins immersed in this will. The pins can be virtually any shape; they can be cylindrical, hollow, or conical. If it is a question of hollow pins, they can be designed in the manner of a solder lug. Such an embodiment is shown in FIG. 1H. The formed solder lug 27 is coated with a low-melting metal such as 27 ', the coating melts by a heat treatment and an intimate contact with the conductor 14' is established.

10 9 8 /4.O / ₂ 11 9 0

Another embodiment is shown in Figure 1F, ϊη this Pail the fully laid out circuit is provided with holes, ζ.Β as in 29 #j each hole is surrounded by a soldering eye with contact pin 33 '. The raw clock pins 33 * protrude beyond the underside of the carrier plate. The conductor 14 * is firmly connected to the solder lug 33 '. In this pail - "■ • the connection is made in such a way that a special wire is used for the conductors, this is insulated with a Hylon or similar plastic coating", but is under this coating with a layer of easily melting ^iU metal or a Metal alloy provided. If the wire is now subjected to a heat treatment / such as, for example, by soldering or the like, the plastic coating melts and the low-melting metal underneath also becomes liquid and connects the solder lug and the wire «

Pigur 2 shows a circuit according to the invention, which contains a plurality of conductors of various lengths and shapes. For example, the "conductors 14a run and 14b are completely straight and extend beyond the rest of the circuit. Others, such as that in Figure 14c shown have a number of kink points and intersection points with other conductors. Other conductors, such as Hd / are comparatively very short.

i'igur 3 shows the circuit of - ^ igur 2 _t after having drilled into these holes were. Some of the holes are at the conductor ends, others, such as hole 15a in conductor 14b, divide the conductor into two or more conductor segments; There are also a few additional holes on the circuit board that have neither the wire ends nor any contact with the conductors *, these are intended for other electrical components.

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λΗ

2i8 wire thickness used for the conductors is between 8 and 80 μ · 3β1ΐΓ wire of 20 μ is often used, for example a polyimide is used as a coating. An insulated wire of 20 μ corresponds in its electrical properties to a printed copper conductor of 40 | i when using. "2 ounces of copper ¹ ^ and BO u when using" lunze of copper ". The holes in the S _c h _a ij; _nK g _S p] _ _a -fets are free when using 20 η conductor wire size, usually 120 μ with thinner wire, the clear width is correspondingly lower, around 50 p. »

As mentioned earlier, wired circuits can also be attached to the back of printed circuit boards; In these cases, the printed circuits are usually already provided with all connection elements. In Figure 4, the printed circuit mounted on the back o.ev in Figures 2 and 3 is shown. The conductor 28 is provided for grounding and power supply.

FIG. 5 shows a cross section through the circuits of FIGS. 3 and 4. The conductors 14 3 are embedded in the coating layer 12 in the manner described above. The B _a uteil ~ 30 is provided with pins 30a and 30b ^ which were inserted into the holes 15 and here make contact with the conductors 14 on the * metallized hole inner wall.

The "wirewritten circuit" of the present invention is conventional connected to the other components «As shown in figure 3A, connecting fingers 8 are provided for this purpose. FIG. 6, the rivets 102 are used for this.

Various methods have been developed for "wire writing". In a preferential way Embodiment of the invention is ultrasonic energy for attaching the wire in the adhesive layer used jöiese works at the same time as the guide head «

1098A0 / 1116 ⁴ "

This configuration is shown in FIG. 7 The wire emerges from the supply tube and is carried by ultrasound under the influence of an ultrasound Energy - "^ seen pressure feet through movement of the apparatus brought into the desired position, at the same time % virä softens the surface, with the space in between dom board and wire pen large enough to allow wire crossings. What happens is the following: the wire H is embedded in the adhesive layer up to half its diameter, on each one On the side of the wire, a furrow is formed, such as this is shown in FIG. 7A / This results in particularly good adhesive strength of the wire in the base. l> ie The speed of the process is on average 8cm / sec, a very good adhesive strength is achieved « But it is quite conceivable that even higher speeds of up to 30cm / sec and above can be achieved are · In the characteristic form of FIG. 7 shows the wire according to 8 different direction vectors designed.

Next to the ITltrasound pressure foot is the guide head provided with a mechanism that cuts the wire ends and again wire at the beginning of the new line donates · The direction of wire feed is given by the movement of the work table relative to the guide head The guide head is controlled automatically. While of the "writing process *" the guide head lays the wire on the surface of the 'i-Vägers and at the same time ensures that it is attached to it at every kink point he shapes and guides the wire according to the desired direction. At the end of each line he cuts the wire. The automatic control of the guide head causes the. great advantages of circuit manufacture by means of "Wireframe" just doesn't have an exact localization the Iieiterkurß is guaranteed and this exactly reproducible i at.iv -. beforehand it can already be im Exactly not mentioned in advance. and by numeric Data fpstgel ept vrorr'en.

1 098AO / 1190

The manufacturing process of the circuits according to the invention can be summarized as follows. The automatically controlled work table receives control impulses in X or Y. Each position affects either the beginning or the length of a ladder or a kink in the ladder where the ladder changes its direction. The table moves linearly between the individual positions. The guide head responds to control pulses that are transmitted by so-called M functions and that are accompanied by the X and Y pulses, which will be explained later

If d: is completed ia circuit, this ηηύ taken from the work table for three ^minutes: a Presne brought UNR * simultaneously "exposed to a suitable temperature This process is used for solidification of the embedded wires in the adhesive layer. Then. · This Klt-herschieht fully cured by etv / a is held for one hour at a temperature of about 160 ⁰ C *

The control impulses transmitted to the guide head can be, for example, as follows:

(1) Turn the wire feed system clockwise in 1-4 steps of 45 ° each

(2) As (1) but in the opposite direction of rotation

(3) Feed in new wire

(4) Lower the pressure foot

(5) Lift the presser foot and cut the wire.

The main features of the wire rubbing device are shown in FIGS. 8-14.

In Fipur 9, 10 is the carrier plate mounted on the work table 17. The work table can do that controlled engine 18 can be moved freely in two coordinates. The plate can therefore in all 4 directions moved and their movement can be controlled exactly according to the pre-drawn program that was created with the Program of the leadership head is coordinated.

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The insulated wire 20 goes through the wire guide 21 after exiting the wire guide, it goes under a U-shaped opening 22 of the guide head 24 ■. The guide head is just raised in the picture and lowers SiCh ₁ in order to bring the wire onto the plate surface. A heating coil 25 is coupled to the 'guide head and keeps it at the desired temperature (1) to heat the thermosetting resin of the' covering layert2.yorzuwärwen and C.2. ') And to connect this layer ^ to the point where it is softened / so that the wire can be embedded in this.

^ in cutting device 26 is arranged adjacent to the guide head, between the head and wire guide 21 The cutter is not working here, it will be on The end of each "line" or conductor is lowered to separate it from the supply wire. .

A special mechanism pushes ku Beging .. ^, _ a corresponding piece of wire in front of the new line · To this Mechanism also includes rollers 31 and 32.

• When the guide head starts to move, it is first lowered so that the legs 34 the Touch the carrier plate, then the conductor 14 is partially pressed into the resin coating compound. At this moment, in which the guide head the coating compound J2. touched, as shown in FIG. 9 at points 35 / he begins to heat the resin. The latter is thereby softened and small bumps are formed at the edges. Has the head reached its end position and the legs if the carrier plate 11 touches the edge beads 37 formed around the head. The completed embedding is shown in FIGS. 9A and 9B, the indentation furrows 38 are from the legs 34 generated.

Figure 10 shows in a simplified representation the functioning of the wire guide and embedding mechanism.

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The clock head 24 and the heater 25 are at the lower end of a hollow axle. 40 mounted, which is provided with a closure flap 41 and a pressure ring 42 at the upper end. This pressure ring serves as a cam follower for the squat 43, which is mounted on the axis of a rotating solenoid 44. The axle 40 is held in position by a spring 45. If the ° olenoi & current flowing through it, *;? O rotate the Solenoidachse 90 degrees and be / egt εο the axis 40 downwards and this exerts pressure on de spring 45. · If the "olenoid v / i ed he discharged is, returns he, and thus also the axis 40 / back to the starting position. The axis 40 is freely rotatable and the nook 43 acts on the cam follower, which is formed by the pressure ring 42, regardless of the axis position.

* ßin Teflon tube 46 extends from the Wire feed mechanism 30 through hollow shaft 40 and the central opening of the cap 41 and the pressure ring 42 So the wire can be fed regardless of the position of the guide mechanism «

The cutter 26 is mounted on the plate 50. This plate is in turn held by the rods 51 and 52, which bind them with the pressure vessel 53 and the pressure ring 54 at their upper ends. The pressure ring 54 serves as a cam follower for the Nooke 55 / the on the Axis of the solenoid 56 is attached. If the solenoid is energized, the nooke rotates 90 ° and thus forces the "Drue kr ing" and the rods 51 and 52 down against the Peder tension, and rely on it Way the cutter in operation.

The hollow cylinder 60 surrounds the axis 40. A gear 61 is mounted at the end of this cylinder. The carrier plate is on the other side of the cylinder for the feed mechanism 30. 63 and 64 are spacers,

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A fixed cylinder 66 surrounds axis 40 and cylinder 60 and rods 51 and 52. This cylinder carries the guide device, this is through.-the cylinder connected to the drive 61 60 "moved * The axis 40 actuates the guide head 24 and the rods 51 and 52 the cutter 26

Figures 11 and 12 show the front and side view of the device,

The guide head 24 is on the back vessel 71 mounted, ^ iη pair of guide pins 72 are within the axis 40 and form within the pressure vessel 71 an oval opening through which allows the head to move relative to the axis. The guide cylinder 73 is attached to the lower end

namely by means of ej near .. .adjusting screw * 74. ^ ine

Spring 75 is located between the screws and the pressure vessel 71, this presses against the reinforcement rods 72 This causes the contact pressure of the guide head against the circuit support plate.Idu: ccjh the spring 75 is controlled and the adjustment screw 74

The axis 40 is movable upwards and downwards in the cylinder 60. A pair of bushings 80 are located in the cylinder 60 and surround the axis 40 · ^ ie the bushings are made by a spacer 8Π. held in position. At the lower end of the cylinder 60 is the feed mechanism 62 it is fixed by the screws and holds the key 82 at the lower end of the cylinder 60. ^T he Drive shaft 83 is hollow and holds the gear 61 at the upper end of the cylinder and by means of the screws 85. ^ he gear shaft 83 protrudes into the upper end of the cylinder ninepin. Ei _n guide pin 86 is located at the lower end of the cylinder 60 and fits into the oval opening in the Aohsenwandung 40 and "causes the raising and lowering of the axle 40 relative to the cylinder 60th

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'In this way WITD _1, when the solenoid is atroradurohflosßen 44 through which Nooke 43, the axis 40 moves downward ", guided by the bushes 80 and the guide pin 86. When the führungslcopf the surface of the carrier plate contacts;!, The spring 75 is compressed and so controls the pressure exerted by the dughäa / "on the guide head.

The upwardly extending cylindrical part of the gear shaft 83 holds the pressure vessel 53 and the pressure vessel 54 in their position. ^The pressure vessel and the! Pressure ring -y ;:.; Sn held in contact with the nooke 55 by springs. The pins 51 * and 52 / shown inside the cylinder 66 are normally hidden in recesses dea. Cylinder 60 in * 'igur 10 · The roller layers 90 cause the cylinder 60 to rotate in the cylinder 66 .. The roller bearings are held by the plates 91 and 92, which in turn are held by the screws.

The rotational movement of the cylinder 60 is controlled by the motor 100, the gearbox 101 is mounted on the IV motor shaft 102. The teeth of the gearbox 101 mesh with those of the gearbox 61 "which_.ara cylinder 60 is attached. A pair of brush holders 104 and 105 rotate with the gearbox 10-1 and hold a pair of brushes in contact with a fixed shift plate 103" and thus serve as position sensors for the rotating cylinder 60 · Four radial rods (not visible), - which are arranged at an angle of 90 ° each, are in one plane with the switching plate Positions of the 4 rods ^ a current flows between the brushes ^ which gives a signal for the regulation of the cylinder position.

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Two pairs of brush holders 107 and 108 are held in the brush holder plate 106 and fastened in the lower cable of the cylinder 60 the non-movable plate 92 attached. The slip rings are supplied with power and transfer the energy to the brushes, which in turn power the heating element 25, because it moves with the guide head. The brush holders 108 similarly bring one pan of brushes into contact with another set of slip rings on the plate 109 # which supply the feed mechanism 30 with power.

The entire guide device is vertically movable and can be swiveled out in order to remove a completed circuit or to insert a new carrier plate. The upper and lower bracket plates,

110 and 111y are perpendicular to the base plate 112. Each of the two plates 110 and 111 consists of two parts which clasp the stationary cylinder 66 when they are joined together. The motor 100 is mounted on the mounting plate 110. A pair of linear bearings 1-13 and 114 are mounted on the plate 110 / and another linear layer Mi5 i ^{0t is mounted} on the plate 111.

A base plate for the device has an upper and a lower mounting plate 12-1 and 122 * ; 3a through the lower plate ..12 ^ becomes .the, vertical axis 123 held, which cooperates with the camp 114. Another vertical axis 124 is between the brackets 113 and 115 attached. So can the whole thing on the base plate 12 assembled device and the brackets 110 and

111 can be moved up and down in relation to its base plate 120 as the linear bearings slide up and down on axles 123 and 124. An adjustable stopper, which is attached to the flor axis 1 - 4, limits the discharge movement ·% n air cylinder 1P7 is used

exercises device, uses »
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The expressions and definitions selected in the present description are used solely for the purpose of clarification: the invention and are not intended to restrict the possibilities offered by them in any way. It goes without saying that there are innumerable possibilities for variation within the framework of the basic inventive concept.

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1 098A0 / 1 190

Claims (1)

.PATENT CLAIMS ~ Procedure for creating conductor assignments, characterized in that, by means of a guide device, the preformed one serving as a conductor Wire to the insulating material plate, the ala carrier serves, brought and at the same time fixed or embedded on this, and that the conductor is any "arbitrary Form on v / iron can. 2 «conductor p .ugs arrangement according to claim 1 thereby characterized in that serving as a carrier plate. Isolieratoffplatte with a variety of in their The course of predetermined conductors is provided, and that each of these conductors runs between two specific points, and that the shape and length of the Conductors are determined by these points, and that every conductor regardless of its course immediately is fixed on the carrier plate and the position of the individual conductors relative to one another is precisely defined. 3. Wire-written conductor run arrangement according to claim 1, characterized in that the carrier plate is provided with a coating compound which, under certain conditions, has adhesive properties. 4. Wirewritten conductor arrangement according to Claim 1, characterized in that the conductor points lying in one plane have intersection points and are isolated from each other. - 23 - 109840/1190 5. Wire-written conductor run arrangement according to claim 4, characterized in that the immediate. Fixation of the wire on the carrier plate by an adhesive layer with which the carrier plate is applied before application the circuit is provided. 6. adhesive layer according to claim 5, characterized in that that this layer consists of a thermosetting resin. 7. Le iterzuganlage according to claim 1 characterized ge · indicates that the conductors are embedded in the adhesive layer on the carrier plate. 8th. . _{ Wire-written conductor run arrangement according to claims 4 and 5, characterized in that the embedded conductors form a plane with the adhesive layer. 9. Wirewritten circuit arrangement thereby marked that the crossing ladder-jän the Crossing points are isolated from each other. 10. Wirewritten circuit layout according to One of the preceding claims, characterized in that the conductors are insulated over their entire length are provided. 11. Wire-written conductor run arrangement, characterized in that at least some of the conductor run end points .Built by drilled or punched holes. 12. Wiring arrangement. according to claim 10 thereby characterized in that the hole walls of the holes are metallized. - 24 109840/1190 13. conductor run arrangement according to claim 11 or characterized in that the conductor in the metallization the inner wall of the hole ends and there is thus contact between the inner wall of the hole and the conductor. 14. Wire-written conductor run arrangement according to claim 1, characterized in that at least some of the endpoints have contact pins. 15.Wire-driven circuit arrangement nadir \ ♦ Claim 1 characterized in that at least some endpoints are provided with metal tubes. 16. conductor run arrangement according to claim H thereby characterized in that.ein conductor is firmly connected at least at one end to the contact pin. 17. conductor run arrangement according to claim 15 characterized characterized in that a conductor is fixedly connected at least at one end to the metal tube. 18. Method for producing conductor track arrangements according to claim 1, characterized in that a; desired conductor pattern produced thereby that of a wire supply roll by means of a feed device and the controlled movement of the work table holding the carrier plate relative to the wire feed device, the wire in certain desired way is placed on the carrier plate and fixed or embedded on this. ~ 25 - 109840/1190 19 · A method for producing conductor track arrangements according to claim 18, characterized in that the wire is laid out line by line between the start and end point ^{3e of} the conductor and is automatically cut off at the end point, and this process is repeated until the complete circuit diagram is completed. 20. Process for the production of conductor tracks nadir- ^ h Claim 1 characterized in that the wire is embedded simultaneously with the application is made possible by the fact that the wire guide device is provided with a heating element> which, at the same time as the wire is laid out, the adhesive layer so far heated so that the wire can be pressed into it. 21. Procedure for the production of ladder tracks Claim 1 characterized in that the wire guide head moves relative to the work table holding the carrier plate, thereby producing the desired conductor pattern will. 22. Process for producing conductor track arrangements ^ - »oh- ~ claim Λ. Characterized in that the wire coming out of the wire guide head is heated by a heating element located in it to such an extent that when it touches the adhesive, it heats the surface so far that it can be pressed into it. -26.- 109840/1190 Blank page