FR2084258A5 - - Google Patents

Info

Publication number
FR2084258A5
FR2084258A5 FR7107725A FR7107725A FR2084258A5 FR 2084258 A5 FR2084258 A5 FR 2084258A5 FR 7107725 A FR7107725 A FR 7107725A FR 7107725 A FR7107725 A FR 7107725A FR 2084258 A5 FR2084258 A5 FR 2084258A5
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7107725A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Application granted granted Critical
Publication of FR2084258A5 publication Critical patent/FR2084258A5/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
FR7107725A 1970-03-05 1971-03-05 Expired FR2084258A5 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1674270A 1970-03-05 1970-03-05

Publications (1)

Publication Number Publication Date
FR2084258A5 true FR2084258A5 (fr) 1971-12-17

Family

ID=21778714

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7107725A Expired FR2084258A5 (fr) 1970-03-05 1971-03-05

Country Status (7)

Country Link
JP (2) JPS5550399B1 (fr)
AT (1) AT312731B (fr)
CA (1) CA932478A (fr)
DE (1) DE2111396B2 (fr)
FR (1) FR2084258A5 (fr)
GB (1) GB1352557A (fr)
NL (1) NL173907C (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2321202A1 (fr) * 1975-08-13 1977-03-11 Kollmorgen Corp Element d'interconnexion electrique comportant un reseau multifilaire de fils isoles dont la connexion mecanique se trouve sur ledit element
FR2424646A1 (fr) * 1978-04-28 1979-11-23 Commissariat Energie Atomique Procede de raccordement de bornes de connexion d'ensembles electriques
FR2458978A2 (fr) * 1979-06-07 1981-01-02 Commissariat Energie Atomique Procede et dispositif d'interconnexions de composants electronique
FR2503931A1 (fr) * 1981-04-14 1982-10-15 Kollmorgen Tech Corp Procede de fabrication de substrats pour composants electroniques et de circuits electroniques, et substrats formes
FR2507853A1 (fr) * 1981-06-12 1982-12-17 Brefdent Dominique Procede d'interconnexion de composants par insertion a force d'un fil metallique
EP0214628A2 (fr) * 1985-09-13 1987-03-18 Kollmorgen Corporation Procédé de fabrication de substrats pour interconnecter des composants électroniques et produits de ce procédé
EP0405482A1 (fr) * 1989-06-30 1991-01-02 Advanced Interconnection Technology, Inc. Panneaux modifiés comportant un circuit de fils posés et leur méthode de fabrication

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2185915B1 (fr) * 1972-05-25 1975-08-29 Commissariat Energie Atomique
FR2304247A1 (fr) * 1975-03-12 1976-10-08 Commissariat Energie Atomique Procede et dispositif d'interconnexion de composants electroniques
ZA781637B (en) * 1977-06-20 1979-02-28 Kollmorgen Tech Corp Wire scribed circuit board and method for the manufacture thereof
ZA775455B (en) * 1977-08-09 1978-07-26 Kollmorgen Tech Corp Improved methods and apparatus for making scribed circuit boards
DE3035090C2 (de) * 1979-09-28 1995-01-26 Cii Honeywell Bull Vorrichtung zur Verdrahtung von Substratoberflächen
US4450623A (en) * 1981-12-18 1984-05-29 Kollmorgen Technologies Corporation Process for the manufacture of circuit boards
EP0168602A1 (fr) * 1984-06-25 1986-01-22 Kollmorgen Technologies Corporation Procédé de fabrication de plaques de circuit d'interconnexion
US4711026A (en) * 1985-07-19 1987-12-08 Kollmorgen Technologies Corporation Method of making wires scribed circuit boards
US4693778A (en) * 1985-07-19 1987-09-15 Kollmorgen Technologies Corporation Apparatus for making scribed circuit boards and circuit board modifications
DE3539040A1 (de) * 1985-11-04 1987-05-07 Telefonbau & Normalzeit Gmbh Leiterbahnanordnung und schaltungsanordnung fuer mit integrierten schaltkreisen bestueckte leiterplatten
US6137054A (en) * 1994-01-25 2000-10-24 Yazaki Corporation Wire-circuit sheet and electric junction box thereof
DE19705934C2 (de) * 1997-02-15 2001-05-17 Cubit Electronics Gmbh Verfahren und Vorrichtung zum Einbringen von drahtförmigen Leiterdrähten in ein Substrat
JP4189707B2 (ja) * 1998-12-03 2008-12-03 日立化成工業株式会社 布線装置とそれを用いた配線板の製造方法
EP1807239A2 (fr) 2004-11-02 2007-07-18 Imasys AG Dispositif de pose, dispositif d'etablissement de contact, systeme d'avance, unite de pose et d'etablissement de contact, installation de production, procede de production et ensemble transpondeur
US7971339B2 (en) 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8286332B2 (en) 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
IL184260A0 (en) 2007-06-27 2008-03-20 On Track Innovations Ltd Mobile telecommunications device having sim/antenna coil interface
EP2040201B1 (fr) 2007-09-18 2010-11-17 HID Global Ireland Teoranta Méthode de soudage d'un fil conducteur posé sur un substrat
US8028923B2 (en) 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
GB2502600B8 (en) 2012-05-31 2015-01-07 Improvements in touch sensitive displays
GB2502602B (en) * 2012-05-31 2015-06-03 Zytronic Displays Ltd Multi-touch sensing panel production method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2958018A (en) * 1955-11-07 1960-10-25 Donald O Kocmich Capacitance operated electronic control
US3234629A (en) * 1962-06-14 1966-02-15 Defiance Printed Circuit Corp Method for producing printed circuits
US3377698A (en) * 1964-09-21 1968-04-16 Gen Motors Corp Method of making an electrical circuit
FR2001647A1 (fr) * 1968-02-07 1969-09-26 Photocircuits Corp

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2958018A (en) * 1955-11-07 1960-10-25 Donald O Kocmich Capacitance operated electronic control
US3234629A (en) * 1962-06-14 1966-02-15 Defiance Printed Circuit Corp Method for producing printed circuits
US3377698A (en) * 1964-09-21 1968-04-16 Gen Motors Corp Method of making an electrical circuit
FR2001647A1 (fr) * 1968-02-07 1969-09-26 Photocircuits Corp

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2321202A1 (fr) * 1975-08-13 1977-03-11 Kollmorgen Corp Element d'interconnexion electrique comportant un reseau multifilaire de fils isoles dont la connexion mecanique se trouve sur ledit element
FR2424646A1 (fr) * 1978-04-28 1979-11-23 Commissariat Energie Atomique Procede de raccordement de bornes de connexion d'ensembles electriques
EP0006039A1 (fr) * 1978-04-28 1979-12-12 COMMISSARIAT A L'ENERGIE ATOMIQUE Etablissement de Caractère Scientifique Technique et Industriel Procédé de raccordement de bornes de connexion d'ensembles électriques
FR2458978A2 (fr) * 1979-06-07 1981-01-02 Commissariat Energie Atomique Procede et dispositif d'interconnexions de composants electronique
EP0021894A1 (fr) * 1979-06-07 1981-01-07 COMMISSARIAT A L'ENERGIE ATOMIQUE Etablissement de Caractère Scientifique Technique et Industriel Procédé et dispositif d'interconnexions de composants électroniques
FR2503931A1 (fr) * 1981-04-14 1982-10-15 Kollmorgen Tech Corp Procede de fabrication de substrats pour composants electroniques et de circuits electroniques, et substrats formes
FR2507853A1 (fr) * 1981-06-12 1982-12-17 Brefdent Dominique Procede d'interconnexion de composants par insertion a force d'un fil metallique
EP0214628A2 (fr) * 1985-09-13 1987-03-18 Kollmorgen Corporation Procédé de fabrication de substrats pour interconnecter des composants électroniques et produits de ce procédé
EP0214628A3 (en) * 1985-09-13 1987-05-13 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components and articles made by said process
EP0405482A1 (fr) * 1989-06-30 1991-01-02 Advanced Interconnection Technology, Inc. Panneaux modifiés comportant un circuit de fils posés et leur méthode de fabrication

Also Published As

Publication number Publication date
DE2111396B2 (de) 1976-04-29
GB1352557A (en) 1974-05-08
CA932478A (en) 1973-08-21
NL7103009A (fr) 1971-09-07
NL173907B (nl) 1983-10-17
AT312731B (de) 1974-01-10
JPS5550399B1 (fr) 1980-12-17
JPS5710592B1 (fr) 1982-02-26
NL173907C (nl) 1984-03-16
DE2111396A1 (de) 1971-09-30

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